Buku la Engineer's Wire Bond Interconnection: Mastering Modern Wire Bonding Technologies

Monga mainjiniya ndi woyambitsa wa Dongxin Electronic Technology, masiku anga ali odzaza ndi zozama zaukadaulo. Nthawi zambiri ndimalankhula ndi akatswiri opanga zinthu ngati a Marcus ku Germany, anthu omwe nkhawa yawo yayikulu si mtengo wa chinthu chimodzi, koma kukhudzidwa kwa madola mamiliyoni ambiri a kuyimitsidwa kwa mzere wopanga chifukwa cha vuto losawoneka bwino. kulumikizana. Amamvetsetsa kuti kudalirika kwa zovuta semiconductor chipangizo kapena module yamagalimoto yamphamvu kwambiri nthawi zambiri imatsikira ku umphumphu wa tsitsi limodzi, lopyapyala waya. Bukuli ndi la iwo. Si kabuku ka malonda; ndikufufuza mozama kwa waya chomangira ndi otsutsa ukadaulo wolumikizira waya zomwe zimapanga msana wamakono opanga zamagetsi. Tidzasanthula sayansi kumbuyo mgwirizano, yerekezerani njira zosiyanasiyana, ndikukambirana zomwe zimapangitsa kuti zikhale zolimba komanso zobwerezabwereza ndondomeko ya mgwirizano.

Kodi Njira Yopangira Mawaya Ndi Chiyani Kwenikweni?

M'malo mwake, kulumikiza waya ndi njira za kupanga a kulumikiza magetsi pakati pa mfundo ziwiri, nthawi zambiri a semiconductor chip ndi kuyika kwake (bond pansi), kapena pakati pa chip ndi a PCB. Ndizogwiritsidwa ntchito kwambiri komanso zotsika mtengo kulumikizana tekinoloje, yomwe imayang'anira mabiliyoni ambiri olumikizana omwe amapangidwa chaka chilichonse. Mosiyana ndi soldering, yomwe imasungunula zinthu zodzaza, kulumikiza waya kumaphatikizapo dziko lolimba kuwotcherera ndondomeko. Izi zikutanthauza mgwirizano imapangidwa popanda kusungunuka waya kapena bond pansi.

Cholinga ndi kupanga amphamvu, odalirika mgwirizano wa metallurgical-chowotcherera chenicheni pamlingo wa atomiki-chomwe chimapereka khola zamagetsi ndi makina kulumikizana. Izi zimatheka pogwiritsa ntchito kuphatikiza mphamvu, kutentha, ndi/kapena ultrasonic mphamvu kusindikiza bwino kwambiri waya motsutsana ndi gawo lapansi. Zotsatira zake waya chomangira amapanga wathunthu magetsi dera, kulola ndi chipangizo cha semiconductor kugwirizana ndi dziko lakunja. Ubwino wa single iyi mgwirizano ndizofunikira kwambiri pakugwira ntchito kwa chipangizocho komanso moyo wautali.

Kodi Mitundu Ikuluikulu Ya Njira Zopangira Mawaya Ndi Chiyani?

Pomwe cholinga chopanga a waya chomangira ndizofanana nthawi zonse, pali ziwiri zoyambirira njira zolumikizirana amagwiritsidwa ntchito m'makampani: kugwirizanitsa mpira ndi kugwirizanitsa mphesa. Kusankha pakati pawo kumadalira pa waya zakuthupi, ntchito, mtengo, ndi zofunikira zenizeni za geometric. Kwa injiniya, kumvetsetsa ma nuances a aliyense kugwirizana njira ndizofunikira pakukhathamiritsa kwadongosolo.

Izi mitundu iwiri ya waya njira zolumikizirana zimalamulira semiconductor phukusi makampani, ndipo aliyense ali ndi gulu losiyana la maubwino omwe amawapangitsa kukhala okondedwa njira yolumikizira waya kwa mapulogalamu osiyanasiyana.

Kodi Thermosonic Ball Bond Process Imagwira Ntchito Motani?

The njira yolumikizira mpira ndi ambiri njira yolumikizira waya, yamtengo wapatali chifukwa cha liwiro lake komanso kusinthasintha. Pafupifupi amangogwiritsa ntchito waya wagolide kapena waya wamkuwa. Njirayi imatchedwa mgwirizano wa thermosonic chifukwa chimaphatikiza mphamvu yamafuta (kutentha), mphamvu, ndi ultrasonic mphamvu.

