Ukungena okujulile ku-wire bond, ukushaya kwenhliziyo kwayo yonke insiza ye-elektroniki

Igama lami nginguKevin, naku-Dongxin Technology, umhlaba wami ujikeleza ngokunemba ngesilinganiso semicroscopic. Ngibe nelungelo lokusebenzisana nonjiniyela njengoMarcus eJalimane - ochwepheshe abaqonda ukuthi ukuthembeka komugqa wokukhiqiza amadola ama-multi amaningi kungangena ebuqothweni be-linye, inwele emnene uwaya. Leli uwaya amafomu a ubudlelwano, ukuxhumana ngogesi nokwenziwe ngomshini kubaluleke kakhulu kangangokuba kunciphise cishe yonke imvelo insizakalo ye-elektroniki. Lona umhlaba we isibopho sentambo. Ubuchwepheshe buyinkimbinkimbi kakhulu kunelula umthengisi, futhi ukwazi kahle kubalulekile kunoma ngubani emkhakheni wethu. Kulesi siqondisi, sizosihlukanisa isibopho sentambo, ukuhlola isayensi, izindlela, kanye nezinto zokwakha ezakha lokhu kuxhumana okubalulekile, ukukunikeza ukuqonda okujulile kwezobuchwepheshe okudingekayo ukuze ubekezelele okwakho Izinqubo Zokubopha.

Iyini inhloso eyisisekelo yokubopha ngocingo kudivayisi ye-elektroniki?

Okuyisisekelo inhloso yokuvunyelwa ngocingo ukwenza Ukuxhumana kukagesi. Ngokuqondile, Ukubopha i-Wire inqubo yokuxhuma umjikelezo ohlanganisiwe we-microscopic, noma xhoza, ekuphaketheni kwayo noma ebhodini lesekethe eliphrintiwe. Leli ubudlelwano yisixhumanisi sokuxhumana esibalulekile. Ngaphandle kwawo, amakhono anamandla okucubungula we xhoza wayezohlala eyedwa futhi engenamsebenzi. Isibopho se-Wire sinikezela Indlela evumelana nezimo, ethembekile, nengabizi kakhulu yokwenza lezi zixhumanisi ezibalulekile. -Nke uwaya isebenza njengebhuloho elincane, liphethe amandla ku xhoza futhi imininingwane iphuma kuyo. Okukodwa, okuyinkimbinkimbi Ingxenye ye-elekthronikhi ingaqukatha amakhulu, noma izinkulungwane, zalawo muntu Izintambo zebhondi.

Le khasi isibopho sentambo ngokwayo ingumbuso oqinile wombuso. Ngokungafani nezinye izindlela ezibandakanya izinto ezincibilikayo, isibopho socingo isebenzisa inhlanganisela yamandla, izinga lokushisa, kanye namandla e-ultrasonic ukudala i-athomu eqondile ubudlelwano phakathi kwe uwaya kanye ne-metal pad ku xhoza (The I-Bond Pad). Lokhu kudala ukuxhumana okunamandla okukhulu. Okuhle ubudlelwano inokuvuka okuhle kakhulu kukagesi namandla okusebenza, ukuqinisekisa insizakalo ye-elektroniki Isebenza ngokuthembekile ngakho yonke impilo yayo. Inethiwekhi eyinkimbinkimbi yalokhu ubudlelwano Ukuxhumeka kwakha umgogodla we-elekthronikhi yanamuhla, kusuka ku-smartphone ephaketheni lakho ezinhlelweni zokulawula ezithuthukile emotweni kagesi. Ikhwalithi ngayinye ubudlelwano Ngcobisa ngqo ukusebenza nokuphila isikhathi eside komkhiqizo wokugcina.

