Zita rangu ndiKevin, uye kuDongxin Electronic tekinoroji, nyika yangu inotenderera nekunyatsojeka pane microscopic chiyero. Ndakave neropafadzo yekushanda neinjiniya seMarcus muGermy-nyanzvi dzinonzwisisa kuti kuwanda kwemamiriyoni emamiriyoni emamiriyoni emamiriyoni kunogona kusvinura waya. Izvi waya mafomu a chisungo. Chishandiso chemagetsi. Ino ndiyo nyika ye Wire Bond. Iyo tekinoroji inoshamisa kwazvo kupfuura nyore mutengesi, uye kujairana kwakakosha kune chero munhu mumunda wedu. Mune iyi gwara, isu tichadzivisa izvo Wire Bond, kuongorora sainzi, nzira idzi, uye zvigadzirwa zvinogadzira idzi zvakakosha kubatana, kukupa iwe neakadzika technical nzwisiso dzinodiwa kuti uve wakakwana wako Bonding maitiro.
Ndeipi chinangwa chakakosha chemaya waya kusungwa muchishandiso chemagetsi?
Iyo yekutanga chinangwa chekusungwa kwemaya waya kuita magetsi ekubatanidza. Zvakananga, Wire Bonding ndiyo maitiro yekubatanidza cirnepic yakabatanidzwa mudunhu, kana chip, kusvika pakutakura kana kune bhodhi redunhu rakadhindwa. Izvi chisungo ndicho chinongedzo chakakosha chekutaurirana. Pasina iyo, iyo Simba rekugadzirisa kugona kwe chip raizoramba riri ndega uye zvisina basa. Wire Boging inopa Iyo inoshanduka, yakavimbika, uye inobudirira nzira yekugadzira iyo inogadzira inokanganisika. Zvese waya zviito seyechidiki bhiriji, vakatakura simba mukati chip uye data kunze kwayo. Imwe, yakaoma Electronic Chikamu inogona kunge iine mazana, kana kunyange zviuru, zvemunhu uyu Bond Wires.
The the Wire Bond pachayo iSimba-State Weld. Kusiyana nedzimwe nzira dzinosanganisira zvekunyungudza zvinhu, Wire Kubatira inoshandisa musanganiswa wesimba, tembiricha, uye ultrasonic simba kugadzira atomic yakananga chisungo pakati pe waya uye simbi pad pane chip (iye Bond Pad). Izvi zvinoumba kubatana kwakasimba kusimba. Zvakanaka chisungo ine magetsi akanaka kwazvo uye musimbe simba, uchivimbisa Chishandiso chemagetsi mabasa anozvipira pamusoro pehupenyu hwayo hwese. Iyo yakaoma network yeizvi chisungo Kubatana kunoumba musana wezvemitambo yemazuva ano zvemagetsi, kubva kune smartphone muhomwe yako kune yepamusoro yekudzora masisitimu mumotokari yemagetsi. Kunaka kweumwe neumwe chisungo zvakananga zvinokanganisa kuita uye kuzere kwechigadzirwa chekupedzisira.
Kukosha kweakanaka Wire Bond haigoni kuve yakakundwa. Imwe chete isina mhosva chisungo inogona kukonzera kuti system yese itadze. Naizvozvo, kugadzira yakakwana chisungo Nguva imwe neimwe ndicho chinangwa chikuru. Izvi zvinoda kunzwisisika kwakadzama kwezvinhu zvinobatanidzwa, iyo fizikisi ye Bonding maitiro, uye chaiko kutonga pamusoro pemishini. The the waya pachayo, Bond Pad metallization, uye iyo kusungwa Paramita dzinofanira kushanda nesimba mukuwirirana. Ndokusaka Wire Bond inzvimbo yekufungidzira yekuita mainjiniya ekuridza zero-yakaremara kugadzira. Zvese zvakabudirira chisungo Itestamende yekunyatsojeka kwehunyanzvi.
Unhu hwe waya hwakasiyana sei nemutengesi kubatana?
