MGP mold plunger bar and pot set for semiconductor packaging

MGP mold plunger bar and pot set for semiconductor packaging

Product No.:DXMJ-22001 Product Name: Cavity plunger Brand: China DOXO Tolerance range: +-0.002 Processing customization: processing according to drawings Function: Semiconductor packaging mold Material: M2 Tungsten Carbide Scope of application: automotive electronics IGBT triode diode Product ...

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Product No.:DXMJ-22001

Product Name: Cavity plunger

Brand: China DOXO

Tolerance range: +-0.002

Processing customization: processing according to drawings

Function: Semiconductor packaging mold

Material: M2 Tungsten Carbide

Scope of application: automotive electronics IGBT triode diode

Product advantages: high hardness, high grinding, long life, improve product yield, 200,000 mold times

Specifications	A(-0.001)	B(±0. 001)
MGP mold barrel injection head	14/15	25.4
MGP mold barrel injection head	17/19	25.4

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MGP mold plunger bar and pot set for semiconductor packaging

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