Tsatane-tsatane ndondomeko ya mgwirizano ndi chodabwitsa cha uinjiniya wolondola:

1. Kupanga Mpira: Njirayi imayamba ndi waya kudyetsedwa kudzera mu chida cha ceramic chopanda kanthu chotchedwa capillary. Wand ya "electronic flame-off" (EFO) imayatsa moto wamagetsi kwambiri kumapeto kwa waya, kuusungunula ndi kulola kuti kugwedezeka kwa pamwamba kukhale kozungulira koyenera, kapena kuti mpira.
2. Bond Yoyamba: Capillary imatsika mpaka kutentha bond pansi (nthawi zambiri 125-150 ° C). Imagwiritsa ntchito mphamvu yeniyeni, kukanikiza mpira pa pad ndikuyika nthawi imodzi ultrasonic mphamvu. Kuphatikiza kutentha, mphamvu, ndi kugwedezeka uku kumapanga mgwirizano woyamba, mpira wamphamvu mgwirizano.
3. Kupanga Loop: The waya bonder kenako imasuntha capillary kupita ku malo a mgwirizano wachiwiri (mwachitsanzo, chala chotsogolera), kupanga chowerengera waya lupu munjira. Maonekedwe a izi waya loop ndi yofunika kwambiri pakuchita komanso kupewa zazifupi.
4. Second Bond: Pamalo achiwiri, chida chimakanikiza waya motsutsana pamwamba ndipo ikugwiritsanso ntchito kuphulika kwina kwa ultrasonic mphamvu kupanga "kusoka" kapena mgwirizano wa wedge.
5. Kuchotsa Wire: Pamapeto pake, makinawo amawombera waya ndikukweza capillary, kuswa waya pa chidendene cha mgwirizano wachiwiri ndikukonzekera EFO kupanga mpira watsopano wotsatira waya chomangira.

Kodi Njira ya Ultrasonic Wedge Bond ndi chiyani?

Mgwirizano wa Wedgeing, kapena makamaka wedge-wedge bonding, ndi yosiyana koma yofunikanso chimodzimodzi njira yolumikizira waya. Njira iyi ndiyo njira yopititsira patsogolo kulumikiza waya wa aluminiyamu ndipo nthawi zambiri amachitidwa pa kutentha kwa chipinda, kudalira kokha ultrasonic mphamvu ndi kukakamiza kwa kupanga ma bond. Ndiwonso njira yoyamba yomwe imagwiritsidwa ntchito kugwirizana kwa riboni.

Munjira iyi, a waya amadyetsedwa pansi pa lathyathyathya-pansi chida cholumikizira wotchedwa wedge. Chidacho chimatsika, kukanikiza waya motsutsana ndi woyamba bond pansi, ndipo ikugwira ntchito ultrasonic mphamvu kupanga woyamba mgwirizano wa wedge. Chidacho chimakwera ndikusunthira kumalo achiwiri, ndikupanga mawonekedwe otsika, ofupikitsa waya lupu kuposa momwe zimakhalira ndi kugwirizana kwa mpira. Pachiwiri bond pansi, ndondomekoyi imabwerezedwa kuti ipange mgwirizano wachiwiri. Chifukwa choyamba komanso mgwirizano wachiwiri ndi zomangika, njira iyi imapereka magwiridwe antchito apamwamba kwambiri pamapulogalamu apamwamba kwambiri ndipo imalola kumveketsa bwino kwambiri (motalikirana kwambiri) kugwirizana. Zolemera kulumikiza waya wa aluminiyamu zipangizo mphamvu komanso amadalira pa mgwirizano wa wedge ndondomeko kupanga cholimba mgwirizano.

Ndi Waya Waya Wotani Amene Ndibwino Kuti Ndigwiritse Ntchito?

The kusankha kwa waya ndi chimodzi mwa zisudzo zofunika kwambiri pankhaniyi waya chomangira ndondomeko. Zoyamba zitatu zipangizo ntchito ndi golide, mkuwa, ndi aluminiyamu. Aliyense zomangira zakuthupi ili ndi zida zapadera zomwe zimapangitsa kuti zikhale zoyenera zosiyanasiyana mapulogalamu ogwirizana.