Nepo vaviri a Wire Bond uye a mutengesi Joint anogadzira kubatana kwemagetsi, iwo maitiro akasiyana siyana ane masisitimu akasarudzika. Musiyano wakakosha kwazvo ndezvekuti Wire Kubatira Icho chiitiko chakasimba-nyika chinogadzira yakananga metallurgical chisungo, nepo kutengesa iri maitiro anoshandisa iyo filler zvinhu (mutengesi) neyakaderera inonyungudika yekubatanidza nzvimbo mbiri. Funga a Wire Bond se microscopic weld uye mutengesi Sesimbi yesimbi.
Mutengesi inoshanda nekunyungudika uye kuyerera pakati pezvikamu kuti zvibatane. Kana ichitonhora, iyo inosimbisa, ichigadzira zvese michina chisungo uye nzira yemagetsi. Maitiro aya akakodzera kubatanidza yakakura Electronic Chikamus kumatunhu ematunhu. Nekudaro, kupisa kunodiwa mutengesi inogona kukuvadza Semiconductor chip. Uyezve, mutengesi majoini anowanzo kuve akakura uye asina kunyatsojeka kupfuura a Wire Bond. Iwe haugone kushandisa mutengesi Kuti vagadzire zviuru zvemaricoscopic kubatana kunodiwa pane zvazvino chip.
Kusiyana neizvi, a Wire Bond inoumbwa isina kunyungudika waya kana iyo Bond Pad. Iyo Ultrasonic simba uye kumanikidza kukonzera maatomu e waya Uye iyo pad yekusiyana mune imwe, inogadzira imwe, ichiramba simbi chimiro. Izvi Kuronga Direkera Nzira inogadzira yakasimba, yakavimbika yakavimbika, uye zvidiki zvidiki kubatana. Maitiro acho zvakare akakurumidza zvakanyanya pane micro-chiyero. Nepo mutengesi yakakwana yeBhodi-Level Assembly, the Wire Bond ndiye tekinoroji yemubati chip-level Interconnection. A Wire Bond inonyanya kuomarara uye chaiyo chisungo pane a mutengesi kubatana.
Ndeapi matatu matatu emhando dzemabhiza ekurongedza mashandiro anoshandiswa nhasi?
Munyika yeMicroyelectronics, pane Mhando nhatu dzeWire Kubatanidza Iyo inotonga kugadzira: Thermonic kusungwa, ultrasonic bondis, uye thermocompres birning. Imwe neimwe Nzira yeWire Kubatira inopa musanganiswa wakasarudzika wekupisa, kumanikidzwa, uye simba kugadzira yakavimbika chisungo. Kunzwisisa izvi Kubatira maitiro yakakosha pakusarudza iyo yakakodzera maitiro ekushandisa chairo.
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Thermonic Bonding: Izvi ndezve zvakanyanya kujairika Rudzi rweWire Kubatira inoshandiswa nhasi, kunyanya kune goridhe waya kusungwa uye Copper Wire Kubatira. Inosanganisa zvese zvinhu zvitatu: kupisa, simba, uye ultrasonic simba. Iyo substrate inotemwa kune imwe tembiricha ine mwero (kazhinji 125-150 ° C), iyo inojekesa zvinhu zvishoma uye inoita kuti ive inogamuchira kusungwa. The the Bonding Tool Wobva wadzvanya waya pane Bond Pad uchinyorera ultrasonic vibrations. Uku kusanganisa kunobvumira kune yakanyanya kutsanya uye yakavimbika chisungo pakudziya kwepazasi uye masimba pane errmocompes, achidzivirira iyo yakaoma chip.