Ukubaluleka kokuhle isibopho sentambo ayikwazi ukweqiwa ngokweqile. Iphutha elilodwa ubudlelwano kungadala ukuthi lonke uhlelo lwehluleke. Ngakho-ke, ukudala okuphelele ubudlelwano Njalo isikhathi umgomo wokugcina. Lokhu kudinga ukuqonda okujulile kwezinto ezihilelekile, i-physics ye Izinqubo Zokubopha, nokulawulwa okuqondile kwemishini. Le khasi uwaya uqobo, I-Bond Pad I-Metallization, kanye okokubopha Amapharamitha wonke kumele wonke asebenze ngokuvumelana. Yingakho isibopho sentambo Iphuzu lokugxila konjiniyela benqubo belwela ukukhiqizwa kwe-zero-def. Konke kuphumelele ubudlelwano kungukuvuselela ukunemba kwezobuchwepheshe.

Ngabe i-wire bond iyehluka kanjani ekuxhumekeni okuthengiswayo?

Ngenkathi zombili a isibopho sentambo kanye a umthengisi Ngokuhlanganyela dala ukuxhumana ngogesi, ziyizinqubo ezihlukile ngokuyisisekelo ezinezicelo ezihlukile. Umehluko omkhulu kakhulu ukuthi isibopho socingo inqubo yombuso oqinile eyakha i-metallurgical eqondile ubudlelwano, kanti i-soldering inqubo esebenzisa impahla ye-filler (umthengisi) ngephuzu eliphansi eliphansi ukujoyina izindawo ezimbili. Cabanga nge isibopho sentambo Njenge-microscopic weld futhi umthengisi njenge-glue yensimbi.

Umthengisi Isebenza ngokuncibilika nokugeleza phakathi kwezinto ezizojoyinwa. Lapho ipholisa, iyaqina, yakha imishini yomibili ubudlelwano kanye nendlela kagesi. Le nqubo ilungele ukuxhuma okukhulu Ingxenye ye-elekthronikhiamabhodi wesifunda. Kodwa-ke, ukushisa okudingekayo umthengisi kungalimaza i-semiconductor ebucayi xhoza. Ngaphezu kwalokho, umthengisi amalunga ajwayele kakhulu futhi anembile kune isibopho sentambo. Awukwazi ukusebenzisa umthengisi Ukwakha izinkulungwane zokuxhunywa microscopic ezidingekayo esimanje xhoza.

Ngokuphambene, a isibopho sentambo yakheka ngaphandle kokuncibilika uwaya noma I-Bond Pad. Amandla e-ultrasonic nengcindezi kubangela ama-athomu we uwaya kanye ne-pad ukuze usebenzise omunye komunye, wakhe isakhiwo esisodwa, esiqhubekayo sensimbi. Leli ukubopha okuqondile Indlela idala okunamandla, okuthembekile ngokwengeziwe, nokuxhumana okuncane kakhulu. Inqubo futhi ishesha kakhulu esikalini esincane. Lapho umthengisi ilungele umhlangano weleveli yeBhodi, The isibopho sentambo ubuchwepheshe obuvelele be xhoza-Level interconconction. A isibopho sentambo kuyinkimbinkimbi ngokwedlulele ngokwengeziwe ubudlelwano ukwedlula a umthengisi ukuxhumana.

Yiziphi izinhlobo ezintathu zezinqubo zokubopha izintambo ezisetshenziswa namuhla?

Emhlabeni weMicroelectronics, kukhona Izinhlobo ezintathu zokubopha ngocingo Lokho kubusa ekwenziweni: isibopho se-thermosonic, isibopho se-ultrasonic, kanye nesibopho se-thermocomepression. Sisinye Indlela Yokubopha Nge-Wire inikeza inhlanganisela eyingqayizivele yokushisa, ingcindezi, namandla okudala okuthembekile ubudlelwano. Ukuqonda lezi amasu wokubopha kubalulekile ekukhetheni inqubo efanelekile yesicelo esithile.

