Umhlahlandlela we-ENGENTUR WOURE BOMBONOCONTECTION: Ukwenza kahle ubuchwepheshe besimanje boond bonding

Njengonjiniyela kanye nomsunguli wobuchwepheshe bama-elekthronikhi be-dongxin, izinsuku zami zigcwele ama-dives ajulile wezobuchwepheshe. Ngivame ukukhuluma nonjiniyela bezinqubo njengoMarcus eJalimane, abantu babo abakhathalela okuyisisekelo akuzona izindleko zengxenye eyodwa, kodwa umthelela wedola wezigidigidi eziningi zokumisa komugqa okhiqizwayo okubangelwa yi-microscopic ekhiqizwayo ukuxhuma. Bayaqonda ukuthi ukwethenjwa kwenkimbinkimbi i-semiconductor idivaysi noma imodyuli ephezulu yezimoto ivame ukwehla ebuqothweni be-all, inwele-mncane uwaya. Lo mhlahlandlela ungowabo. Akuyona incwajana yokuthengisa; Kungukuhlola okujulile kwe isibopho sentambo kanye nobucayi Ubuchwepheshe be-Wire Bonding Lokho kwakha umgogodla wokukhiqiza ngogesi wanamuhla. Sizovula isayensi ngemuva kwe ubudlelwano, qhathanisa amasu ahlukile, bese uxoxa ngezinto eziholela ekuqineni nasekuphindekekelweni inqubo yebhondi.

Iyiphi inqubo yokubopha isigqila?

Emgogodleni wayo, Ukubopha i-Wire inqubo yokudala i Ukuxhumeka ngogesi phakathi kwamaphoyinti amabili, imvamisa a i-semiconductor I-Chip kanye nokupakishwa kwayo (I-Bond Pad), noma phakathi kwe-chip ne-a I-PCB. Kuyinto esetshenziswa kabanzi futhi ebiza kakhulu xaxa Ubuchwepheshe, obubhekele ama-trillions okuxhumeka okwenziwe minyaka yonke. Ngokungafani ne-soldering, encibilikisa impahla ye-filler, ukubopha ngentambo kubandakanya Isimo esiqinile Inqubo ye-Welding. Lokhu kusho ubudlelwano yakheka ngaphandle kokuncibilika uwaya noma I-Bond Pad.

Umgomo ukudala okuqinile, okuthembekile isibopho se-metallurgical-I-real beld ezingeni le-athomu-elihlinzeka ngesitezi Ugesi noMenzi ukuxhumana. Lokhu kutholakala ngokusebenzisa inhlanganisela yamandla, ukushisa, kanye / noma amandla e-ultrasonic ukucindezela inhlawulo enkulu uwaya ngokumelene ne-substrate. Umphumela isibopho sentambo kwakha umjikelezo kagesi ophelele, okuvumela Idivaysi ye-semiconductor ukuxhuma emhlabeni wangaphandle. Ikhwalithi yalokhu okukodwa ubudlelwano kubaluleke kakhulu emsebenzini wedivayisi nokuphila isikhathi eside.

Yiziphi izinhlobo eziphambili zamasu wokubopha ngocingo?

Ngenkathi inhloso yokwakha a isibopho sentambo kuhlale kufana, kukhona okuyisisekelo okubili Izindlela Zokubopha Kusetshenziswe embonini: Ukubopha kwebhola kanye nokubopha kwe-wedge. Ukukhetha phakathi kwabo kuncike ku- impahla ye-wire, Isicelo, izindleko, kanye nezidingo ezithile zejometri. Ngonjiniyela, ukuqonda ama-nuances ngamunye I-Bonding Technique kubalulekile ukuze inqubo yokwenza kahle.

Lezi izinhlobo ezimbili zocingo izinqubo zokubopha zibusa Ukupakishwa kwe-semiconductor imboni, futhi ngalinye linesethi ehlukile yenzuzo eyenza kube ngukuthandwa Indlela yokubopha i-Wire ngezicelo ezihlukile.

Inqubo ye-thermosonic ball bond isebenza kanjani?

Le khasi I-Ball Bonding Techtique kuvame kakhulu Inqubo Yokubopha Nge-Wire, Iwugugu ngejubane layo nokuvumelana nezimo. Kucishe kusetshenziswe kuphela ucingo lwegolide noma ucingo lwethusi. Inqubo ibizwa isibopho se-thermosonic Ngoba ihlanganisa amandla ashisayo (ukushisa), amandla, futhi amandla e-ultrasonic.