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Ultrasonic Bonding: Izvi Bonding nzira inowanzonzi "inotonhora" kusungwa nekuti inowanzoitwa pamhepo tembiricha. Iyo inovandudza ingangoita chete pane ultrasonic simba uye kumanikidzwa kugadzira iyo chisungo. Iyo yakakwira-frequency kupwanya chiito chechishandiso chinopesana ne waya inopwanya pasi mhou dzemukati uye dzinogadzira iyo kupokana inodiwa kune yakasimba-nyika weld. Ultrasonic Bonding ndiyo nzira yakajairwa ye Aluminium Wire Kubatira, seAluminium fakences zviri nyore kuumba yakaoma nzombe yehudzo inoda kuti ibudiswe. Iko kushomeka kwekunze kupisa kunoita kuti maitiro aya akakodzera kune tembiricha-inotyisa zvishandiso.
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Thermocompres Bonding: Izvi ndizvo zvekutanga Wire Kubatira maitiro. Zvinovimba chete pakupisa kwakanyanya (anopfuura 300 ° C) uye kumanikidzwa kuumba a chisungo. The the waya uye Bond Pad inopisa kusvika kune imwe nguva iyo maatomu avo anokwana kusiyana uye kuumba a chisungo kana ichimanikidzwa pamwechete. Nepo kushanda, iyo tembiricha yakakwira inogona kukuvadza kana kushatisa iyo semiconductor chip. Nekuda kweizvozvo, iyi nzira haina kujairika nhasi asi ichiri kushandiswa mune zvakanyatso mafaro umo maltrasonic simba harigone kushandiswa. Shanduko kubva kuTrmmocompession ku Thermonic Bonding yaive nhanho huru yekumberi kune indasitiri.
Iwe unogona here kudzora chip uye waya kurongedza maitiro?
The the chip uye Wire Boging Process inonyanya kugadzirwa, yakawanda-nhanho maitiro anoitika mukati mechinguvana waya bonder. Ngatipwanya sei kuteedzana kweimwe Thermonic Ball Bonding kutenderera, zvakanyanya kuwanda Wire Kubatira maitiro.
Kutanga, chip (kana kufa) yakachengetedzwa zvakachengeteka pane substrate kana kutungamira. Gungano iri rinobva rapiswa kune tembiricha yekutandarira. A chaizvo yakaonda waya, kazhinji goridhe kana mhangura, yakashongedzwa kuburikidza nehombodo yehombodo inonzi capillary. Spark yemagetsi inodzingwa kupera kwe waya, ichinyungudutsa uye kugadzira nzvimbo yakakwana, inozivikanwa seyemahara-yemhepo bhora. Apa ndipo panotangira maitiro.
Iyo muchina werobotic ruoko saka inofambisa iyo capillary pasi kune iyo chip. Inomanikidza bhora pane yakatarwa Bond Pad nechisimba chaiko. Panguva imwe chete, mushini unoshandisa kuputika kwesimba rekupedzisira. Izvi zvinogadzira iyo Chekutanga Bond, kubatana kwakasimba, kwakabatana. Muchina wacho unobva wasimudza chishandiso uye unotanga kufamba uchienda kune yechipiri yekubatanidza pfungwa pane substrate, kubhadhara kunze waya sezvazviri. Iyo nzira inotora inoumba chidimbu cheinjini chaicho mu waya. Pakupedzisira, mudziyo unodzvinyirira waya kupokana ne substrate kuti iite Chisungo chechipiri (a "stitch" chisungo). Clamp grips the waya, uye chishandiso chinofamba kumusoro, kutyora waya nechitsitsinho chechipiri chisungo uye kusiya chidiki Wire muswe yakagadzirira kutenderera kunotevera. Izvi zvese Wire Boging Process, kubva ku Chekutanga Bond ku waya Pwanya, zvinoitika muchikamu chechipiri.
Ndezvipi zvinhu uye mhando dze waya dzinoshandiswa mu waya kusungwa?
Kusarudzwa kwe zvigadzirwa uye waya isarudzo yakaoma mu Wire Boging Process. Sarudzo inokanganisa zvakananga mutengo, kuita, uye kuvimbika kwe Chishandiso chemagetsi. The the Wires for wire bonding Inofanirwa kuve nemagetsi akakwirira ekuita, simba rakanaka rekusimba, uye kuramba kuonga. Matatu matatu ekutanga Mhando dzeWire Inoshandiswa mu waya yekubatanidza ndiro ndarama, mhangura, uye aluminium.
