Cavity bar, pot, plunger for semiconductor packaging mould used for auto electronics,IGBT,triode,diode

https://dgdx-elec.com/wp-content/uploads/2023/01/s-2.mp4 Specifications A(-0.001) B(¡À0. 001) MGP mold barrel injection head 14/15 25.4 MGP mold barrel injection head 17/19 25.4 Product No.:DXMJ-22001 Product Name: Cavity plunger Brand:?China DOXO Tolerance range:?+-0.00...

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Specifications	A(-0.001)	B(¡À0. 001)
MGP mold barrel injection head	14/15	25.4
MGP mold barrel injection head	17/19	25.4

Product No.:DXMJ-22001

Product Name: Cavity plunger
Brand:?China DOXO
Tolerance range:?+-0.002
Processing customization:?processing according to drawings
Function:?Semiconductor packaging mold
Material:?M2 Tungsten Carbide
Scope of application:?automotive electronics IGBT triode diode
Product advantages:?high hardness, high grinding, long life, improve product yield, 200,000 mold times

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Cavity bar, pot, plunger for semiconductor packaging mould used for auto electronics,IGBT,triode,diode

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