1. Isibopho se-Thermosonic: Lokhu kuvame kakhulu Uhlobo lokubopha ngentambo Kusetshenziswe namuhla, ikakhulukazi Igolide Wire Bonding na- isibopho socingo sethusi. Kuhlanganisa zonke izinto ezintathu: ukushisa, amandla, kanye namandla e-ultrasonic. I-substrate ifudunyezwa emazingeni okushisa alinganiselayo (imvamisa 125-150 ° C), ethambisa izinto zokwakha kancane futhi ibenze bamukele ngokwengeziwe okokubopha. Le khasi Ithuluzi Lokubopha bese ucindezela i- uwaya ungene ku I-Bond Pad ngenkathi usebenzisa ukunyakaza kwe-ultrasonic. Le nhlanganisela ivumela okusheshayo futhi okuthembekile ubudlelwano emazingeni okushisa aphansi nasemabuthweni kune-thermococomepression, ukuvikela ubuthakathaka xhoza.

2. Isibopho se-ultrasonic: Leli Indlela Yokubopha Imvamisa ukubizwa ngesibopho esithi "kubanda" ngoba kuvame ukwenziwa emazingeni okushisa asekamelweni. Ithembela cishe kuphela kumandla e-ultrasonic kanye nengcindezi yokwakha ubudlelwano. Isenzo esivame ukuklabalasa ithuluzi elimelene ne- uwaya Iphula imibuso engaphezulu koxides futhi yakha ukungqubuzana okudingekayo kwi-welve-state weld. Isibopho se-ultrasonic yindlela ejwayelekile ye I-Aluminium Wire Bonding, njengoba i-aluminium ihlala kalula yakha ungqimba olunzima lwe-oxide oludinga ukuchithwa. Ukuntuleka kokushisa kwangaphandle kwenza le nqubo ilungele amadivayisi abucayi bokushisa.

3. Isibopho se-thermocomepression: Lokhu kungokwangempela isibopho socingo inqubo. Ithembele ekushiseni okuphezulu kuphela (ngaphezulu kuka-300 ° C) nengcindezi yokwakha a ubudlelwano. Le khasi uwaya na- I-Bond Pad bafuthelwa iphuzu lapho ama-athomu awo eselula ngokwanele ukuze ahlukanise futhi akha a ubudlelwano lapho icindezelwa ndawonye. Ngenkathi esebenza ngempumelelo, amazinga okushisa aphezulu angalimaza noma anciphise i-semiconductor xhoza. Ngenxa yalokhu, le ndlela ayivamile namuhla kepha isasetshenziswa ezinhlelweni ezithile lapho amandla e-ultrasonic akwazi ukusetshenziswa. Ukuziphendukela kwemvelo kusuka ku-thermocomepression kuya isibopho se-thermosonic kwakuyisinyathelo esikhulu phambili embonini.

Ungakwazi yini imininingwane yenqubo yokubopha isibopho se-chip ne-wire?

Le khasi xhoza na- Inqubo Yokubopha Nge-Wire kuyindlela ezenzakalelayo kakhulu, enezinyathelo eziningi ezenzeka ngaphakathi kwe-posiciated uwaya Bonda. Ake sihlukanise ukulandelana kokujwayelekile I-Thermosonic ibhola bonding umjikelezo, okuvame kakhulu isibopho socingo inqubo.

Okokuqala, xhoza (noma ukufa) kufakwe ngokuphephile e-substrate noma i-leadframe. Lo mhlangano bese ufudunyezwa ekushiseni okuqondiwe. A impela ucingo omncane, imvamisa yegolide noma ithusi, ifakwe ngethuluzi elingamaze libizwa ngokuthi yi-capillary. Kuxoshwe inhlansi kagesi ku ukuphela kocingo, ukuncibilika futhi kwakha indawo ephelele, eyaziwa ngokuthi yibhola lamahhala. Yilapho inqubo iqala khona ngempela.

