Nhungamiro yeinjiniya kune waya Bond Bond Interconnection: Mastering Yazvino Wire Kubatira Technologies

Semunhu mainjiniya uye muvambi weDongxin Electronic tekinoroji, mazuva angu akazadzwa nemapakiti akadzika ehunyanzvi. Ini ndinowanzotaura neinjiniya semagetsi seMarcus muGerman, vanhu vane hanya neyakajairwa chimwe chinhu, asi madhora emadhora emadhora emitsara yekugadzira inokonzerwa neine microscopic Kubatana. Ivo vanonzwisisa kuti kuvimbika kweiyo yakaoma semicononductor Chishandiso kana yakakwira-simba emagetsi module inowanzouya pasi pekuvimbika kweimwe, bvudzi-rakatetepa waya. Iyi ndima ndeye yavo. Haisi bhurocha rekutengesa; Iyo inodzika-yakadzika kuongorora kwe Wire Bond uye kutsoropodza Wire Kubatira Technologies iyo inoumba musana wezvemitambo yemazuva ano zvigadzirwa zvemagetsi. Isu tichavhura sainzi kuseri kwe chisungo, enzanisa nehunyanzvi hwakasiyana, uye kurukura zvinhu zvinotungamira mukugara uye kudzokorodza Bond maitiro.

Chii chinonzi waya yekubatanidza maitiro?

Pamusimboti wayo, Wire Bonding ndiyo maitiro yekugadzira Electrical Interconnection pakati pemapoinzi maviri, kazhinji a semicononductor chip uye kurongedza kwayo (Bond Pad), kana pakati pe chip uye PCB. Ndiyo inonyanya kushandiswa uye inodhura-inoshanda Kushamwaridzana Tekinoroji, inotarisira matricions ekubatana akaitwa gore rega rega. Kusiyana nevatengesi, iyo inonyungudika chinhu chinoputika, Wire Kubatira kunosanganisira yakasimba-nyika Welding maitiro. Izvi zvinoreva kuti chisungo inoumbwa isina kunyungudika waya kana iyo Bond Pad.

Chinangwa ndechekugadzira yakasimba, yakavimbika Metallurgical Bond-Asa wechokwadi weld kuAtomic level-inopa yakagadzikana magetsi uye nemuchina kubatana. Izvi zvinowanikwa nekushandisa musanganiswa wesimba, kupisa, uye / kana Ultrasonic Energy kudzvanya zvakanaka kwazvo waya kupokana ne substrate. Zvinokonzerwa Wire Bond inoumba dunhu rakazara remagetsi, kubvumira iyo Semiconductor mudziyo kubatanidza kune vekunze nyika. Mhando yeiyi imwe chisungo iri paramount kune basa remushini uye hurefu.

Ndeapi marudzi makuru eaya waya marongero ekubatanidza maitiro?

Ipo chinangwa chekugadzira a Wire Bond inogara yakafanana, kune maviri ekutanga nzira dzekubatanidza Inoshandiswa muindasitiri: bhora bhora uye wedges birning. Sarudzo pakati payo inoenderana ne Wire zvinhu, application, mutengo, uye zvakananga geometric zvinodiwa. Kune mainjiniya, anonzwisisa nuNeances yeumwe neumwe Kubatira maitiro inokosha yekuita kugadzirisa.

Izvi Mhando mbiri dzeWire Bonding maitiro anotonga iyo Semiconductor Packing indasitiri, uye imwe neimwe ine musiyano wakasarudzika wezvakanakira zvinoita kuti ive yaunoda Wire Boging nzira Zvekushandisa zvakasiyana.

Iyo Thermonic bhora bond bond process inoshanda sei?

The the Bhora Bland Technique ndiyo yakajairika Wire Boging Process, inokosheswa nekumhanya kwayo uye kuchinjika. Izvo zvinenge zvichishandiswa chete Goridhe Wire kana Copper waya. Maitiro acho anonzi Thermonic Bonding nekuti inobatanidza simba rekupisa (kupisa), simba, uye Ultrasonic Energy.