- Goridhe (au) waya: Goridhe Wire ndiyo sarudzo yekutanga. Izvo zvakavimbika zvakanyanya nekuti hazvisi oxidize, chengetedza nzvimbo yakachena kuti ive yakakwana chisungo. Izvo zvakare zvakapfava uye ducthile, inobvumira yakasimba chisungo kuumbwa neine simba rakaderera uye tembiricha. Izvi zvinogadzira goridhe waya kusungwa Yakanakira kune yakashata, yakakwira-density machipi. Iyo huru yekudhirowa yekushandisa Goridhe Wire ndiyo mutengo wakakwira. Zvakanaka chisungo ne Goridhe Wire kazhinji zviri nyore kuzadzisa.
- Copper (cu) waya: Copper waya yakabuda semhando inodhura-inoshanda kune goridhe. Magetsi aro uye anodziya maitiro ari nani pane goridhe. Nekudaro, Copper Wire Kubatira inopa mamwe matambudziko. Mhangura yakaomesesa kupfuura goridhe, saka Kuronga paramita inofanira kunyatso kudzorwa kuti udzivise kukuvadza iyo chip. Zvakare iyo oxidaiday zviri nyore, inogona kukanganisa iyo chisungo. Izvi zvinoda izvo kusungwa kuitwa mune inert intermphere. Pasinei nematambudziko aya, mutengo wayo wakaderera unozviita sarudzo yakakurumbira.
- Aluminium (al) waya: Aluminium Wire ndiko kushanda kweshizha remagetsi emagetsi. Izvo zvinowanzo shandiswa mukati Wedge Bhuku zvikumbiro. Kana Aluminium Wire inosungwa kune iyo aluminium Bond Pad pane chip, inogadzira yakavimbika kwazvo mono-metallic system. Izvi zvinodzivirira kuumbwa kweBrittle Intermitallic Compound inogona kuitika mukati Goridhe Wire Bond-Bond Pad Syvel Systems, kunyanya pakupisa kwakanyanya. An Aluminium Wire zvakare mutengo wakanyanya-zvinobudirira. Isu tinosarudzika mukupa zvakakwirira-kuchena yakachena aluminium waya kune izvi zvinodikanwa zvekushandisa.
Nei waya yegoridhe ichinyatsoona mukubatanidza maitiro?
Kunyangwe mutengo wakanyanya, Goridhe Wire yakaramba iri korona yekuvimbika-yakavimbika chip kurongedza nekuda kwezvikonzero zvakakosha. Kuwanda kwayo mukati Bonding maitiro iTesitamende kune iyo yakasarudzika zvinhu zvivakwa, izvo zvinoita kuumba zvinowirirana uye kuvimbika chisungo nyore kupfuura nezvimwe zvinhu. Kune iyo mainjiniya ekumisikidza nekuverengera yakakwana goho uye refu-time mudziyo kuita, zvakanakira a Goridhe Wire Bond zvinowanzomanikidza.
Mukana wakanyanya kukosha we Goridhe Wire ndiyo kemikari yemakemikari. Goridhe haina ngura kana oxidize pasi pemamiriro ezvinhu akajairwa. Izvi zvinoreva pamusoro pe waya inogara iri pristine uye yakagadzirira kusungwa, kubvisa kushanduka kukuru kunogona kukonzera kusarongeka bond mhando uye kugadzira urema. Izvi zviri mukushambadzira kusiyana-siyana kwemhangura, izvo zvinoda mamiriro ekudzivirira kudzivirira oxidation kubva mukupindirana ne chisungo. The the Kubatirana kwegoridhe kungozvikanganwira zvakanyanya.