Ingalo ye-robotic yomshini bese ihambisa i-capillary phansi ku xhoza. Icindezela ibhola lingene ngokuqondile I-Bond Pad ngamandla aqondile. Ngasikhathi sinye, umshini usebenzisa ukuqhuma kwamandla e-ultrasonic. Lokhu kudala isibopho sokuqala, uxhumano oluqinile, olubekiwe. Umshini bese uphakamisa ithuluzi futhi uqala ukunyukela endaweni yesibili yokuxhuma ku-substrate, ukhokha uwaya njengoba kunjalo. Indlela ethatha ngayo amafomu loop ubunjiniyela ngokucophelela ku uwaya. Ekugcineni, ithuluzi licindezela i- uwaya ngokumelene ne-substrate ukwakha Isibopho sesibili ("Stitch" ubudlelwano). I-clamp ibambe uwaya, futhi ithuluzi liqhubekela phezulu, ukuphula uwaya Esithendeni sesibili ubudlelwano futhi ushiye okuncane umsila wentambo Ilungele umjikelezo olandelayo. Konke lokhu Inqubo Yokubopha Nge-Wire, ukusuka isibopho sokuqala ku uwaya Phula, kwenzeka engxenyeni yesibili.

Yiziphi izinto zokwenziwa nezinhlobo zocingo ezisetshenziswayo ku-Wire Bonding?

Ukukhethwa kwe Izinto zokwakha nocingo Isinqumo esibucayi ku Inqubo Yokubopha Nge-Wire. Ukukhetha kuthinta ngqo izindleko, ukusebenza, kanye nokwethenjwa kwe insizakalo ye-elektroniki. Le khasi izintambo zokubopha nge-wire Kufanele ube nokuvuka okuphezulu kagesi, amandla amahle omshini, kanye nokumelana nokugqwala. Okuthathu okuyisisekelo Izinhlobo zocingo isetshenziswe embonini yocingo yigolide, ithusi, ne-aluminium.

• I-FOLD (AU) Wire: Ucingo lwegolide ukukhetha kweprimiyamu. Ithembeke kakhulu ngoba ayisebenzi, iqinisekisa indawo ehlanzekile ephelele ubudlelwano. Ithambile futhi ithambile kakhulu futhi i-ductile, evumela ukuqina ubudlelwano ukuze kwakhiwe ngamandla aphansi kanye nokushisa okuphansi. Lokhu kwenza Igolide Wire Bonding Ilungele ama-chips abuthakathaka, aphezulu aphezulu. Ukubuyela emuva okuyinhloko kokusebenzisa ucingo lwegolide izindleko zayo eziphakeme. Okuhle ubudlelwano nge a ucingo lwegolide kuvame ukuba lula ukufeza.
• Ucingo lweCopper (CU): Ucingo lwethusi kuqhamuke njengenye indlela ephumelelayo yegolide. Ukuvuka kwayo kukagesi nokushisa kungcono kakhulu kunegolide. Noma kunjalo, isibopho socingo sethusi ziveza ezinye izinselelo. Ithusi linzima kunegolide, kanjalo amapharamitha ahlanganisa kumele alawulwa ngokucophelela ukuze agweme ukulimaza xhoza. Iphinde iaxeizes kalula, okungaphazamisa ubudlelwano. Lokhu kudinga okokubopha ukwenziwa emkhathini we-inert. Ngaphandle kwalezi zinselelo, izindleko zalo eziphansi zikwenza kube ukukhetha okuthandwayo.
• I-Aluminium (Al) Wire: I-Aluminium Wire Ingabe i-Workorse yemboni ye-Electronics Power Power. Kuvame ukusetshenziswa hlanganisa isibopho Izicelo. Lapho I-Aluminium Wire uboshwe kwi-aluminium I-Bond Pad ku xhoza, kwakha uhlelo oluthembekile oluthembekile lwe-monallic. Lokhu kugwema ukwakheka kwamakhompiyutha okucaca ngokungenisa angenzeka ngaphakathi I-Gold Wire Bond-Bond Pad Systems, ikakhulukazi emazingeni okushisa aphezulu. A I-Aluminium Wire futhi kubiza kakhulu. Sisebenza ngokukhethekile ekuhlinzekeni ubumsulwa obuphezulu I-Aluminium Wire Emsulwa Kulezi zicelo ezifunwayo.