Nhanho-nhanho Bond maitiro Isine chishamiso chekunyatsojeka engineering:

1. Bhora Kuumbwa: Maitiro acho anotanga ne waya Kudyara kuburikidza nehasha ceramic mudziyo unonzi capillary. "Electronic Flame-Off" (EFO) Wand inopisa yakakwira-voltage spark yekupaza pamucheto we waya, ichivhenekera uye kubvumira kushushikana kwepasi kugadzira nzvimbo yakakwana, kana bhora.
2. Chekutanga Bond: Capillarry inofamba ichidzika kune inopisa Bond Pad (kazhinji 125-150 ° C). Inoshandisa simba chairo, kudzvanya bhora pakatarisana nePadhi panguva imwe chete uchishandisa Ultrasonic Energy. Uku kusanganiswa kwekupisa, simba, uye vibration inogadzira iyo Chekutanga Bond, bhora rakasimba chisungo.
3. Loop kugadzirwa: The the Wire Boder Wobva wafambisa capillary kune iyo nzvimbo ye Chisungo chechipiri (i.G., leftframe chigunwe), kugadzira yakaverengerwa Wire loop mukuita. Chimiro cheizvi waya chiuno chakanyanya kukosha chekuita uye kudzivirira zvipfupi.
4. Chisungo chechipiri: Pane yechipiri nzvimbo, chishandiso chinodzvinyirira iyo waya pamusoro pechiso uye chinoshanda chimwe chakaputika Ultrasonic Energy kugadzira "stitch" kana Wedge Bond.
5. Wire muswe-off: Pakupedzisira, muchina unogunun'una waya uye inosimudza capillary, kutyora waya nechitsitsinho cha Chisungo chechipiri uye kugadzirira iyo efo kuti iite bhora idzva kune inotevera Wire Bond.

Chii chinoita kuti ultrasonic wedge bond maitiro akasiyana?

Wedge Bonding, kana kupfuura zvakananga wedge-wedges-wedges bonding, ndeye akasiyana nazvino akakosha zvakafanana Wire Boging Process. Iyi nzira ndeyekuenda-kune nzira ye Aluminium Wire Kubatira uye inowanzoitwa kupisa kwemimba, tichivimba chete Ultrasonic Energy uye kumanikidza Kuumbwa Kuumbwa. Iyo zvakare ndiyo nzira yekutanga inoshandiswa ribhoni kubatana.

Mune izvi, the waya inodyiswa pasi pefirati Bonding Tool anonzi wedge. Chishandiso ichiburukira, zvichimanikidza waya zvinopesana newekutanga Bond Pad, uye inoshanda Ultrasonic Energy kugadzira yekutanga Wedge Bond. Chishandiso chinobva chabuda uye chinofamba kuenda kunzvimbo yechipiri, kugadzira yakaderera-mbiri, ipfupi Wire loop pane zvakajairika na Wire bhora kusungwa. Pane yechipiri Bond Pad, maitiro anodzokororwa kuumba Chisungo chechipiri. Nekuti zvese zvekutanga uye Chisungo chechipiri dzoga-dzakaumbwa, iyi nzira inopa yepamusoro pesvedzero mukukwira-frequency-frequency application uye inobvumira yakanyatsonaka-pitch (zvakanyatsonaka) kusungwa. Zvinorema Aluminium Wire Kubatira Zvemidziyo yemagetsi inovimba chete pane Wedge Bond maitiro ekugadzira robust chisungo.

Ndeipi waya ye waya yakanakira chikumbiro changu?

The the kusarudzwa kwe waya ndechimwe chezvakanyanya kutsoropodza sarudzo mu Wire Bond maitiro. Matatu matatu ekutanga zvishandiso zvinoshandiswa ndiro ndarama, mhangura, uye aluminium. Imwe neimwe Kubatira zvinhu ine yakasarudzika seti yezvivakwa inoita kuti ive yakakodzera kune dzakasiyana Kubatira Zvikumbiro.