Uyezve, Goridhe Wire inodakadza kwazvo uye yakapfava. Izvi zvinobvumidza zvakanakisa Bond Formation uye Bond mhando pamasimba akadzika uye kupisa panguva Thermonic Bonding. Kushandisa simba shoma kunodzora njodzi yekupaza kana kukuvadza iyo isina kusimba silicon chip pasi pe Bond Pad. Kupfava kwe Goridhe Wire inobvumira kugadzirisa nyore nyore, kugadzira nzvimbo yakakura, yakavimbika yekubatana kwe chisungo. Nepo Kudzivirira Goridhe Wire Zvisungo May Iva nechinangwa chekudzora mutengo, kune mishonga yekunyorera-inonyorera iyo kutadza haisi sarudzo, kuvimbika kunopihwa ne Goridhe Wire Bond kazhinji inokoshesa mutengo wekutanga.
Wedge cyges blands akasiyana sei nedzimwe matekinoroji ekubatanidza?
Wedge Bhuku inomira pakati Wire Kubatira Technologies Nekuda kwechishandiso chayo chakasarudzika, kuyerera, uye zvinoshandiswa. Kusiyana Bhora Bland, iyo inoshandisa capillary inotenderera uye inotanga nebhora-rakaumbwa chisungo, Wedge Bhuku inoshandisa a wedge-Iye mudziyo wekudzvanya iyo waya zvakananga zvinopesana nekubhira. The the waya yakanatswa zvakananga uye yakaburitswa neyakasarudzika simba kuti iite stitch-senge chisungo. Uyu mutsauko unokosha unotungamira kune akati wandei akasiyana maitiro.
Chimwe chinhu chakakosha che Wedge Bhuku ndiko kugona kwayo kugadzira yakaderera-mbiri chisungo. Iyo inokonzeresa stitch chisungo inobata kumeso kupfuura bhora chisungo, kugadzira Wedge Bhuku Yakanakira pakuratidzira uko kujekeswa kwakasarudzika kunogumira. Inotenderawo kune yakanyanya kunaka-pitch kusungwa, pane Bond Mapads pane chip vanoiswa padhuze pedyo pamwechete. The the Wedge Bhuku maitiro anopa zvakanakisa kutonga pamusoro peiyo loop chimiro che waya, iyo inotsoropodza mumidziyo yakakwirira-frequency. Uku kunyatsoita kuti nei isu mainjiniya zvishandiso senge zvedu Yakagadzirirwa Wedge Bonding Tool kusangana nemhosva yakasimba.
Wedge Bhuku ndiyo nzira huru ye Aluminium Wire Kubatira. Iyo ultrasonic scrubing chiito inobudirira kwazvo pakuputsa kuburikidza neyakagara oxide layer pa Aluminium Wire. Kuita uku kunogona kushandisawo Goridhe Wire (goridhe wedges bonding) kana ribhoni, riite zvinochinja-siyana. Nekudaro, Wedge Bhuku kazhinji zvishoma nezvishoma kupfuura Bhora Bland Nekuti chishandiso chinofanira kuwiriranwa mumwe nemumwe chisungo. Pasinei neizvi, nekuda kwemidziyo yakakwirira-yemagetsi uye zvikumbiro zvakanaka-zvakaringana, kuvimbika uye nekunyatsojeka kwe Wedge Bond ita kuti ive yepamusoro sarudzo pakati kusungwa kwakasiyana Tekinoroji. The the Wedge Bonding Bond ibhiza rebasa.
Chii chinoratidza "zvakanaka" chisungo uye unozviita sei?
"Zvakanaka" chisungo ndeimwe iri zvese zviri zviviri zvine mutsindo uye nemakanji kusimba, kugona zvachose hupenyu hwese hwe Chishandiso chemagetsi. Kune injinjini, yakanaka chisungo inotsanangurwa nenzira yakatarwa, yekuyera maitiro: zvakakwana Bond Simba, kudzikisira kwemagetsi kupesana, uye chimiro chinowirirana, chakaumbwa. Kuzadzisa izvi zvakakwana chisungo ndicho chinangwa chikuru che Optimizing iyo waya yekubatanidza maitiro.