Kungani ucingo lwegolide luvame kakhulu ezinqubweni zokubopha?

Naphezu kwezindleko zayo eziphakeme, ucingo lwegolide ihlala iyitshe legumbi lokuthembela okuphezulu I-Chip Packing ngezizathu ezimbalwa ezibalulekile. Ukubhebhetheka kwayo ngaphakathi Izinqubo Zokubopha Ingabe iTestamente yayo ebonakalayo ebonakalayo ebonakalayo, eyenza ukwakha okungaguquki futhi okuthembekile ubudlelwano lula ukwedlula kwezinye izinto. Ku-Enjiniyela okunikezwe umsebenzi wokuqinisekisa isivuno esiphezulu nokusebenza kwensiza yesikhathi eside, izinzuzo ze Igolide Wire Bond zivame ukuphoqa.

Inzuzo ebaluleke kakhulu ucingo lwegolide yi-chemenicness yayo. Igolide aligwiki noma alizize ngaphansi kwezimo ezijwayelekile zomoya. Lokhu kusho ubuso be uwaya ihlala i-pristine futhi isilungele okokubopha, ukuqeda ukuguquguquka okukhulu okungadala Ikhwalithi ye-bond empofu nokukhiqiza iziphambeko. Lokhu kuphambene kakhulu ne-Copper, okudinga umkhathi wokuvikela ukuvimba i-oxidation ukuthi ingaphazamisi ubudlelwano. Le khasi ukubopha kwegolide ukumane nje kuthethelelwa ngokwengeziwe.

Ngaphezu kwalokho, ucingo lwegolide i-ductile enkulu futhi ithambile. Lokhu kuvumela okuhle kakhulu ukwakheka kwebhondi nekhwalithi yebhondi emandleni aphansi namazinga okushisa ngesikhathi isibopho se-thermosonic. Ukusebenzisa amandla amancane kunciphisa ubungozi bokuqhekeka noma ukulimaza i-silicon entekenteke xhoza ngaphansi kwe- I-Bond Pad. Ukuthamba kwe ucingo lwegolide Ivumela ukuthi iguquke kalula, ukudala indawo enkulu yokuxhumana, ethembekile ye ubudlelwano. Lapho ukugwema izibopho ze-wire wire kungenzeka Yiba umgomo wokuncishiswa kwezindleko, izicelo ezibucayi kwe-mission lapho ukwehluleka akuyona inketho, ukuthembeka okunikezwa yi Igolide Wire Bond kuvame ukubaluleka ngentengo yeprimiyamu.

Ngabe ukubopha kwe-wedge kuhluke kanjani kwezinye ubuchwepheshe bobuhlobo?

Hlanganisa isibopho kumi phakathi Ubuchwepheshe be-Wire Bonding Ngenxa yethuluzi layo elihlukile, ukugeleza kwenqubo, kanye nezicelo. -Ngafani na- ukubopha ibhola, esebenzisa i-capillary eyindilinga futhi iqala ngebhola ubudlelwano, hlanganisa isibopho isebenzisa a shayaIthuluzi elivunyelwe ukucindezela i- uwaya ngqo ngokumelene nobumbano. Le khasi ucingo lucindezelwe ngqo futhi iklanywe ngamandla e-ultrasonic ukwakha i-stitch-like ubudlelwano. Lo mehluko oyisisekelo uholela ezimisweni eziningana ezihlukile.