• Goridhe Wire (AU): Chiyero chepakutanga che Wire Kubatira Inoshandisa Goridhe. Izvo zvinonyanya kurwisa oxidation, zvichiita kuti zvive nyore chisungo uye yakavimbika kwazvo. Kubatirana kwegoridhe yakatwasuka. Zvinyoro-nyoro zvakare zvinodzivirira kukuvadza kune anonzwa semicononductor Substrate. Iyo huru yekudhirowa ye Goridhe Wire ndiyo mutengo wakakwira. Thermonic Bonding chiyero che goridhe chisungo.
• Copper waya (cu): Copper waya rave paine imwe nzira inozivikanwa yegoridhe nekuda kwemutengo wayo wepasi uye mukuru magetsi uye anopisa Kuita. Nekudaro, mhangura oxidaly zviri nyore, inogadzira iyo Bond maitiro zvakawandisa uye zvinoda inert intermphere mu Wire Boder. Kuomerwa kwayo kunodawo kuoma Kuronga paramita kudzivirira chip kukuvara.
• Aluminium Wire (Al): Aluminium Wire ndiye akapfava Wire zvinhu uye yakakodzera Ultrasonic Bonding. Yakanakisa kugadzira yakagadzikana chisungo kumhepo tembiricha. Zvinorema Aluminium Bonding Wire Iyo indasitiri mwero wesimba yemagetsi yemagetsi uye zvemotokari zvinoshandiswa nekuda kwekuvimbika kwayo uye kugona kuumba yakasimba, yakasimba chisungo. Isu tinoona vazhinji vatengi vachinzviva Yakakwirira-Pollity Aluminium Bonding Wire pakuita kwayo kuenderana.

Wire diameter uye ribhoni kusunga kuenzanisa?

Chimiro chemuviri che Kubatana-Kwakatenderedza waya kana rabboni rakatetepa - rinotorawo basa rakakura. Sarudzo inoenderana nezvinodiwa nemagetsi zvekushandisa.

Waya diamita inogona kuve yakakombama zvakazara mumapoka maviri. Yakaonda waya Kubatira kazhinji kunoshandisa waya ine diameters kubva pagumi nemashanu kusvika makumi manomwe emicons (μm). Iyi ndiyo mwero wechiratidzo Kubatana muyero semicononductor Mapakeji, kubatanidza iyo chip's i / o kune inotungamira. Zvinorema waya Kuronga Kushandisa waya diamita kubva zana kusvika ku500 μm. Kubira uku waya inoshandiswa mune mashandiro emagetsi uye automotiv modules kubata mifungo yakakwira. Nyanzvi inorema aluminium waya varanda varanda zvinodiwa kuti uite izvi.

Ribhoni kubatana inzira yekurema waya kusungwa. Pachinzvimbo chekutenderera waya, inoshandisa flat, rectangular ribhoni yakagadzirwa nealuminium kana goridhe. Ribbons ine yakakwira nzvimbo-kune-vhoriyamu ratio, iyo inobatsira kune yakakwira-frequency application (kuderedza mashandiro eganda) uye kune magetsi magetsi ipo yekushambadzira kusapfeka uye kuderera kwekunyepedzera kunodiwa. The the Bond maitiro yeiyo ribhoni yakafanana nedutu chisungo.

Ndezvipi zvinhu zvakakosha zvinopesvedzera kusungwa uye kuvimbika?

Kuti injinjini inotarisa mutsara wekugadzira, kuzadzisa yakakwira Bond Simba uye zvinowirirana kurongedza goho ndicho chinangwa chikuru. Kubudirira kwe Wire Bond haina tsaona; Ndiwo mhedzisiro yekunyatso kudzora seti yekutsoropodza Kuronga paramita uye akasiyana.