Zvinoratidzika, bhora rakanaka chisungo inofanira kuve yakakwana kutenderera uye yakatarisana pane Bond Pad, nehurongwa hunooneka (squash) kuratidza yakasimba metallurgical kubatana. Wedge yakanaka chisungo inofanirwa kuratidza musiyano, yunifomu fungidziro kubva ku Bonding Tool. Panofanira kunge pasina marara mu chisungo kana kutenderedza chip, uye waya kubuda chisungo (iye bhora Bond Bond kana chitsitsinho) inofanira kunge isina kutetepa yakawandisa kana kukuvara. Kuvimbika kwe Wire Bond-Bond Pad interface is the resmount.
Kuzadzisa zvakanaka chisungo zvinoda meticuuses kutonga pamusoro pe Kuronga paramita: kumanikidza, ultrasonic simba, nguva, uye tembiricha. Izvi zvinofanirwa kuvezwa kune zvakananga zvigadzirwa uye waya kushandiswa, kusanganisira iyo Wire saizi uye simbi ye Bond Pad. Zvishandiso zvemhando yepamusoro hazvitaurizve; chishandiso chakapfekwa kana chisina kunaka chakagadzirwa chisingakwanise kuburitsa chinowirirana chisungo. Pakupedzisira, kuchena kunokosha. Chero kusvibiswa pane chip kana waya inogona kudzivirira yakakodzera chisungo kubva pakugadzira. Kuvimbika Kusungwa Imhedzisiro yekuita kwakanyatsogadzirwa, zvinhu zvepamusoro, uye kuenderera mberi kwekutarisa. Yakasimba chisungo yakavimbika chisungo. Mumwe nemumwe chisungo zvine basa.
Chii chinobatanidzwa mukuedzwa kwemahota zvisungo zvekuvimbika?
Kuvimba Wire Bond Kuvimbika chikamu chinonetsa chemhando yekutonga kwemhando muSemiconductor kugadzira. Yakanaka-inotaridzika chisungo haina chinangwa kana isina simba rinodiwa. Saka, rakasimba Kuedzwa kweWire Zvisungo zvinoitwa kuti ushandise iyo Kubatira maitiro uye vimbiso kwenguva refu kuita. Iyo mbiri mbiri dzinowanzoitika dzinoparadza ndizvo waya dhonza bvunzo uye chisungo Shear test.
Wire dhonza kuongororwa ndiyo quintessential bvunzo kune chero Wire Bond. Izvo zvinosanganisira kushandisa chidiki chidiki kudhonza kumusoro pane waya pahuswa hwechiuno chake kusvika kana waya kupaza kana imwe yemabhondari inosimudza. Simba rinodiwa kukonzera kuti kutadza uku kuyerwa muGram-simba. Iyi data inozofananidzwa neyesindori zviyero (kunge mil-std-883) kuona kana iyo Bond Simba inogamuchirwa. Nzvimbo yekutadza zvakare yakanyorwa, sezvo inopa ruzivo rwakakosha ruzivo nezvehutano hwe Wire Bond uye zvese Kubatira maitiro.
Bond Dhirowa uye Shear Kuedza inopa imwe denderedzwa rekusimbiswa. A chisungo Shear bvunzo inoshandiswa kuyanyera zvakananga kudedera kwe chisungo ku Bond Pad. Chishandiso chinouya kubva parutivi uye chinosundira pamusoro pe chisungo (bhora chisungo kana wedge chisungo(Kusvikira rinomira pariri. Simba rinodiwa kuti riite chisungo Chiyero chakananga chemhando yeiyo metallurgical weld. Zvose zviri zviviri Wire Bond Dhirowa uye Shear Miedzo inowanzoitwa pane sampule yeyekutarisa kugadzikana kwe Bonding maitiro. Izvi zvinogara zviripo Kuedzwa kweWire anovimbisa kuti zvese zvese Chishandiso chemagetsi iyo inosiya fekitori ine simba uye yakavimbika Wire Bond network.
Ndezvipi zvinokonzeresa zvinokonzeresa zveWire WIRE Bond Zvikutengo uye vangadziviswa sei?