Isici esisodwa esingukhiye se hlanganisa isibopho amandla ayo ukudala iphrofayili ephansi kakhulu ubudlelwano. Isiteki esiphumela ubudlelwano ithopha kakhulu kunebhola ubudlelwano, Ukwenza hlanganisa isibopho Ilungele izinhlelo zokusebenza lapho imvume mpo ilinganiselwe. Iphinde ivumele i-pitch enhle kakhulu okokubopha, lapho ama-bond pads ku xhoza zibekwa eduze kakhulu. Le khasi hlanganisa isibopho Inqubo ihlinzeka ngokulawula okuhle kwephrofayela ye-loop ye uwaya, okubaluleke kakhulu kumadivayisi avama kakhulu. Lokhu kunengqondo yingakho thina amathuluzi wonjiniyela afana neyethu Ithuluzi elenziwe ngesibopho se-Wedge ukuhlangabezana nokubekezelelana okuqinile.

Hlanganisa isibopho inqubo evelele ye I-Aluminium Wire Bonding. Isenzo se-Ultrasonic Scrubbing sisebenza kakhulu ekwephuleni ungqimba lwe-oxide oxide on an I-Aluminium Wire. Le nqubo nayo ingasebenzisa ucingo lwegolide (Bodge Wedge Bonding) noma iribhoni, okwenza kube lula kakhulu. Noma kunjalo, hlanganisa isibopho ngokuvamile kancane kunoku ukubopha ibhola Ngoba ithuluzi kumele lihambisane ngakunye ubudlelwano. Ngaphandle kwalokhu, ngamadivayisi anamandla amakhulu kanye nezicelo ezinhle kakhulu, ukwethenjwa kanye nokunemba kwe bond bond Kwenze kube ukukhetha okuphakeme phakathi ukubopha okuhlukile Ubuchwepheshe. Le khasi bodge bonding bond kuyinto i-worworse.

Yini eyakha isibopho "esihle" futhi uyifinyelela kanjani?

"Okuhle" ubudlelwano yinye enomsindo kagesi futhi onamandla kagesi, okwazi ukuhlala impilo yonke ye insizakalo ye-elektroniki. Ngonjiniyela, okuhle ubudlelwano ichazwa ngezindlela ezithile, ezilinganisekayo: zanele Amandla eBond, ukumelana kukagesi okuphansi, kanye nokwakheka okungaguquki, okwenziwe kahle. Ukuthola lokhu kuphelele ubudlelwano umgomo oyinhloko we UKHETHO Inqubo Yokubopha Nge-Wire.

Ngokubona, ibhola elihle ubudlelwano kufanele izungeze ngokuphelele futhi igxile ku I-Bond Pad, ngokuguquguquka okubonakalayo (squash) okubonisa ukuxhumana okuqinile kwensimbi. I-Wedge enhle ubudlelwano kufanele ikhombise umbono ohlukile, ofanayo Ithuluzi Lokubopha. Akufanele kube khona imifantu ku ubudlelwano noma okuzungezile xhoza, no uwaya Ukuphuma ubudlelwano (The intamo yebhondi yebhola noma isithende) kufanele kube mahhala ekunciphiseni ngokweqile noma ekulimaleni. Ubuqotho be i-wire bond-bond pad I-interface ibaluleke kakhulu.

Ukuthola okuhle ubudlelwano kudinga ukulawula okuthembekile ngaphezulu kwe amapharamitha ahlanganisa: Force, amandla e-ultrasonic, isikhathi, kanye nokushisa. Lezi kumele zenzelwe okuthile Izinto zokwakha nocingo kusetshenziswa, kufaka phakathi usayizi we-wire kanye ne-metallization ye I-Bond Pad. Amathuluzi asezingeni eliphakeme awaxoxiswana; ithuluzi eligqokwa noma elingenziwa kahle alikwazi ukukhiqiza okungaguquki ubudlelwano. Ekugcineni, inhlanzeko ibalulekile. Noma yikuphi ukungcola ku xhoza noma uwaya kungavimbela ukufanele ubudlelwano kusuka ekubumbeni. Ukubopha okuthembekile umphumela wenqubo eyenzelwe kahle, izinto eziphakeme, nokuqapha okuqhubekayo. Okunamandla ubudlelwano uthembekile ubudlelwano. Wonke umuntu ubudlelwano izindaba.