1. Kuronga paramita: Iyo "Big nhatu" parameter isimba (kuti yakaoma sei mudziyo wekushandisa), Ultrasonic Energy (iyo mari uye nguva yekutsvaira), uye tembiricha (yeTirmosic Bonding). Izvi zvinofanirwa kuve zvakanyatsonongedzwa mukati mevakanangana waya uye Bond Pad kusanganisa.
2. Bond Pad mhando: Pamusoro pe Bond Pad Inofanira kuva yakachena, isina mhou dzemhou uye dzinosvibiswa, uye uve neyakafanira simbi uye gobvu. Akagadzirirwa zvisina kunaka Bond Pad chinhu chinotungamira che chisungo kukundikana.
3. Bonding Tool Mamiriro ezvinhu: Iyo capillary kana wedge ndicho chega chinhu chinobata Wire Bond. Zvishandiso izvi zvakaringana zvinoparadza zvinopera nekufamba kwenguva. Chishandiso chakapfeka kana chakasarudzika chinoburitsa zvisungo zvisina kusimba kana zvisingaenzaniswi. Ndokusaka isu tichinyatsotarisa mukugadzira Tsika-Yakagadzirwa Wedge Kubatanidza Zvishandiso yakagadzirwa kubva kune Ultra-yakaoma zvinhu kuti uve nechokwadi chehupenyu hwakareba uye hwakavimbika chisungo.
4. Wire mhando: Kusungwa waya Ichochocho chinofanira kunge chiri chemhando yepamusoro, neyakawirirana, kuchena, uye michina yemuchina. Chero kusiyana mune waya inogona kukanganisa zvese Bond maitiro.

Ibasa ripi rinoita kuti waya yemazuva ano bonder play mune maitiro?

Zvazvino Wire Boder chidimbu chakanyanyisa chemuchivharo chemidziyo yakashandura Wire Kubatira kubva pane bhuku remanyorero mune chaiyo, otomatiki sainzi. Nyika-ye-iyo-art Wire Boder ine mutoro wekuuraya Bond maitiro nekumhanya kunoshamisa uye kudzokorora.

Iyi michina inobatanidza kiyi dzinoverengeka technologies. Yakakwira-resolution Chiono Systems otomatiki Ziva Bond Pad Nzvimbo uye upe mhinduro kune iyo yekufambisa kudzora system. Yepamberi Software inobvumira mainjiniya kuProgram yakaoma uye chaiyo Wire loop Maumbirwo kuti udzivise zvipfupi uye dzokorora kutendeka kwesina chiratidzo. Zvakanyanya kukosha, zvazvino Wire varanda Ipa chaiyo-nguva maitiro ekuongorora uye data matanda. Ivo vanogona kuona kukanganisa chisungo Sezvazvinoitika uye kumisa maitiro, kudzivirira zvikamu zvine urema kubva pakufamba pasi mutsara. Iyi nhanho ye automation uye kutonga kwakakosha kune yakakwirira-vhoriyamu yekugadzira yezuva razvino zvigadzirwa zvemagetsi zvemagetsi uye ndiyo chete nzira yekuzadzisa iyo inodiwa zvikamu-mumiriyoni emamiriyoni emhando yepamusoro.

Ndekupi kumwe kuraswa kwemawiri kusungwa maitiro anoshandiswa?

Nepo Wire Bond inonyanya kufarirwa ne semicononductor machipisi. Kuchinjika uye kuvimbika kwe Wire Kubatira Technologies vakavaita vanokoshesa mune dzimwe nzvimbo dzakawanda dzekugadzira zvemagetsi.

