Imfashanyigisho ya injeniyeri yo guhuza inguzanyo: uzwi cyane tekinoloji ya kijyambere

Nka injeniyeri nuwashinze ikoranabuhanga rya elegitoroniki ya Dongxic, iminsi yanjye yuzuyemo imitwe yimbitse. Nkunze kuvuga hamwe nabashinzwe umutekano nka Marcus mubudage, abantu bafite ikibazo cyibanze ntabwo aricyo giciro kimwe, ariko ingaruka za miliyoni nyinshi zamadorari Guhuza. Basobanukiwe ko kwizerwa kwikibazo igice cya kabiri Igikoresho cyangwa Imyandikire Yimodoka Yinshi Akenshi imanuka mubusugire bwumusatsi umwe, umusatsi-muto wire. Aka gatabo karimo. Ntabwo ari agatabo k'agacuruza; ni ubushakashatsi bwimbitse bwa wire n'ingenzi Wire Wire Technologies ibyo bituma umugongo wibikorwa bya elegitoroniki zigezweho. Tuzagaragaza siyanse inyuma ya inkwano, gereranya tekinike zitandukanye, hanyuma uganire kubintu biganisha ku ruvumo no gusubirwamo Inzira ya Bond.

Ni ubuhe buryo bwo guhuza insinga?

Imbere yayo, Amarira ya Wire ni inzira yo kurema an Guhuza amashanyarazi hagati yingingo ebyiri, mubisanzwe a igice cya kabiri chip no gupakira (Bond Pad), cyangwa hagati ya chip na a Pcb. Nicyo cyakoreshejwe cyane kandi gifite akamaro guhuza Ikoranabuhanga, nyirabayazana wa tiriyation ya cherion yakozwe buri mwaka. Bitandukanye no kugurisha, ishonga ibikoresho byuzuza, Inzitizi Zirimo Leta-ikomeye inzira yo gusudira. Ibi bivuze inkwano yakozwe utashonga Uwiteka wire cyangwa Bond Pad.

Intego ni ugushiraho imbaraga zikomeye, zizewe Ububiko bwa Metallurgical-Ubukuru nyabwo kurwego rwa atome-ibyo bitanga ihamye Amashanyarazi na Mechanical guhuza. Ibi bigerwaho mugukoresha ihuriro ryimbaraga, ubushyuhe, na / cyangwa Ingufu za Ultrasonic gukanda neza cyane wire kurwanya substrate. Ibisubizo wire ikora umuzenguruko wuzuye wamashanyarazi, yemerera Uwiteka igikoresho cya semiconductor guhuza isi. Ubwiza bw'iki gihe inkwano ni plamount kumikorere yibikoresho no kuramba.

Ni ubuhe bwoko bw'ingenzi bw'ubuhanga bwo guhuza insinga?

Mugihe intego yo kurema a wire ni kimwe, hari ibyiciro bibiri Uburyo bwo guhuza ikoreshwa mu nganda: Umupira uhuza na wedge ihuza. Guhitamo hagati yabo biterwa na ibikoresho, gusaba, ikiguzi, hamwe nibisabwa na geometrike. Kuri injeniyeri, gusobanukirwa nualies ya buri Tekinike ni ngombwa kugirango utunganyirize.

Ibi Ubwoko bubiri bw'insinga Guhuza inzira Yiganje muri gupakira Semiconductor Inganda, kandi buriwese afite ibyiza byihariye bituma akunzwe uburyo bwo guhuza insinga kuri porogaramu zitandukanye.

Nigute umupira wamaguru wumupira wamaguru ukora?

Uwiteka tekinike yumupira ni rusange Inzira yo Guhuza Wire, guha agaciro umuvuduko wacyo no guhinduka. Ikoreshwa gusa Umugozi wa zahabu cyangwa umuyoboro w'umuringa. Inzira irahamagarwa Amarira ya Thermosonic Kuberako ihuza imbaraga zubushyuhe (ubushyuhe), imbaraga, na Ingufu za Ultrasonic.

