I-dive enzulu kwi-wire ye-wire ye-wire, ukubetha kwentliziyo kwazo zonke izinto ze-elektroniki

Igama lam nguKevin, nakwi-Dongxin itekhnoloji ye-elektroniki, umhlaba wam ujikeleza ngokuchanekileyo kwisikali se microscopic. Ndikhe ndanelungelo lokusebenza kunye neenjineli ezifana noMarcus eJamani-Meridals eziqonda ukuba umgca wemveliso yezigidi zeedola unokuyigcina ngokunyaniseka, intanda ucingo. Le ucingo iifom a iqhina, uqhagamshelo lombane kunye noomatshini lubaluleke kakhulu ukuba luqhubekele phantse kuyo yonke imihla isixhobo se-elektroniki. Eli lilizwe le i-wire ye-wire. Itekhnoloji enkulu kakhulu kunokuba ilula umthengisi, kwaye ukuba nokulawula kubalulekile nakubani na kwintsimi yethu. Kwesi sikhokelo, siyakuphambuka i-wire ye-wire, ehlola isayensi, iindlela, kunye nezixhobo ezenza unxibelelwano olubalulekileyo, zikunika ulwazi olunzulu lobuchwephesha obufunekayo ukuze bagqibe kweyakho Iinkqubo ze-BOID.

Yeyiphi injongo ephambili yocingo olungena kwisixhobo se-elektroniki?

Eyona nto iphambili Injongo yocingo lwentambo kukwenza Unxibelelwano lombane. Ngokukodwa, I-wire i-boire yinkqubo yokudibanisa isekethe elihlanganisiweyo le-microscopic, okanye itshiphu, ukupakisha okanye kwibhodi yesekethe eprintiweyo. Le iqhina Ikhonkco lonxibelelwano olufanelekileyo. Ngaphandle kwawo, amandla okulungisa okunamandla kwe itshiphu iya kuhlala ilungu kwaye ingenamsebenzi. I-wire inikezela Indlela eguqukayo, ethembekileyo, esebenzayo yokwenza oku kunxibelelana okubalulekileyo. Yonke ucingo isebenza njengebhulorho encinci, iphethe amandla kwi itshiphu kunye nedatha yangaphandle kuyo. Umntu ongatshatanga Icandelo le-elektroniki Inokuqulatha amakhulu, okanye amawaka, kwalowo mntu iingcingo zebhondi.

I i-wire ye-wire ngokwayo yindawo eqinileyo-rhulumente. Ngokungafaniyo nezinye iindlela ezibandakanya izinto zokunyibilika, I-wire bond Sebenzisa indibaniselwano yamandla, ubushushu, kunye namandla e-ultrasonic ukwenza i-atomic ngqo iqhina phakathi kwe ucingo kunye nepad yentsimbi kwi itshiphu ( I-Bond pad). Oku kudala uqhagamshelo olumangalisayo. Entle iqhina Unenkqubela phambili yombane kunye namandla omatshini, ukuqinisekisa i isixhobo se-elektroniki imisebenzi ethembekileyo phezu kwayo yonke i-wospan. Inethiwekhi yentsusa yezi iqhina Unxibelelwano lwenza umqolo we-elektroniki yanamhlanje, ukusuka kwi-smartphone kwipokotho yakho kwiinkqubo zolawulo oluqhubela phambili kwinqwelo yombane. Umgangatho ngamnye iqhina Impembelelo ngqo kwintsebenzo kunye nobomi obude bemveliso yokugqibela.

Ukubaluleka kokulungileyo i-wire ye-wire ayinakuba ngaphezulu. Impazamo enye iqhina inokubangela ukuba yonke inkqubo iphumelele. Ke ngoko, ukudala igqibeleleyo iqhina Ngalo lonke ixesha yeyona njongo iphambili. Oku kufuna ukuqonda okunzulu kwezixhobo ezichaphazelekayo, i-profiksi ye Iinkqubo ze-BOID, kunye nolawulo olufanelekileyo ngaphezulu koomatshini. I ucingo ngokwayo, i I-Bond pad I-Statialfalfaltise, kunye ne boleza Iiparamitha kufuneka zonke zisebenze ngokuvisisanayo. Yiyo le nto i-wire ye-wire yindawo ekugxilwe kuyo kwiinjineli zenkqubo zizabalazela ukwenziwa kwemveliso ze-zero. Yonke iphumelele iqhina sisivumelwano sokuchaneka kwetekhnoloji.

I-wire yengqengqelo yahluke njani kunxibelelwano lweThuqu?