• Waya Wagolide (Au): Muyezo woyambirira wa kulumikiza waya kumagwiritsa ntchito golide. Imalimbana kwambiri ndi okosijeni, kupangitsa kuti ikhale yosavuta mgwirizano ndi odalirika kwambiri. Kugwirizana kwa golide ndi zowongoka. Kufewa kwake kumalepheretsanso kuwonongeka kwa tcheru semiconductor gawo lapansi. The drawback waukulu wa waya wagolide ndi mtengo wake wokwera. Kugwirizana kwa Thermosonic ndi muyezo wa a golide chomangira.
• Waya Wamkuwa (Cu): Waya wamkuwa wakhala wotchuka m'malo mwa golide chifukwa cha mtengo wake wotsika kwambiri komanso wapamwamba magetsi ndi matenthedwe conductivity. Komabe, mkuwa umatulutsa okosijeni mosavuta, zomwe zimapangitsa ndondomeko ya mgwirizano zovuta kwambiri ndipo zimafuna mpweya wokhazikika mu waya bonder. Kuuma kwake kumafunanso kulimba kugwirizana magawo kupewa kuwonongeka kwa chip.
• Waya wa Aluminium (Al): Aluminium waya ndi chofewa kwambiri waya zakuthupi ndipo ndi yabwino kwa ultrasonic mgwirizano. Ndi yabwino kwambiri popanga khola mgwirizano kutentha kwapakati. Zolemera aluminiyamu chomangira waya ndiye mulingo wamakampani pamagetsi amagetsi ndi ntchito zamagalimoto chifukwa chodalirika komanso kuthekera kopanga zida zolimba, zolimba. mgwirizano. Tikuwona makasitomala ambiri akusintha waya wokwera kwambiri wa aluminiyumu wolumikizira chifukwa cha machitidwe ake osasinthasintha.

Kodi Ma Wire Diameters ndi Ribbon Bonding Amafananiza Bwanji?

The thupi mawonekedwe a kulumikizana- kaya ndi kuzungulira waya kapena riboni lathyathyathya - limagwiranso ntchito yayikulu. Kusankha kumadalira zofunikira zamagetsi zomwe zimagwiritsidwa ntchito.

Ma diameter a waya akhoza kugawidwa m'magulu awiri. Waya woonda kugwirizana kawirikawiri ntchito waya okhala ndi mainchesi kuyambira 15 mpaka 75 microns (µm). Uwu ndiye muyezo wa chizindikiro kulumikizana mu standard semiconductor phukusi, kulumikiza chip I/O ku leadframe. Zolemera waya kugwiritsa ntchito mgwirizano waya diameters kuchokera 100 mpaka 500 μm. Izi zolimba waya amagwiritsidwa ntchito pazida zamagetsi ndi ma module amagalimoto kuti azigwira mafunde apamwamba. Zapadera zitsulo zolemera za aluminiyamu zofunika pa ndondomekoyi.

Kugwirizana kwa riboni ndi njira ina yolemetsa waya kugwirizana. M'malo mozungulira waya, amagwiritsa ntchito riboni yathyathyathya, yamakona anayi yopangidwa ndi aluminiyamu kapena golide. Ma riboni ali ndi chiŵerengero chapamwamba chapamwamba ndi chiwerengero cha voliyumu, chomwe chiri chopindulitsa pakugwiritsa ntchito pafupipafupi (kuchepetsa zotsatira za khungu) komanso kugwiritsa ntchito mphamvu komwe kumafunika kutentha kwabwino ndi kutsika kwapansi. The ndondomeko ya mgwirizano pakuti riboni ndilofanana ndi mphero mgwirizano.

Ndi Zinthu Ziti Zomwe Zimakhudza Kulimba kwa Bondi ndi Kudalirika?

Kwa mainjiniya omwe amayang'anira mzere wopanga, kukwaniritsa apamwamba mphamvu ya mgwirizano ndi zosasinthasintha kugwirizana zokolola ndiye cholinga chomaliza. Kupambana kwa a waya chomangira sichinangochitika mwangozi; ndi zotsatira za kuyang'anira mosamala gulu la otsutsa kugwirizana magawo ndi zosintha.