Yini ehilelekile ekuhlolweni kwezibopho zocingo ukuze zithembeke?

Ukuqinisekisa Ukwethembeka kwe-Wire Bonder kuyingxenye ebucayi yenqubo yokulawula ikhwalithi ekwenziweni kwe-semiconductor. Ukubukeka okuhle ubudlelwano ayinangqondo uma ingenawo amandla adingekayo. Ngakho-ke, kuqinile Ukuhlolwa kocingo Amabhondi enziwa ukuze aqinisekise Inqubo Yokubopha futhi kuqinisekisa ukusebenza kwesikhathi eside. Izivivinyo ezimbili ezihlukumeza kakhulu yilezi uwaya donsa isivivinyo kanye ubudlelwano ukuhlolwa kwe-shear.

Ukuhlolwa kwentambo ukuhlolwa kwe-quintessential kwanoma yikuphi isibopho sentambo. Kubandakanya ukusebenzisa i-hook encane ukudonsa phezulu ku uwaya E-apex yokhiye wayo kuze kube yilapho uwaya ikhefu noma elinye lamabhondi liphakamisa. Amandla adingekayo ukwenza lokhu kwehluleka kukalwa ngama-grams-force. Le datha iqhathaniswa nokulwa namazinga embonini (njengeMil-Std-883) ukuthola ukuthi Amandla eBond kwamukelekile. Indawo yezelelekalo nayo iqoshwa, ngoba inikeza imininingwane ebalulekile yokuxilonga ngempilo ye isibopho sentambo kanye neyonke Inqubo Yokubopha.

Ukudonsa kwebhondi nokuhlolwa kwe-shear inikeza enye isendlalelo sokuqinisekiswa. A ubudlelwano Ukuhlolwa kwe-Shear kusetshenziselwa ukukala ngokuqondile ukunamathela kwe ubudlelwano ku I-Bond Pad. Ithuluzi livela lisuka ohlangothini liphoqelela ubudlelwano (ibhola ubudlelwano noma wedge ubudlelwano) Kuze kube yilapho kufunga. Amandla adingekayo ukushefa ubudlelwano isilinganiso esiqondile sekhwalithi ye-metallurgical weld. Kokubili I-Wire Bond Donsela futhi i-Shear izivivinyo zivame ukwenziwa ngesampula yokubheka ukuqina kwe Izinqubo Zokubopha. Lokhu njalo Ukuhlolwa kocingo iqinisekisa ukuthi njalo insizakalo ye-elektroniki lokho kushiya ifektri inokuqina futhi ithembekile isibopho sentambo inethiwekhi.

Yiziphi izimbangela ezivamile ukwehluleka kwebhondi yocingo futhi zingagwenywa kanjani?

Ukwehluleka kwebhondi ziyinkinga enkulu ekukhiqizeni ngogesi, ngoba kungaholela ekungasebenzi kahle kwensiza futhi kukhumbule izindleko. Lokhu kwehluleka ngokuvamile kungahle kulandelwa emuva ezindabeni kwenye yezindawo ezintathu: izinto zokwakha, ukulawulwa kwenqubo, noma ukucindezelwa kwangemva kokubopha. Ukuqonda lezi zimbangela zempande yisinyathelo sokuqala sokuvimbela. Ihlulekile isibopho sentambo kuhlulekile ubudlelwano.

