Isikhokelo seNjineli kwiDiere Count Concontction: I-Cring Gring Haire yombane

Njengenjineli kunye noMsunguli weTekhnoloji ye-Dongxin, iintsuku zam zizaliswe ziingcamango ezinzulu zobugcisa. Ndihlala ndithetha neenjineli zenkqubo enjengeMarcus eJamani, umntu obaluleke kakhulu yindleko yecandelo elinye, kodwa ifuthe ledola yezigidi zeedola lemicroscopic ebiwe uqhagamshelo lwe. Bayayiqonda ukuba ukuthembeka kwento enzima I-Semiconductor Isixhobo okanye imodyuli yemoto enamandla ehlala ihla iye kwingqibelelo yenye, intaphane ucingo. Esi sikhokelo senzelwe bona. Ayisiyo incwadana yokuthengisa; Ngumnqweno onzulu we i-wire ye-wire kwaye eyona nto ibalulekileyo I-wire bond the theire teknologies Yenza i-backnene yemveliso ye-elektroniki yanamhlanje. Siza kuyityhila isayensi emva kwe iqhina, Thelekisa ubuchwephesha obahlukileyo, kwaye uxoxe ngezinto ezikhokelela kwimozulu kwaye iphinde iphinde iphinde Inkqubo yeBod.

Ithini i-wire fire fit proPlally?

Kwinkalo yayo, I-wire i-boire yinkqubo yokudala i iqhagamshela yombane phakathi kwamanqaku amabini, ngokuqhelekileyo a I-Semiconductor i-chip kunye nokupakishwa kwayo (I-Bond pad), okanye phakathi kwe-chip kunye ne I-PCB. Yeyona nto isetyenziswa kakhulu kwaye ineendleko phawula Itekhnoloji, inoxanduva lweetriliyoni zonxibelelwano ezenziweyo ngonyaka. Ngokungafaniyo nokuthengiswa komzimba, okunyibilikisi i-filler I-wire boire ibandakanya ilizwe eliqinileyo Inkqubo ye-welding. Oku kuthetha i iqhina yenziwa ngaphandle kokunyibilika ucingo okanye I-Bond pad.

Injongo kukwenza into eyomeleleyo, inokuthenjwa I-Mentellical Bond-I-WOLD YINYANISO YENKUNDLA KWI-ATOMIC AMAXESHA APHA APHA Umbane noomatshini Unxibelelwano. Oku kufezekiswa ngokusebenzisa indibaniselwano yamandla, ubushushu, kunye / okanye amandla e-ultrasonic Ukucofa i-good kakhulu ucingo ngokuchasene nendawo. Isiphumo i-wire ye-wire Yenza isekethe yombane epheleleyo, ivumela i Isixhobo se-semiconductor Ukunxibelelana nehlabathi elingaphandle. Umgangatho wale nye iqhina Ibaluleke kakhulu kumsebenzi wefowuni kunye nobomi obude.

Zeziphi iintlobo eziphambili zendlela yokubonisa?

Ngelixa injongo yokudala i i-wire ye-wire ihlala ifana, zimbini eziphambili eziphambili Iindlela zokuBola isetyenziswe kwishishini: Ibhola yebhola kunye ne-Wedge. Ukukhetha phakathi kwabo kuxhomekeke kwi Izixhobo ze-cire, isicelo, iindleko, kunye neemfuno zejometri. Injineli, ukuqonda intsingiselo nganye I-BOUFISIQOIT kubalulekile ukuba kuqinisekiswe.

Ezi Iindidi ezimbini zocingo I-Handing yeenkqubo ilawula i Ukupakishwa kwe-semicondcuct ishishini, kwaye nganye nganye inemida yezinto eziluncedo ezizenzayo indlela yokubonisa indlela kwizicelo ezahlukeneyo.

Isebenza njani i-thermontolonic yeqela?

I I-Bloll Bondiquique yeyona ixhaphakileyo I-Wire Sire Sport Inkqubo, ixabisa isantya sayo kunye nokuguquguquka. Iphantse yasetyenziswa kuphela I-wire yegolide okanye ucingo lobhedu. Inkqubo ibizwa I-thermosonic bond Kuba idibanisa amandla e-thermal (ubushushu), amandla, kwaye amandla e-ultrasonic.