Wire Bond Kukundikana Iko kushushikana kukuru mumagetsi kugadzira, sezvavanogona kutungamira kune mudziyo kushamisika uye zvinoyevedza zvinoyevedza. Uku kukundikana kazhinji kunogona kudzidziswa kumashure kune nyaya mune imwe yenzvimbo nhatu: zvinhu, kugadzirisa, kana kushushikana-kushushikana. Kunzwisisa izvi zvinokonzeresa nzvimbo ndiyo yekutanga nhanho yekudzivirira. A yakundikana Wire Bond iri kutadza chisungo.
Chimwe chezvinhu zvinowanzoitika zveisina kusimba chisungo kusvibiswa. Chero zvinhu zvekunze pane Bond Pad kana iyo waya-Suchenyaya yemhou, guruva, kana makemikari zvasara - zvinogona kuita sechipo, kudzivirira metallurgical chisungo kubva pakugadzira. Izvi zvinoratidzira kukosha kwekutora kwekuchenesa protocol. Imwe nyaya huru haina kunaka Kuronga paramita. Simba rakawanda rinogona kupwanya chip, nepo kusimba kushoma kana kuti usimbe simba rinogona kukonzera kusiri-tsvimbo, kana kusimudzwa, chisungo. Iyo process hwindo kune yakanaka chisungo inogona kuve yakamanikana, inoda kunyorwa muchina calibration. Apa ndipo panowanikwa hunyanzvi hwemutengesi Dongxin Electronic tekinoroji inova yakakosha.
Kukundikana kunogona kuitika mushure me Wire Bond yakagadzirwa. Brittle Intermitallic Compound, kunyanya mukati Goridhe-Aluminium Bond Systems, inogona kukura nekufamba kwenguva uye kutungamira kune isina kusimba chisungo. Simba rekushushikana kubva pane zvekushandisa zvemushini panguva dzekutora cycling inogona zvakare kukonzera kuneta muna waya, zvichitungamira kuzorora kuchitsitsinho cha chisungo. Kudzivisa izvi Wire Bond Kukundikana inoda nzira yeHolistic: uchishandisa yakakwira-mhando zvinhu, zvine mutsindo zvichitora iyo Kubatira maitiro, kurongedza kushushikana kwemuchina, uye kuongororwa zvine moyo wekuvimbika. Zvese chisungo mu Chishandiso chemagetsi inofanira kuve yakakwana.
Key Deaaroways
- Iyo Wire WALL ISTOCKI: The the Wire Bond ndiko kubatana kwakakosha kunoita kuti Semiconductor chip kushanda mukati me Chishandiso chemagetsi. Imwe neimwe chisungo Chakakosha chinongedzo.
- Kwete zvakafanana sewe mutengesi: A Wire Bond chinhu chake, chakasimba-nyika weld, nepo mutengesi isimbi yesimbi. The the chisungo yakasimba uye idiki.
- Matanho matatu epakati: Bonding maitiro SaThermonic, Ultrasonic, uye Thermocompans inoshandiswa, ne Thermonic Bonding kuve akajairika zvakanyanya kune chiyero chayo chekumhanya uye kuchengeteka kune chip.
- NYAYA DZESVONDO: Sarudzo pakati Goridhe Wire, Copper waya, uye Aluminium Wire Iko kutengeserana-kubviswa pakati pemutengo, kuita, uye iyo chaiyo application zvido. Yakakodzera waya kiyi kune zvakanaka chisungo.
- Mhando inoyevedza: Zvakanaka chisungo ine yakakwira Bond Simba uye kudzikisira kwemagetsi. Izvi zvinoshandiswa kuburikidza nekuparadza bvunzo senge waya dhonza uye chisungo Shear Kuedza.
- Kukundikana kunodzivirirwa: Zvakanyanya Wire Bond Kukundikana stem kubva pakusvibiswa, zvisiri izvo Kuronga paramita, kana mashandiro emunamato. Maitiro akasimba uye zvinhu zvepamusoro-zvemhando yepamusoro ndiwo akanakisa kudzivirira. Chinangwa chakakwana chisungo, nguva dzese.