Enye yezimbangela ezivame kakhulu ze-abuthakathaka ubudlelwano ukungcola. Noma yikuphi ukwaziswa kwangaphandle ku- I-Bond Pad noma uwaya-Such njengo-oxides, uthuli, noma izinsalela zamakhemikhali - zingasebenza njengesithiyo, ukuvimbela i-metallurgical eqinile ubudlelwano kusuka ekubumbeni. Lokhu kuqokomisa isidingo sezinqubo eziqinile zokuhlanza amagumbi. Enye inkinga enkulu ayifanele amapharamitha ahlanganisa. Amandla amaningi angaqhekeka xhoza, ngenkathi amandla amancane kakhulu noma amandla e-ultrasonic angaholela ekungatheni, noma aphakanyisiwe, ubudlelwano. Iwindi lenqubo lokuhle ubudlelwano kungaba mncane, kudinga ukulinganiswa komshini okuqondile. Yilapho ubuchwepheshe bomhlinzeki bunjani Ubuchwepheshe be-dongxin elektroniki iba yinto ebaluleke kakhulu.

Ukwehluleka nakho kungenzeka ngemuva kwe isibopho sentambo kwenziwa. Amakhompiyutha aphakathi nendawo, ikakhulukazi ngaphakathi I-Gold-aluminium Bond Izinhlelo, zingakhula ngokuhamba kwesikhathi futhi ziholele kwababuthakathaka ubudlelwano. Ukucindezela okwenziwe ngomshini kusuka ezintweni zokufaka zedivayisi ngesikhathi sokuhamba ngebhayisekili esishisayo kungadala ukukhathala ku uwaya, okuholela ekhefu esithendeni se ubudlelwano. Ukugwema lezi Ukwehluleka kwebhondi idinga indlela ephelele: usebenzisa izinto ezisezingeni eliphakeme, elawula ngokucophelela Inqubo Yokubopha, ukuklama ukucindezelwa kwemishini, nokwenza ukuhlola okuqinile kokuthembela. -Nke ubudlelwano ku insizakalo ye-elektroniki kumele kube okuphelele.

Ukuthathwa Key

• I-wire bond ibalulekile: Le khasi isibopho sentambo ukuxhumana okuyisisekelo okuvumela i-semiconductor xhoza ukusebenza ngaphakathi kwe insizakalo ye-elektroniki. Sisinye ubudlelwano isixhumanisi esibalulekile.
• Akufani nomuntu oyedwa: A isibopho sentambo kuyinto eqondile, i-solid-state weld, kanti umthengisi yi-glue yensimbi. Le khasi ubudlelwano iqine kakhulu futhi incane.
• Izinqubo ezintathu ezibalulekile: Izinqubo Zokubopha njenge-thermosonic, i-ultrasonic ne-thermococomepressions isetshenziswa, nge isibopho se-thermosonic Ukuba okuvame kakhulu ukulinganisela kwalo kwejubane nokuphepha kwe xhoza.
• Izindaba ezibonakalayo: Ukukhetha phakathi ucingo lwegolide, ucingo lwethusi, futhi I-Aluminium Wire kuyinto yokuhweba phakathi kwezindleko, ukusebenza, kanye nezidingo ezithile zohlelo lokusebenza. Afanele uwaya ukhiye omuhle ubudlelwano.
• Ikhwalithi iyalinganiswa: Okuhle ubudlelwano iphakeme Amandla eBond kanye nokumelana kukagesi okuphansi. Lokhu kuqinisekiswa ngokuhlolwa okulimazayo okufana uwaya donsa futhi ubudlelwano Ukuhlolwa kwe-Shear.
• Ukwehluleka kuvinjelwe: Kakhulu Ukwehluleka kwebhondi isiqu esingcolisweni, asilungile amapharamitha ahlanganisa, noma ukucindezela kwemishini. Inqubo eqinile nezinto ezisezingeni eliphakeme zingukuvimbela okungcono kakhulu. Umgomo uphelele ubudlelwano, zikhathi zonke.