1. Zolinga za Bonding: Magawo "aakulu atatu" ndi Mphamvu (momwe chida chikanikizira mwamphamvu), Akupanga Mphamvu (kuchuluka ndi nthawi yokolopa), ndi Kutentha (kwa thermosonic bonding). Izi ziyenera kukhazikitsidwa bwino kuti zitsimikizidwe waya ndi bond pansi kuphatikiza.
2. Ubwino wa Bond Pad: Pamwamba pa bond pansi ziyenera kukhala zoyera, zopanda ma oxides ndi zowononga, komanso kukhala ndi zitsulo ndi makulidwe oyenera. A bwino kukonzekera bond pansi ndi chifukwa chachikulu cha mgwirizano zolephera.
3. Momwe Chida Chothandizira: Capillary kapena wedge ndi chinthu chokhacho chomwe chimakhudza waya chomangira. Zida izi ndizomwe zimagwiritsidwa ntchito moyenera zomwe zimatha pakapita nthawi. Chida chowonongeka kapena chosweka chidzatulutsa zomangira zofooka kapena zosagwirizana. Ndicho chifukwa chake timakhazikika pakupanga zida zomangira wedge zopangidwa mwamakonda zopangidwa kuchokera kuzinthu zolimba kwambiri kuti zitsimikizire moyo wautali komanso wodalirika mgwirizano.
4. Ubwino Wawaya: Kulumikizana waya Lokha liyenera kukhala lapamwamba kwambiri, lokhala ndi m'mimba mwake, chiyero, ndi machitidwe amakina. Kusiyana kulikonse mu waya akhoza kusokoneza zonse ndondomeko ya mgwirizano.

Kodi Wopanga Waya Wamakono Amagwira Ntchito Yanji Pantchitoyi?

Zamakono waya bonder ndi chida chamakono cha robotic chomwe chasintha kugwirizana kwa waya kuchokera ku luso lamanja kupita ku sayansi yolondola, yodzipangira okha. Wotsogola waya bonder ali ndi udindo wochita ndondomeko ya mgwirizano ndi liwiro lodabwitsa komanso kubwerezabwereza.

Makinawa amaphatikiza matekinoloje angapo ofunikira. High-kusamvana masomphenya machitidwe basi kuzindikira bond pansi malo ndikupereka ndemanga ku kayendetsedwe ka kayendetsedwe ka kayendetsedwe kake. Mapulogalamu apamwamba amalola mainjiniya kupanga mapulogalamu ovuta komanso olondola waya lupu mawonekedwe kuti apewe zazifupi komanso kukhathamiritsa kukhulupirika kwa chizindikiro. Chofunika kwambiri, zamakono waya bonders perekani nthawi yeniyeni yowunikira ndondomeko ndi kudula deta. Amatha kuzindikira cholakwika mgwirizano momwe zimachitikira ndikuyimitsa njirayo, kuteteza mayunitsi olakwika kuti asasunthike pamzere. Mulingo wodziyimira pawokha ndi wowongolera ndi wofunikira pakupangira zida zamakono zamakono zamakono ndipo ndiyo njira yokhayo yokwaniritsira magawo ofunikira pamiyoyo iliyonse.

Kodi Njira Zinanso Zopangira Mawaya Amagwiritsidwa Ntchito?

Pamene a waya chomangira odziwika kwambiri ndi semiconductor chips, kugwiritsa ntchito kwake kumapitilira kupitilira muyeso wamba wa IC. Kusinthasintha ndi kudalirika kwa ukadaulo wolumikizira waya zawapanga kukhala ofunikira m'magawo ena ambiri opanga zamagetsi.