Inyathelo lenyathelo Inkqubo yeBod ngummangaliso wenjineli echanekileyo:

1. Ukuqulunqwa kwebhola: Inkqubo iqala nge ucingo I-Fed ngesixhobo se-ceramic se-ceramic ebizwa ngokuba yi-capillary. "" I-elektrome-off "(i-EFO) i-wand ifihlisa umlilo ophakamileyo wevolthi kwincam ye ucingo, ukuyinyibilikisa kwaye ivumela uxinzelelo lwe-temputer ukwenza indawo egqibeleleyo, okanye ibhola.
2. I-CONT YOKUQALA: I-capillary ihamba iye eshushu I-Bond pad (Ngokwesiqhelo i-125-150 ° C). Isebenza ngamandla achanekileyo, ecinezela ibhola ngokuchasene nepali ngelixa kwangaxeshanye amandla e-ultrasonic. Indibaniselwano yobushushu, amandla, kunye nokuntywila kudala I-Bondy yokuqala, ibhola eyomeleleyo iqhina.
3. I-LOOP ye-LOP: I umnikeli emva koko susa i-capillary kwindawo ye I-Bond yesibini (E.G., umnwe we-charframe), ukudala ukubalwa ucingo loop kwinkqubo. Ubume besi ucingo I-loop ibalulekile ekusebenzeni nasekuthinteleni iifutshane.
4. I-Bond yeSibini: Kwindawo yesibini, kungucinezeli olwenziweyo ucingo nxamnye nomphezulu kwaye usebenza omnye komnye amandla e-ultrasonic ukwenza "i-stitch" okanye Wedge Bond.
5. I-Wire Swiil-Off: Okokugqibela, umatshini uxhwila i ucingo kwaye iphakamisa i-capillary, yaphula i ucingo kwi-heel ye I-Bond yesibini kwaye ilungisa i-efo ukuba ibhola entsha elandelayo i-wire ye-wire.

Yintoni eyenza i-Ultrasonic Wedge ye-Ultrasonic ye-Wordge yahlukile?

Wedge BondIng, okanye ngaphezulu okukhethekileyo we-Wedge-Wedge Wowge, yindawo eyahlukileyo kodwa ibalulekile I-Wire Sire Sport Inkqubo. Obu buchule yindlela yokuhamba I-Aluminium Wire Bond kwaye ihlala yenziwe ubushushu begumbi, sixhomekeke kuphela amandla e-ultrasonic kunye nokunyanzelwa UKWENZIWA KWESICWANGCISO. Ikwayindlela esetyenzisiweyo I-ribbon bond.

Kule nkqubo, i ucingo yondliwe phantsi kweflethi Isixhobo sokuBonelela Ibizwa ngokuba yi-Wedge. Esi sixhobo sihla, kucinezelwa ucingo ngokuchasene nowokuqala I-Bond pad, kwaye uyasebenza amandla e-ultrasonic ukwenza okokuqala Wedge Bond. Isixhobo emva koko sikhuphuka kwaye sihamba kwindawo yesibini, senza iprofayile esezantsi, imfutshane ucingo loop kunokuba iqhelekile Ibhola yebhola ye-wire. Okwesibini I-Bond pad, le nkqubo iphindaphindwayo ukuba yenze I-Bond yesibini. Kuba zombini okokuqala kunye I-Bond yesibini Ngaba umtshato wenziwe, obu buchule bubonelela ngokusebenza okuphezulu kwizicelo eziphezulu-free kwaye kuvumela i-pitch entle kakhulu (esondele kakhulu) boleza. Inzima I-Aluminium Wire Bond Kuba izixhobo zamandla zixhomekeke kuphela kwi Wedge Bond Inkqubo yokwenza i-gooust iqhina.

Yeyiphi i-cire cire ilunge ngakumbi kwisicelo sam?

I Ukukhetha ucingo sesinye sezigqibo ezibaluleke kakhulu kwi i-wire ye-wire inkqubo. Ezintathu eziphambili izixhobo ezisetyenzisiweyo yigolide, ubhedu, kunye ne-aluminium. Nganye Bound ineseti eyodwa yepropathi eyenza ilungele okwahlukileyo Izicelo eziBondelayo.