Intambwe-ku ntambwe Inzira ya Bond ni igitangaza cyo kumenya neza ubuhanga:

1. Imiterere y'umupira: Inzira itangirana na wire Kugaburirwa binyuze mu gikoresho ceramic yubusa cyitwa capillary. "Flametike-ya elegitoronike" (efo) yagonze umuriro-voltage ndende ku isonga rya wire, gusashonga kandi wemerera ubuso bukabije kugirango ugire umuzingi wuzuye, cyangwa umupira.
2. Ihuriro rya mbere: Capillary yimukira ashyushye Bond Pad (Mubisanzwe 125-150 ° C). Ikoresha imbaraga nyazo, ukanda umupira kurwanya padi mugihe icyarimwe usangiye Ingufu za Ultrasonic. Uku guhuza ubushyuhe, imbaraga, na vibration bitera Uwiteka umuhuza wa mbere, umupira ukomeye inkwano.
3. Gushiraho: Uwiteka Bornder Noneho yimura capillary ahava umuhuza wa kabiri (urugero, urutoki rwa Liveframe), kurema ababarwa Umuyoboro muri iki gikorwa. Imiterere yibi wire loop ni ngombwa mu bikorwa no gukumira ikabutura.
4. Ihuriro rya kabiri: Kumwanya wa kabiri, igikoresho gikanda wire Kurwanya ubuso kandi bukoresha irindi riturika Ingufu za Ultrasonic gushiraho "kudoda" cyangwa Wedge Bond.
5. Umurizo utuntu: Hanyuma, imashini iranyeganyega wire kandi azura capillary, amena kuri wire ku gitsinsino cya umuhuza wa kabiri no gutegura EFO kugirango ukore umupira mushya kubikurikira wire.

Niki gituma inderusi ya Ultrasonic yedge itandukaniro ritandukanye?

Wedge Bonding, cyangwa byinshi byumwihariko umugozi-wedge, ni ngombwa ariko bifite agaciro Inzira yo Guhuza Wire. Ubu buhanga ni bwo buryo bwo kugenda Aluminium Wire kandi akenshi bikorwa kuri ubushyuhe bwicyumba, kwishingikiriza gusa Ingufu za Ultrasonic kandi guhatira ingwate. Nuburyo bwambere bukoreshwa kuri RibBon.

Muriyi nzira, the wire ni kugaburirwa munsi ya Flat-Hampmed igikoresho cyo guhuza bita ingofero. Igikoresho kiramanuka, kanda kuri wire kurwanya uwambere Bond Pad, kandi birakurikizwa Ingufu za Ultrasonic Kurema intangiriro Wedge Bond. Igikoresho noneho kizamuka no kwimukira ahanini, gukora umwirondoro wo hasi, ngufi Umuyoboro kuruta ibisanzwe hamwe Wire umupira. Ku wa kabiri Bond Pad, inzira isubirwamo kugirango ikore Uwiteka umuhuza wa kabiri. Kuko byombi na umuhuza wa kabiri ni umutenguruko washizwemo, ubu buhanga butanga imikorere isumba cyane muburyo bwo hejuru bukoreshwa cyane kandi bukemerera ikibanza cyiza cyane (umwanya wa hafi) Guhuza. Biremereye Aluminium Wire kubikoresho byamashanyarazi nabyo bishingikiriza gusa kuri Wedge Bond inzira yo gukora urufatiro inkwano.

Ni ibihe bintu birebire nibyiza kubisabwa?

Uwiteka Guhitamo Wire ni kimwe mubyemezo bikomeye muri wire inzira. Ibanze eshatu Ibikoresho Byakoreshejwe ni zahabu, umuringa, na alumunum. Buri ibikoresho ifite urutonde rwihariye rwimitungo ituma ikwiranye na zitandukanye Guhuza.

• Gold Wire (AU): Urwego rwumwimerere kuri Amarira akoresha zahabu. Birahanganye cyane kuri okiside, kugirango byoroshye inkwano kandi wizewe cyane. Guhuza zahabu ni. Ubwitonzi bwayo nabwo birinda ibyangiritse igice cya kabiri substrate. Ibisubizo nyamukuru bya Umugozi wa zahabu nigiciro kinini. Amarira ya Thermosonic ni urwego rwa a Inguzanyo ya Zahabu.
• Umuyoboro w'umuringa (CU): Umuyoboro w'umuringa yahindutse ubundi buryo buzwi kuri zahabu kubera ikiguzi cyo hasi cyane kandi kirenze amashanyarazi na thermal gukora. Nyamara, umuringa wumuringa byoroshye, ibyo bituma Inzira ya Bond bigoye kandi bisaba ikirere kivanze muri Bornder. Gukomera kwayo bisaba kandi gukomera guhuza ibipimo kwirinda kwangirika.
• Umugozi wa aluminium (al): Umuyoboro wa Aluminium ni Byoroheje ibikoresho kandi ni byiza kuri Ultrasonic. Nibyiza gukora ikiranuka inkwano ku bushyuhe bw'icyumba. Biremereye aluminium ihuza insinga Ese inganda zingana na porogaramu za electronics na porogaramu zigufasha kubera kwizerwa nubushobozi bwo gukora iramba, iraramba. inkwano. Turabona abakiriya benshi bahindukira Umuyoboro muremure uhuza insinga kubikorwa byayo bihamye.