Isinyathelo ngesinyathelo inqubo yebhondi kungumbuzo wobunjiniyela obunembile:

1. Ukwakheka kwebhola: Inqubo iqala nge uwaya Yondli ngethuluzi le-ceramic eliyize elibizwa ngokuthi yi-capillary. "I-flame ye-elekthronikhi" (efo) iWand ishisa i-high-voltage spark endaweni ye uwaya, ukuncibilika futhi okuvumela ukungezwani komhlaba ukwakha indawo ephelele, noma ibhola.
2. Isibopho sokuqala: I-capillary ihamba phansi iye ekushiseni I-Bond Pad (imvamisa 125-150 ° C). Kusebenza amandla aqondile, kucindezela ibhola ngokumelene nephedi ngenkathi kusebenza ngasikhathi sinye amandla e-ultrasonic. Le nhlanganisela yokushisa, amandla, nokudlidliza kudala isibopho sokuqala, ibhola eliqinile ubudlelwano.
3. Ukwakheka kweLoop: Le khasi i-wire bonder Bese uhambisa i-capillary endaweni ye Isibopho sesibili (e.g., umunwe wegama eliholayo), ukudala okubaliwe I-Wire Loop kwinqubo. Ukwakheka kwalokhu uwaya I-Loop ibalulekile ekusebenzeni nasekuvimbeleni izikhindi.
4. Isibopho sesibili: Endaweni yesibili, ithuluzi licindezela i- uwaya ngokumelene ebusweni futhi kusebenza okunye kokuqhuma kwe amandla e-ultrasonic ukwakha i- "stitch" noma bond bond.
5. I-wire tail-off: Ekugcineni, umshini ubopha uwaya futhi uphakamisa i-capillary, ephula uwaya Esithendeni sikaJehova Isibopho sesibili futhi ulungiselela i-efo ukwakha ibhola elisha elilandelayo isibopho sentambo.

Yini eyenza inqubo ye-ultrasonic wedge bond ihluke?

Bond bonding, noma ngaphezulu ngesibopho se-wedge-wedge, kubalulekile ngokwehlukile Inqubo Yokubopha Nge-Wire. Le ndlela yindlela yokuhamba ye I-Aluminium Wire Bonding futhi kuvame ukwenziwa at Ukushisa kwegumbi, ukuncika kuphela amandla e-ultrasonic futhi aphoqe ukwakheka kwebhondi. Futhi kuyindlela eyinhloko esetshenziselwa Ukubopha I-Ribbon.

Kule nqubo, uwaya Udliswa ngaphansi kwefulethi eliphansi Ithuluzi Lokubopha wabiza i-wedge. Ithuluzi lehla, licindezela i- uwaya ngokumelene nolokuqala I-Bond Pad, futhi kusebenza amandla e-ultrasonic Ukwakha okuqala bond bond. Ithuluzi livuka futhi lihamba liye endaweni yesibili, lakha iphrofayili ephansi, emfushane I-Wire Loop kunokujwayelekile nge isibopho sebhola le-wire. Esesibili I-Bond Pad, inqubo iyaphindwa ukuze kwakhiwe Isibopho sesibili. Ngoba kokuqala nobabili Isibopho sesibili babunjiwe, le ndlela inikezela ukusebenza okuphezulu kuzinhlelo zokusebenza zemvamisa ephezulu futhi ivumela i-pitch enhle kakhulu (ihlukaniswe kakhulu) okokubopha. -Sindayo I-Aluminium Wire Bonding Amadivayisi kagesi abuye ancike kuphela ku bond bond inqubo yokwakha i-robust ubudlelwano.

Yiziphi izinto zocingo ezingcono kakhulu isicelo sami?

Le khasi Ukukhetha kungenye yezinqumo ezibucayi kakhulu ku- isibopho sentambo inqubo. Okuthathu okuyisisekelo izinto ezisetshenzisiwe yigolide, ithusi, ne-aluminium. Sisinye Izinto ezibophayo inesethi ehlukile yezakhiwo ezenza ukuthi ilungeke ngehlukile Izicelo zokubopha.