• I-wire yegolide (AU): Umgangatho wokuqala we I-wire boire isebenzisa igolide. Ingaphumi kakhulu kwi-oxidation, esenza kube lula iqhina kwaye inokuthenjwa kakhulu. I-Bound yegolide ngqo. Ukuthamba kwayo kuthintela ukonakaliswa kukonakala I-Semiconductor subsare. Ubuyisela umva I-wire yegolide yindleko zayo eziphezulu. I-thermosonic bond ngumgangatho we iqhina legolide.
• I-woreper cire (CU): Ucingo lobhedu iye yaba yinto ethandwayo yegolide ngenxa yeendleko zayo ezisezantsi kwaye ziphezulu Umbane kunye ne-thermal ukuqhubela phambili. Nangona kunjalo, i-copper axidid ngokulula, eyenza i Inkqubo yeBod Ucelomngeni ngakumbi kwaye ufuna i-InErt Andmosphere kwi umnikeli. Ubunzima bayo bufuna ukuqina I-rameter ye-rameters Ukuthintela ukonakala kwe-chip.
• I-aluminium wire (Al): I-aluminium wire kukuthamba Izixhobo ze-cire kwaye ilungele I-Ultrasonic Bonding. Kulungile ukudala izinzile iqhina kubushushu begumbi. Inzima I-Aluminium Bound wire ngumgangatho wecandelo le-elektroniki ze-elektroniki kunye nezicelo zemoto ngenxa yokuthembeka kwayo kunye nokukwazi ukwenza amandla, aqine iqhina. Sibona uninzi lwabathengi lutshintshela kwi I-Aluminum ePhezulu yeAluminum ye-Bire ngentsebenzo yayo engaguqukiyo.

I-wire diameter kunye ne-ribbon boing faint faint?

Uhlobo lomzimba lwe uqhagamshelo lwe-Umjikelo ucingo okanye iribbon eflethi-ikwadlala indima enkulu. Ukukhetha kuxhomekeke kwiimfuno zombane zesicelo.

Iidayimitha zeWire inokuhlelwa ngokubanzi ngokwamaqela amabini. Ucingo olucekeceke I-Bound ihlala isebenzisa ucingo Iidayimitha zisusela kwi-15 ukuya kwi-75 microns (μm). Lo ngumgangatho womqondiso uqhagamshelo lwe Kwinqanaba I-Semiconductor Iiphakheji, idibanisa i-chip Inzima ucingo I-Bonding Sebenzisa Iidayimitha zeWire ukusuka kwi-100 ukuya kwi-500 μm. Lowomeleleyo ucingo isetyenziswa kwizixhobo zamandla kunye neemodyuli zemoto ukujongana nemijikelezo ephezulu. Ikhethekileyo I-Aluminium ye-aluminium ye-aluminium ziyafuneka kule nkqubo.

I-ribbon bond yenye indlela enzima ucingo I-Bound. Endaweni yomjikelo ucingo, isebenzisa iribhothi ethe tyaba, i-ribboular i-aluminium okanye igolide. I-ribbons inomyinge wendawo ephezulu yendawo ephezulu yendawo, enobuchule kwizicelo eziphezulu zokusetyenziswa komhlaba (ukunciphisa ukusebenza kwesikhumba) kunye nezicelo zombane) kunye nezicelo zombane apho i-special speipation isebenza khona kwaye i-Insoctrication ye-SURPY kunye ne-Insoctrication ifuneka. I Inkqubo yeBod I-ribbon ifana ne-Wedge iqhina.

Zeziphi izinto eziphambili zefuthe kumandla kunye nokuthembeka?

Injineli yongamela umgca wokuvelisa, ukufezekisa okuphezulu amandla eBondo kwaye ngokungaguqukiyo I-Bround Veed yeyona njongo iphambili. Impumelelo ye i-wire ye-wire ayinangqondo; sisiphumo sokulawula ngenyameko iseti I-rameter ye-rameters kunye nezinto eziguquguqukayo.