Nigute diameters na lente ihuza?

Imiterere yumubiri ya Guhuza-Ibyo bizengurutse wire cyangwa lebbon iringaniye - nanone bigira uruhare runini. Guhitamo biterwa nibisabwa mumashanyarazi.

Diameters irashobora gushyirwa mu byiciro byinshi mumatsinda abiri. Insinga Guhuza mubisanzwe bikoresha wire hamwe na diameters kuva kuri microns 15 kugeza 75 (μm). Nibipimo byo kwerekana ibimenyetso Guhuza mu gipimo igice cya kabiri Amapaki, guhuza chip I / O kuri Liveframe. Biremereye wire Guhuza diameters kuva ku 100 kugeza 500 μm. Iyi mvururu wire ikoreshwa mubikoresho byimbaraga hamwe na module yimodoka kugirango ukemure imigezi myinshi. Kabuhariwe umutware uremereye aluminium basabwa kuri iki gikorwa.

RibBon ni ubundi buryo bwo gukomera wire Guhuza. Aho kuzenguruka wire, ikoresha leb, urukiramene rukozwe muri aluminium cyangwa zahabu. Imyenda yo hejuru yubuso-hejuru-imbibi, ikungurira ikoreshwa ryinshi (kugabanya imbaraga zuruhu) hamwe na porogaramu zuruhu) hamwe na porogaramu zubutegetsi aho gutandukana gukomeye no gutera imbere. The Inzira ya Bond Kuri lebbon bisa na wedge inkwano.

Ni ibihe bintu by'ingenzi bigira ingaruka ku mbaraga no kwiringirwa?

Kuri injeniyeri kugenzura umurongo utanga umusaruro, kugera hejuru imbaraga kandi bihamye Guhuza umusaruro nintego nyamukuru. Intsinzi ya a wire ntabwo ari impanuka; Nibisubizo byo kugenzura neza urutonde rwibikomeye guhuza ibipimo n'ibihinduka.

1. Isano Ibipimo: Ibipimo bya "Big bitatu" ni imbaraga (uburyo ibikoresho byabigenewe), Ingufu za Ultrasonic . Ibi bigomba guhamagarwa neza muburyo bwihariye wire na Bond Pad guhuza.
2. Bond Padi Nziza: Ubuso bwa Bond Pad Ugomba kuba ufite isuku, udafite oxide nabanduye, kandi bafite metallurgy ikwiye nubwinshi. Byateguwe nabi Bond Pad ni impamvu nyamukuru itera inkwano gutsindwa.
3. Guhuza ibikoresho: Capillary cyangwa Wedge nikintu cyonyine kikora kuri wire. Ibi bikoresho ni ugukoresha neza bishaje mugihe runaka. Igikoresho cyambarwa cyangwa cyacitse kizatanga ubumwe cyangwa budahuye. Niyo mpamvu dusanzwe gukora Ibikoresho byateguwe byateguwe bikozwe mubikoresho bya ultra-bikomeye kugirango ukemure igihe kirekire kandi wizewe inkwano.
4. Ubwiza Bwiza: Ihuza wire ubwabwo igomba kuba ifite ireme ryisumbuye, hamwe na diameter ihamye, ubuziranenge, hamwe nubukanishi. Itandukaniro iryo ari ryo ryose muri wire irashobora guhungabanya byose Inzira ya Bond.

Ni uruhe ruhare umuyoboro wa none ukina muri gahunda?

Igezweho Bornder ni igice kinini cyibikoresho bya robo byahindutse Amarira kuva mubuhanga bwintoki muburyo bwiza, bwikora. Leta-yubuhanzi Bornder ni yo nyirabayazana yo gukora Inzira ya Bond hamwe n'umuvuduko udasanzwe no gusubiramo.

Izi mashini zihuza tekinoroji yingenzi. Sisitemu yo hejuru ya sisitemu ihita izi Bond Pad Ahantu no gutanga ibitekerezo muri sisitemu yo kugenzura. Software yambere yemerera injeniyeri gahunda yo gutegura no gusobanura neza Umuyoboro imiterere kugirango wirinde ikabutura no kunoza ubunyangamugayo. Icy'ingenzi cyane, bigezweho umugezi wire Tanga uburyo busanzwe bwo gukurikirana no kwinjira. Barashobora kumenya amakosa inkwano Nkuko bibaho kandi uhagarike inzira, gukumira ibice bifite inenge uhereye kumanuka kumurongo. Uru rwego rwo kwikora no kugenzura ni ngombwa kubikorwa byinshi byimibare ya electronics yuyu munsi kandi niyo nzira yonyine yo kugera kubice bisabwa-byanze bisabwa.