• Igolide Wire (AU): Indinganiso yangempela ye isibopho socingo sisebenzisa igolide. Kumelana kakhulu ne-oxidation, okwenza kube lula uku ubudlelwano futhi ethembeke kakhulu. Ukubopha kwegolide iqondile. Ukuthamba kwalo nakho kuvimbela ukulimala kozwela i-semiconductor substrate. Ukubuyiselwa imali okuyinhloko kwe ucingo lwegolide izindleko zayo eziphakeme. Isibopho se-thermosonic kuyindinganiso ye ibhodlela legolide.
• I-Copper Wire (CU): Ucingo lwethusi usephenduke enye indlela ethandwayo yegolide ngenxa yezindleko zayo eziphansi kakhulu futhi ziphakeme Ugesi no-Thermal ukubangelanisa. Kodwa-ke, i-Copper oxidize kalula, okwenza inqubo yebhondi inselelo enkulu futhi idinga umkhathi we-inert ku i-wire bonder. Ubulukhuni balo budinga ukuqina amapharamitha ahlanganisa ukugwema ukulimala kwe-chip.
• I-Aluminium Wire (Al): I-Aluminium Wire kuthambile kakhulu impahla ye-wire futhi ilungele isibopho se-ultrasonic. Kuhle kakhulu ngokwakha isitebhisi ubudlelwano emazingeni okushisa ekamelo. -Sindayo I-Aluminium Bonding Wire Ingabe indinganiso yezimboni ye-Power Electronics kanye nezicelo zezimoto ngenxa yokwethenjwa kwayo kanye nekhono ukwakha okuqinile, okuhlala isikhathi eside ubudlelwano. Sibona amaklayenti amaningi ashintsha I-wire ephezulu yokuhlanza i-aluminium bonding ngokusebenza kwayo okungaguquki.

I-Wire Diameters ne-Ribbon Bonding Qhathanisa kanjani?

Uhlobo lomzimba lwe ukuxhuma-Kwenzi uwaya noma iribhoni elisicaba - futhi lidlala indima enkulu futhi. Ukukhetha kuncike kwizidingo zikagesi zohlelo lokusebenza.

Ama-wire diameters ingahlukaniswa kabanzi ibe ngamaqembu amabili. Ucingo omncane ukubopha ngokuvamile kusetshenziswa uwaya ngamadayimitha asukela ku-15 kuye ku-75 microns (μm). Lesi yindinganiso yesiginali ukuxhuma Kwizinga i-semiconductor Amaphakheji, axhumanisa i-Chip's I / O ku-Loveframe. -Sindayo uwaya ukubopha imali ama-wire diameters kusuka ku-100 kuye ku-500 μm. Lokhu kuqine uwaya isetshenziswa kumadivayisi wamandla kanye namamojula wezimoto ukuphatha amasondo aphezulu. -Bhekeneyo Izikweletu ze-Aluminium Wire ziyadingeka kule nqubo.

Ukubopha I-Ribbon ngenye indlela esindayo uwaya ukubopha. Esikhundleni somjikelezo uwaya, isebenzisa iribhoni elisicaba, elingunxande elenziwe nge-aluminium noma igolide. Ama-Ribbons anesilinganiso esiphakeme sendawo-yevolumu, ezuzisa izinhlelo zokusebenza ezivame kakhulu (ukunciphisa umphumela wesikhumba) kanye nezinhlelo zokusebenza zamandla lapho kudingwa khona ukushisa okungcono kanye nokuqanjwa okuphansi okudingekayo. Le khasi inqubo yebhondi ngembambo lifana ne-wedge ubudlelwano.

Yiziphi izinto ezibalulekile ezithonya amandla e-bond kanye nokwethenjwa?

Ngonjiniyela owengamela umugqa wokukhiqiza, ukufeza okuphezulu Amandla eBond futhi kuyavumelana isivuno esibophayo umgomo wokugcina. Impumelelo ka-a isibopho sentambo akukhona ngengozi; Kungumphumela wokulawula ngokucophelela iqoqo elibucayi amapharamitha ahlanganisa kanye nokuhlukahluka.