• Zamagetsi Zamagetsi: Ma IGBT, MOSFET, ndi zida zina zamagetsi zimadalira zolemetsa waya wa aluminiyamu ndi kugwirizana kwa riboni kuthana ndi mafunde apamwamba ndikuchotsa bwino kutentha.
• Zamagetsi Zagalimoto: Kulumikizana kwa waya pamagalimoto ndizofala, zomwe zimagwiritsidwa ntchito mu masensa, ma unit control (ECUs), ndi machitidwe owunikira kumene kudalirika pansi pa kutentha kwakukulu ndi kugwedezeka sikungatheke.
• Kupanga kwa PCB: Kulumikiza waya amagwiritsidwa ntchito kulumikiza bare die molunjika ku a PCB (Chip-on-Board), kuchotsa kufunikira kwa kulongedza kwakukulu ndikupangitsa kuti tipangidwe ting'onoting'ono tazinthu zophatikizika.
• Zida za RF ndi Microwave: Kuwongolera bwino waya geometry amapanga golide chomangiraing ndi kugwirizana kwa riboni yabwino pamapulogalamu apamwamba kwambiri pomwe kufananitsa kwa impedance ndikofunikira.
• Ma module a LED: Kulumikiza waya ndiye njira yokhazikika yolumikizira kagawo kakang'ono ka LED kugawo la phukusi, lomwe limapezeka m'chilichonse kuyambira pazithunzi zamafoni mpaka kuyatsa kwabwaloli.

Kodi Tingatsimikize Bwanji Njira Yama Bond Apamwamba Popanga Zopanga?

Kupeza zokolola zapafupi kwambiri pamlingo wapamwamba kugwirizana kwa waya ntchito ndi vuto lonse. Sikuti kukhala ndi zabwino koposa waya bonder kapena zabwino kwambiri waya; ndi za kukhathamiritsa dongosolo lonse. Monga wopanga zogwiritsidwa ntchito mwaluso, timaziwona izi tsiku lililonse.

Kupambana kumakhazikika pazipilala zitatu. Choyamba ndikugwiritsa ntchito zida zapamwamba kwambiri, kuchokera ku semiconductor mkate ndi bond pansi kupaka kwa kugwirizana waya yokha. Chachiwiri ndi kugwiritsa ntchito zida zolondola komanso zosamalidwa bwino waya bonder zokonzedwa ndi wokometsedwa kugwirizana magawo. Mzati wachitatu, komanso wofunikira kwambiri, ndi chidziwitso chozama cha njira. Izi zikutanthauza kukhala ndi mainjiniya ndi akatswiri omwe amamvetsetsa physics ya mgwirizano, omwe amatha kuthana ndi zovuta moyenera, komanso omwe amagwira ntchito limodzi ndi othandizira awo ngati othandizana nawo. A wopambana waya chomangira ndi zotsatira za mgwirizano wa symbiotic pakati pa makina, zipangizo, ndi katswiri woyendetsa ndondomekoyi.

Zofunika Kwambiri

The waya chomangira ndi gawo laling'ono koma lamphamvu, ngwazi yosadziwika yadziko lamagetsi. Kudziwa ukadaulo ndikofunikira kwa mainjiniya aliyense wotsimikiza za kudalirika kopanga. Nazi zinthu zofunika kwambiri kukumbukira:

• Njira ziwiri zazikulu: Makampaniwa amadalira magawo awiri oyambirira njira zolumikizira wayamankhwala: thermosonic mgwirizano wa mpiraing (mwachangu, kusinthasintha, amagwiritsa ntchito golide / mkuwa) ndi akupanga mgwirizano wa wedgeing (yolondola, yotsika kwambiri, imagwiritsa ntchito aluminiyamu).
• Zofunika: Kusankha kwa waya zakuthupi- golidi, mkuwa, kapena aluminiyamu - ndi chisankho chofunikira chotengera mtengo, conductivity, ndi zofunika zenizeni za ndondomeko ya mgwirizano.
• Ndi System: A wopambana waya chomangira sikuti ndi za waya kapena makina. Ndizovuta kuyanjana pakati pa kugwirizana magawo, bond pansi khalidwe, chikhalidwe cha zida, ndi ukadaulo wa opareshoni.
• Pamwamba pa Chip: Kulumikiza waya ndi zosunthika kulumikizana ukadaulo wogwiritsidwa ntchito kwambiri pamagalimoto, zamagetsi zamagetsi, PCB, ndi kupanga LED.
• Kulondola ndikofunika kwambiri: Zonse njira yolumikizira waya, kuchokera ku mapangidwe a mpira kupita ku ulamuliro wa loop, ndi masewera a ma microns ndi ma milliseconds, omwe amafuna kulondola kwapamwamba kwambiri kuchokera ku makina onse ndi zogwiritsira ntchito.