1. I-parameter ye-rameter: "Iiparamitha ezinkulu" ezintathu zinamandla (kunzima kangakanani ulutho lwakho), Amandla e-ultrasonic . Ezi kufuneka zidweliswe ngokugqibeleleyo ucingo kwaye I-Bond pad indibaniselwano.
2. Umgangatho weBod Pad: Umphezulu we I-Bond pad Kufuneka icoceke, ingenaziintsizi kunye nongcoliseko, kwaye ube ne-metallgergy elungileyo kunye nobungqingqwa. Ilungisiwe kakuhle I-Bond pad sisizathu esikhokelayo iqhina ukusilela.
3. Imeko yesixhobo sokuBopha: I-capillary okanye i-wedge kuphela kwento echukumisa i i-wire ye-wire. Ezi zixhobo zinokuchasana nokuchaneka okuphezulu kwexesha. Isixhobo esinxilisayo okanye esiqhekekileyo siya kuvelisa iibhondi ezibuthathaka okanye ezingahambelaniyo. Kungenxa yoko le nto senza impumelelo I-Wedge-eyenziwe ngesiko le-Wedge yenziwe kwizinto ezinzima ze-ultra ukuqinisekisa ukuba ixesha elide lokuphila kunye nokuthenjwa okungakumbi iqhina.
4. Umgangatho wocingo: I-Boing ucingo Iyona kufuneka ibe yeyemgangatho uphakamileyo, onobubanzi obungaguqukiyo, ubunyulu, kunye neepropathi zoomatshini. Naluphi na umahluko kwi ucingo inokuphazamisa yonke Inkqubo yeBod.

Inayiphi indima i-wire yocingo yale mihla kule nkqubo?

Yale mihla umnikeli sisiqwengana sezixhobo zerobhothi ezitshintshileyo I-wire bond ukusuka kwi-ART yeNcwadi kwiSayensi echanekileyo, ezenzekelayo. Imeko ye-ofisi umnikeli inoxanduva lokuphula i Inkqubo yeBod ngesantya esimangalisayo kunye nokuphindaphinda.

Aba boomatshini bahlanganisa itekhnoloji yeqhosha eliphambili. Iinkqubo zoMbono weZigqibo eziPhezulu zivuma ngokuzenzekelayo I-Bond pad Iindawo kwaye unike ingxelo kwinkqubo yokulawula intshukumo. Isoftware ephezulu ivumela iinjineli ziye kuluhlu oluntsonkothileyo kwaye zichanekile ucingo loop Iimilo zikuphephe iifutshane kwaye zinyuse ingqibelelo yomqondiso. Eyona nto ibaluleke kakhulu, yale mihla amakhoboka eWire Nika inkqubo yexesha lokwenyani kunye nokuloga kwedatha. Banokufumana isiphoso iqhina Njengoko kuyenzeka kwaye kuyayiyeka le nkqubo, ukuthintela iiyunithi ezinesiphene ekuhambeni komgca. Eli nqanaba le-automation nolawulo libalulekile kumthombo ophezulu we-elektroniki yanamhlanje kwaye kuphela kwendlela yokufezekisa amanqanaba emigangatho efunekayo.

Isetyenziswe phi i-wire iindlela zokubonisa?

Ngelixa i-wire ye-wire yeyona nto ihambelana nayo I-semiconductor chips, isicelo sayo sidlulela ngaphaya kokupakisha ngokwesiko. Ukuguquguquka kunye nokuthembeka kwe I-wire bond the theire teknologies Ubenze ukuba bangabinakho kwezinye iindawo zokwenza i-elektroniki.