1. Amapharamitha wokubopha: Amapharamitha athi "amathathu" aphoqayo aphoqelekile (Ithuluzi licindezela kangakanani), Amandla e-ultrasonic (inani kanye nesikhathi sokukhohla), kanye nokushisa (ngesibopho se-thermosonic). Lokhu kumele kushayelwe ngokuphelele kukho okuthile uwaya na- I-Bond Pad inhlanganisela.
2. Ikhwalithi ye-Bond Pad: Ingaphezulu le I-Bond Pad kumele ihlanzeke, mahhala oxides kanye nokungcola, futhi ibe ne-metallurgy efanele kanye nobukhulu. Kulungiselelwe kabi I-Bond Pad kuyimbangela ehamba phambili ye ubudlelwano ukwehluleka.
3. Isimo se-Bonding Tool: I-capillary noma i-wedge ukuphela kwento ethinta isibopho sentambo. Lawa mathuluzi okudla okunembile okugqoke isikhathi ngokuhamba kwesikhathi. Ithuluzi eligqokile noma eliqhekekile lizokhiqiza izibopho ezibuthakathaka noma ezingahambelani. Yingakho sisebenza ngokukhiqiza Amathuluzi Wokubopha Okwenziwe Ngokwezifiso enziwe ngezinto ezinzima ze-Ultra-Hard ukuqinisekisa impilo ende futhi ethembeke kakhudlwana ubudlelwano.
4. Ikhwalithi ye-Wire: Isibopho uwaya ngokwayo kumele kube ngekhwalithi ephezulu kakhulu, enobubanzi obungaguquki, ubumsulwa kanye nezakhiwo zemishini. Noma yikuphi ukuhlukahluka ku uwaya kungaphazamisa konke inqubo yebhondi.

Iyiphi indima i-boonder ye-wire yanamuhla edlala ngayo kwinqubo?

Okwanamuhla i-wire bonder ucezu oluyinkimbinkimbi kakhulu lwemishini yamarobhothi eguqukile isibopho socingo kusuka kubuciko bencwajana kusayensi eqondile, ezenzakalelayo. Isimo-sobuciko i-wire bonder unesibopho sokwenza lokhu inqubo yebhondi ngesivinini esimangalisayo nokuphindaphinda.

Le mishini ihlanganisa ubuchwepheshe obuningi obukhulu. Izinhlelo zokubona izinqumo ze-High-Resolution zibona ngokuzenzakalelayo I-Bond Pad Izindawo futhi zinikeze impendulo ohlelweni lokulawula ukunyakaza. Isoftware ethuthukisiwe ivumela onjiniyela ukuthi bahlele inkimbinkimbi futhi inembile I-Wire Loop bobunjwa ukugwema izikhindi kanye nokwandisa ubuqotho besiginali. Okubaluleke kakhulu, kwanamuhla Izikweletu ze-Wire Nikeza ukuqapha kwenqubo yesikhathi sangempela nokugawulwa kwedatha. Bangabona iphutha ubudlelwano Njengoba kwenzeka futhi umise inqubo, ukuvikela amayunithi angenaphutha ukuthi ahlehle phansi. Leli zinga lokushintshana nokulawula libalulekile ekukhiqizweni kwevolumu ephezulu ye-elekthronikhi yanamuhla futhi ukuphela kwendlela yokufeza izingxenye ezidingekayo zekhwalithi yekhwalithi yekhwalithi ephezulu.

Kuphi amanye amasu okubopha izimbotshana?

Ngenkathi isibopho sentambo kuhlotshaniswa kakhulu Ama-semiconductor chips, uhlelo lwayo lufinyelela kude kakhulu nge-IC PacAGRAIST. Ukuguquguquka nokuthembeka kwe Ubuchwepheshe be-Wire Bonding bazenze babaluleke kakhulu kwezinye izindawo zokukhiqiza nge-elekthronikhi.