Nihehe handi hakoreshejwe tekinike ifatanye?

Mugihe wire ni uzwi cyane Semiconductor, gusaba kwayo kwaguka kure cyane ya gapfunyika. Guhinduka no kwizerwa kwa Wire Wire Technologies byatumye bitabikenewe mubindi bice byinshi byo gukora ibikoresho bya elegitoroniki.

• Imbaraga Zidozi: IGBBTS, Mosfets, hamwe nibindi bikoresho byingufu byishingikiriza Umuyoboro wa Aluminium na RibBon gukora imigezi myinshi kandi utandukanya ubushyuhe neza.
• Ibikoresho bya elegitoroniki: Wire Amarira mumodoka ni byinshi, bikoreshwa muri sensor, kugenzura ibice (ecus), na sisitemu yo gucana aho kwizerwa hakurya yubushyuhe bukaze nubushyuhe hamwe no kunyeganyega bitaganirwaho.
• Gukora Gukora PCB: Amarira ikoreshwa muguhuza ubusa yapfiriye kuri a Pcb .
• Ibikoresho bya RF na Microwave: Kugenzura neza wire geometrie ikora Inguzanyo ya Zahabuing na RibBon Nibyiza kubisabwa byinshi-aho bihuye nibyingenzi.
• Yayoboye module: Amarira Nuburyo busanzwe bwo guhuza igihe gito bigapfa kuri paki substrates, dusanga muri buri kintu kuva muri stade ya stade.

Nigute dushobora kwemeza inzira ndende-umusaruro mukora?

Kugera kumusaruro hafi-yuzuye mubunini bwinshi Amarira Igikorwa nikibazo cyuzuye. Ntabwo ari ukugira ibyiza Bornder cyangwa ibyiza wire; Bijyanye no guhitamo sisitemu yose. Nkumurimo wa Amafaranga akoreshwa neza, turabona buri munsi.

Intsinzi iruhukira ku nkingi eshatu. Ubanza ukoresha ibikoresho byiza cyane, uhereye kuri igice cya kabiri wafer na Bond Pad kwibeshya wire ubwayo. Icya kabiri kirakoresha ibikoresho byabigenewe hamwe nabungabunzwe neza Bornder Yateguwe hamwe guhuza ibipimo. Icya gatatu, kandi butoroshye cyane, inkingi ni ibintu byimbitse. Ibi bivuze kugira injeniyeri nabatekinisiye bumva fiziki ya inkwano, ninde ushobora gukemura ibibazo neza, kandi ninde ukorana nabaguzi babo nkabafatanyabikorwa. Gutsinda wire Nibisubizo byumubano wa symbiotic hagati yimashini, ibikoresho, hamwe nimpuguke ikora inzira.

ABAFATANYIJE

Uwiteka wire ni ikintu gito ariko gikomeye, intwari itaririsi ya elegitoroniki. Kumenya ikoranabuhanga ni ngombwa kuri injeniyeri iyo ari yo yose ikomeye yerekeye gukora kwizerwa. Hano hari ibintu byingenzi byo kwibuka:

• Uburyo bubiri bw'ingenzi: Inganda zishingiye kuri masiyo abiri tekinike yo guhuza insinga: thermosonic umupiraing (byihuse, byoroshye, ikoresha zahabu / umuringa) na ultrasonic Wedge Bonding (ibisobanuro, umwirondoro muto, ukoresha alumini).
• Ibintu bifatika: Guhitamo ibikoresho-Gold, umuringa, cyangwa aluminium-nicyemezo gikomeye gishingiye ku giciro, gukora, n'ibisabwa byihariye bya Inzira ya Bond.
• Ni sisitemu: Gutsinda wire ntabwo ari ibya wire cyangwa imashini. Ni intera igoye hagati ya guhuza ibipimo, Bond Pad ubuziranenge, imiterere yibikoresho, hamwe nubuhanga.
• Kurenga Chip: Amarira ni ihuriro Guhuza Ikoranabuhanga ryakoreshejwe cyane mumodoka, ingufu za electoronics, Pcb, no gukora inganda.
• Precision nibyinshi: Byose Inzira yo Guhuza Wire, kuva gushinga umupira kugirango ugenzure, ni umukino wa mirize na milisegonda, usaba urwego rwo hejuru rwukuri ruva mumashini zombi kandi unywa.