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Precision parts tungsten carbide press claw for semiconductor aluminium wire bonding equipment

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Precision parts tungsten carbide press claw for semiconductor aluminium wire bonding equipment

Precision parts tungsten carbide press claw for semiconductor aluminium wire bonding equipment

https://dgdx-elec.com/wp-content/uploads/2022/07/Soldering-equipment-solder-head-ejector-pin-suct...

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Mold die head for die bonder ASM & KS used for automotive electronics and IGBT

Mold die head for die bonder ASM & KS used for automotive electronics and IGBT

https://dgdx-elec.com/wp-content/uploads/2022/07/Die-pressing-equipment-solder-head.mp4 Speci...

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360 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (F Series)

360 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (F Series)

https://dgdx-elec.com/wp-content/uploads/2023/01/s-3.mp4 Made from special modification macromole...

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Stainless steel thimble stick for die bonder ASM and KS

Stainless steel thimble stick for die bonder ASM and KS

Product No.: DXGJ-22005 Product Name: Stainless steel thimble Brand: China DOXO Tolerance range: ...

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White steel SKD 11 press claw regular semiconductor once bonding

White steel SKD 11 press claw regular semiconductor once bonding

Product Name: Press Claw Brand: China DOXO Tolerance range: +-0.002 Applicable equipment: Semicon...

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