• Simba Magetsi: Igbts, mosfets, uye zvimwe zvishandiso zveimba zvinovimba zvinorema Aluminium Wire uye ribhoni kubatana kubata yakakwira mafungu uye zvinobudirira kuputsa kupisa.
• Zvemagetsi emotokari: Waya kusungwa mumotokari Yakapararira, inoshandiswa muSensors, masisitimu ekudzora (ecus), uye maruva ekuvhenekera anovimbika pasi pekudziya kwehasha uye mamiriro ezvinhu asina kutaurwa haatauri.
• PCB Kugadzira: Wire Kubatira inoshandiswa kubatanidza isina kubereka inofa zvakananga kune a PCB .
• RF uye microwave midziyo: Kudzora kwakanaka pamusoro waya geometry inoita goridhe chisungoing uye ribhoni kubatana Yakanakira kukwidziridzwa-frequency application uko kwakakurumidza kuenderana neyekutsoropodza.
• LED Modules: Wire Kubatira ndiyo nzira yakajairwa yekubatanidza diki diki kufa kune iyo subjew substrate, inowanikwa mune zvese kubva kufoni madhiri kune nhandare yeNhandare.

Tingaite sei kuti tisvike pabasa rakakwirira kwazvo rekugadzira mugadziri?

Kuzadzisa goho rakakwana-rakakwana mune yakakwirira-vhoriyamu Wire Kubatira Kushanda idambudziko rakawanda. Hazvisi zvekuita zvakanakisa Wire Boder kana zvakanakisa waya; ndezvekusimbisa iyo yese system. Semugadziri we Precision-Injiniya Anopererwa, tinoona izvi mazuva ese.

Kubudirira kunozorora pamapongi matatu. Kutanga iri kushandisa iyo yepamusoro mhando zvinhu, kubva ku semicononductor wafer uye Bond Pad kugadzirira kusungwa waya . Yechipiri iri kushandisa zvishandiso zvakanyatsojeka uye yakanyatsochengetwa Wire Boder yakarongedzwa neakagadziriswa Kuronga paramita. Yechitatu, uye nharo inonyanya kukosha, mbiru yakadzika yekugadzirisa ruzivo. Izvi zvinoreva kuti mainjiniya uye nyanzvi vanonzwisisa fizikisi ye chisungo, Ndiani anogona kugadzirisa nyaya nekubetsera, uye ndiani anoshanda nevatengesi vavo sevakaroorana. Kubudirira Wire Bond Imhedzisiro yehukama hweSykiotic pakati pemuchina, izvo zvinoshandiswa, uye nyanzvi iri kuita maitiro.

Key Deaaroways

The the Wire Bond chinhu chidiki asi chine simba, iyo gamba risingatauri renyika yemagetsi. Kusimbisa tekinoroji kwakakosha kune chero mainjiniya zvakakomba nezvekugadzira ivate. Hechino zvinhu zvinonyanya kukosha kuti urangarira:

• Nzira mbiri huru: Iyo indasitiri inovimba neyisiyo yekutanga Wire Boging Techniquees: Thermonic BALL BCHASing (nekukurumidza, inoshanduka, inoshandisa goridhe / mhangura) uye ultrasonic Wedge Bonding (chaiyo, yakaderera-mbiri, inoshandisa aluminium).
• NYAYA DZESVONDO: Sarudzo ye Wire zvinhu-Gold, mhangura, kana aluminium-isarudzo yakaoma yakavakirwa pamutengo, Kuita, uye zvakananga zvinodiwa zve Bond maitiro.
• Icho hurongwa: Kubudirira Wire Bond hazvisizvo chete nezve waya kana muchina. Iyo yakaoma kunzwisisa pakati pe Kuronga paramita, Bond Pad mhando, chishandiso mamiriro, uye hunyanzvi hwekushandisa.
• Kupfuura chip: Wire Kubatira chinhu chanies Kubatana Tekinoroji inoshandiswa zvakanyanya mumotokari, magetsi emagetsi, PCB, uye akatungamira kugadzira.
• Kunyatsojeka ndiko: Izvo zvese Wire Boging Process, kubva pakuumbwa kwebhora kuenda kuLoop kutonga, mutambo weMicroni uye milliseconds, achida huwandu hwepamusoro hwekunyora kubva pamishini mbiri uye dzinopeserwa.