• Amandla e-elektroniki: I-Igbts, Mosfets, kunye nezinye izixhobo zombane zixhomekeke kwinzima i-aluminium wire kwaye I-ribbon bond ukuphatha imijelo ephezulu kunye nokutshisa ngokufanelekileyo ubushushu.
• I-AKHRAMOTICICICICICICICICICICS: I-wire wires kwi-Automotive ixhaphake, isetyenziswe kwiinzwa, iiyunithi zolawulo (i-ECUS), kunye neenkqubo zokukhanyisa apho ukuthembeka kweqondo lobushushu obukhohlakeleyo kunye neemeko zokuhamba ngokungakhathali.
• Ukuvelisa i-PCB: I-wire bond isetyenziselwa ukuqhagamshela i-fare ifa ngqo kwi I-PCB .
• I-RF kunye nezixhobo ze-microwave: Ulawulo oluhle ngaphezulu ucingo I-Geometry yenza iqhina legolideIng kunye I-ribbon bond Ilungele izicelo eziphezulu zokusebenza apho ukungqinelana okubonakalayo kubalulekile.
• Iimodyuli ze-LED: I-wire bond Yindlela esemgangathweni yokuqhagamshela i-TIT encinci ye-LED ifa kwiPhakathi yePhepha, ifumaneka kuyo yonke into evela kwizikrini zefowuni ukuya kwisibane senkundla.

Singayiqinisekisa njani inkqubo yebhondi ye-yenveniven kwimveliso?

Ukufezekisa isivuno esifanelekileyo kumthamo ophezulu I-wire bond Ukusebenza ngumceli mngeni opheleleyo. Ayisiyonto ilungileyo umnikeli okanye eyona ilungileyo ucingo; Imalunga nokwenza inkqubo yonke. Njengomvelisi we I-Precinage-Neener, siyayibona yonke imihla.

Impumelelo ixhomekeke kwiintsika ezintathu. Okokuqala usebenzisa ezona zixhobo ziphezulu eziphezulu, ukusuka kwi I-Semiconductor i-wafer kunye I-Bond pad Ukubeka kwi-boled ucingo ngokwayo. Okwesibini kukusebenzisa izixhobo ezichanekileyo kunye nokugcinwa kakuhle umnikeli Iququzelwe kunye I-rameter ye-rameters. Okwesithathu, kwaye intsika ibaluleke kakhulu, intsika iluncedo olunzulu lwenkqubo. Oku kuthetha ukuba neenjineli kunye neengcali eziqondayo i-physics ye iqhina, Ngubani na onokulungisa iingxaki ngokuphumelelayo, kwaye osebenza nabathengisi babo njengamaqabane. Impumelelo i-wire ye-wire Isiphumo sobudlelwane be-syliotic phakathi komatshini, izixhobo, kwaye ingcali iqhuba inkqubo.

Iqhosha lezitshixo

I i-wire ye-wire licandelo elincinci kodwa elinamandla, iqhawe elingangcungcuthekanga lehlabathi le-elektroniki. Ukulungiselela itekhnoloji kubalulekile kuyo nayiphi na injineli enzulu malunga nokuthembeka. Nazi ezona zinto zibalulekileyo ekufuneka uzikhumbule:

• Iindlela ezimbini eziphambili: Umzi mveliso uxhomekeke kwi-tipript ezimbini Iindlela zokubonisa: i-thermosonic Ibhondi yebholaIng (ngokukhawuleza, bhetyebhetye, isebenzisa igolide / yobhedu) kunye ne-ultrasonic Wedge BondIng (ichanekile, iprofayile ephantsi, isebenzisa ialuminium).
• Imicimbi yezinto ezibonakalayo: Ukhetho lwe Izixhobo ze-cire-Orver, ubhedu, okanye i-aluminium-sisigqibo esibalulekileyo esekwe kwiindleko, ukuqhubela phambili, kwaye iimfuno ezithile ze Inkqubo yeBod.
• Yinkqubo: Impumelelo i-wire ye-wire ayisiyo malunga ne ucingo okanye umatshini. Yinto enobunzima phakathi kwe I-rameter ye-rameters, I-Bond pad Umgangatho, imeko yezixhobo, kunye nobuchule bomsebenzi.
• Ngaphandle kwe-chip: I-wire bond yindawo yokutshintsha uqhagamshelo lwe Itekhnoloji isetyenziselwa kakhulu kwiimoto, amandla e-elektroniki, I-PCBukuvelisa, kunye nokwenziwa kwe-LED.
• I-Pict ibaluleke kakhulu: Yonke I-Wire Sire Sport Inkqubo, Ukusuka kwibhola kulawulo lwe-LOOP, ngumdlalo wee-microns kunye milles, efuna olona nqanaba liphezulu lokuchaneka koomatshini nakwizitrato.