• I-Power Electronics: Ama-Igbts, ama-Mosfets, namanye amadivaysi anamandla ancike esindayo I-Aluminium Wire na- Ukubopha I-Ribbon ukuphatha amasondo aphezulu kanye nokushibilika ngempumelelo.
• Izithuthi ze-elekthronikhi: Isibopho socingo kuzimoto Igcwele, isetshenziswa ezinzwa, amayunithi okulawula (ama-ecus), nezinhlelo zokukhanyisa lapho ukuthembeka khona lapho ukuthembeka khona ngaphansi kokushisa okunzima nezimo zokudlidliza kungaxoxiswanga.
• I-PCB Ekhiqizakayo: Isibopho socingo isetshenziselwa ukuxhuma i-ture ifa ngqo ku I-PCB .
• Amadivayisi we-RF ne-Microwave: Ukulawula okuhle uwaya IJiyomethri iyakha ibhodlela legolideing futhi Ukubopha I-Ribbon Ilungele izinhlelo zokusebenza ezivame kakhulu lapho ukufana kwe-Imperance kubalulekile.
• Amamojula we-LED: Isibopho socingo Ingabe indlela ejwayelekile yokuxhuma i-LED encane iyafa ku-substrate yephakheji, etholakala kukho konke kusuka kwizikrini zefoni kuya ekukhanyiseni kwe-Stadium.

Singaqinisekisa kanjani ukuthi inqubomgomo yeBond-Reled Bond ekwenziweni?

Ukuthola isivuno esiseduze esiseduze ngevolumu ephezulu isibopho socingo Ukusebenza kuyinselele ephelele. Akukona ukuthi ube nokuhle kakhulu i-wire bonder noma okungcono kakhulu uwaya; Kumayelana nokwenza ngcono lonke uhlelo. Njengomenzi we Ukudla okunengqondo-ubunjiniyela, siyakubona lokhu nsuku zonke.

Impumelelo iphumule ngezinsika ezintathu. Okokuqala usebenzisa izinto ezisezingeni eliphakeme kakhulu, kusuka ku i-semiconductor wafer futhi I-Bond Pad ifaka phakathi isibopho uwaya uqobo. Okwesibili ukusebenzisa amathuluzi okunemba kanye nokugcinwe kahle i-wire bonder ihlelwe ngokwenza kahle amapharamitha ahlanganisa. Okwesithathu, futhi okubaluleke kakhulu, insika inqubo ejulile yolwazi. Lokhu kusho ukuthi onjiniyela nochwepheshe abaqonda i-physics ye ubudlelwano, Ngubani ongaxazulula inkinga ngempumelelo nezinkinga, futhi asebenza nabahlinzeki bazo njengabalingani. Kuphumelele isibopho sentambo kungumphumela wobudlelwano obuphakathi emshinini, izinto zokwakha, kanye nochwepheshe osebenzisa inqubo.

Ukuthathwa Key

Le khasi isibopho sentambo Ingxenye encane kodwa enamandla, iqhawe elingaziwa lomhlaba we-elekthronikhi. Ukukwazisa ubuchwepheshe kubalulekile kunoma yimuphi unjiniyela obaluleke kakhulu ngokukhiqiza ukwethenjwa. Nazi izinto ezibaluleke kakhulu okufanele uzikhumbule:

• Izindlela ezimbili eziphambili: Imboni ithembele kokuqala okuyisisekelo amasu wokubopha intambo: I-thermosonic ibhondi yebholaIng (esheshayo, eguquguqukayo, isebenzisa igolide / ithusi) ne-ultrasonic bond bondIng (eqondile, ephansi-iphrofayili, isebenzisa i-aluminium).
• Izindaba ezibonakalayo: Ukukhethwa kwe impahla ye-wire-Gold, ithusi, noma i-aluminium - yisinqumo esibucayi esekwe kwizindleko, ukubangelanisa, nezidingo ezithile ze inqubo yebhondi.
• Uhlelo: Kuphumelele isibopho sentambo akukhona nje mayelana uwaya noma umshini. Kungukudlala okuyinkimbinkimbi phakathi kwe amapharamitha ahlanganisa, I-Bond Pad Ikhwalithi, isimo sethuluzi, nobuchwepheshe opharetha.
• Ngaphandle kwe-chip: Isibopho socingo kuyinto eguquguqukayo ukuxhuma Ubuchwepheshe busetshenziswe kakhulu kwezimoto, ama-elekthronikhi amandla, I-PCB, nokukhiqiza okwenziwayo.
• Ukunemba kubaluleke kakhulu: Konke Inqubo Yokubopha Nge-Wire, Ukusuka ekwakhekeni kwebhola ku-Loop Control, ngumdlalo wama-microns nama-milliseconds, afuna izinga eliphakeme kakhulu lokunemba kusuka emishinini kanye nezinto zokudla.