Ngelixa bobabini a i-wire ye-wire kwaye a umthengisi Ukudibanisa Yidale uqhagamshelo lombane, ngeendlela ezahlukeneyo ngeendlela ezahlukeneyo ngezicelo ezahlukeneyo. Owona mahluko ubambi kakhulu yile I-wire bond yinkqubo eqinileyo-yombuso edala i-metrical ngqo iqhina, ngelixa ukuthengisa yinkqubo esebenzisa i-filter (umthengisi) Ngendawo ephantsi yokunyibilika ukuze ujoyine imiphezulu emibini. Cinga nge i-wire ye-wire Njenge-microscopic yedd kwaye umthengisi njengeglue ye-metic.

Umthengisi isebenza ngokutyibilika kwaye ihamba phakathi kwamacandelo anokujoyina. Xa ipholile, iyaziqinisa, iyenza zombini oomatshini iqhina kunye nendlela yombane. Le nkqubo ilungele ukunxibelelana okukhulu Icandelo le-elektronikiS kwiibhodi zesekethe. Nangona kunjalo, ubushushu obufunekayo umthengisi inokuyonakalisa i-semicondcuctory ecekeceke itshiphu. Ngapha koko, umthengisi Amalungu aqhele kakhulu kwaye angaphantsi kwe-a i-wire ye-wire. Awukwazi ukusebenzisa umthengisi Ukwenza amawaka amawaka okuxhuma kwe-microscopic efunekayo kwixesha langoku itshiphu.

Ngokwahlukileyo, a i-wire ye-wire yenziwa ngaphandle kokunyibilika ucingo okanye I-Bond pad. Amandla e-ultrasonic kunye noxinzelelo kubangela iiatom ze ucingo kunye nepali ukuba zihlukane omnye komnye, zenza isakhiwo esingatshatanga esikhawulezayo. Le ngqo Indlela idala umoya othembekileyo, onokuthenjwa ngakumbi, kwaye unxibelelwano oluncinci kakhulu. Inkqubo ikwakhawuleza ngokukhawuleza kwisikali esincinci. Ngelixa umthengisi ilungele iNdibano yeBhodi yeBhodi, i i-wire ye-wire Ngaba itekhnoloji enkulu ye itshiphuuqhagamshelo lwe-Intanethi. A i-wire ye-wire Ngaba yinto ebaluleke kakhulu kwaye ichanekile iqhina kune umthengisi Unxibelelwano.

Zeziphi iintlobo ezintathu zeenkqubo ezisetyenziswayo ezisetyenziswayo namhlanje?

Kwihlabathi lee-microelectiactrosics, kukho Iindidi ezintathu zombane Ezo zinto zilawula imveliso: I-thermosonic bond, i-Ultrasonic Bonding, kunye neThetheleko. Nganye Indlela yoWire Wire inika indibaniselwano eyodwa yobushushu, uxinzelelo, kunye namandla ukwenza ukuthembeka iqhina. Ukuqonda ezi I-Boinding Goods ibalulekile ekukhetheni inkqubo efanelekileyo yesicelo esithile.

1. I-thermosonic boled: Le yeyona ixhaphakileyo Uhlobo locingo lwe-wire isetyenziswe namhlanje, ngakumbi UWire Wire Wire kwaye ucingo lobhedu. Idibanisa zonke izinto ezintathu: ubushushu, amandla, kunye namandla e-ultrasonic. Ukuthathwa kwekhusi kubushushu obuphakathi (ngokwesiqhelo i-125-150 ° C), ethambisa izixhobo kancinci kwaye zibenza balamkele ngakumbi boleza. I Isixhobo sokuBonelela emva koko kucinezelwa ucingo kwi I-Bond pad Ngelixa usebenzisa i-ultrasosonic fibys. Indibaniselwano ivumela ngokukhawuleza kwaye ithembekile iqhina kumaqondo obushushu aphantsi kunye nemikhosi kune-thermocompion, ukukhusela ubuncwane itshiphu.

2. I-Ultrasonic Bonding: Le indlela yokundedwa ihlala ibizwa ngokuba "kubanda" iqhuma kuba ihlala isebenza kubushushu begumbi. Ibonisa ngokukodwa kwi-Ultrasonic amandla kunye noxinzelelo ukwenza i iqhina. Isenzo esiphakamileyo seScrubb ucingo Ukuqhekeza ezantsi i-oxides kwaye kudala uxinzelelo oluyimfuneko kwi-steld eqinileyo. I-Ultrasonic Bonding yindlela esemgangathweni ye I-Aluminium Wire Bond, njengendawo ye-aluminium ngokulula yenza ukuba ungqimba olunzima lwe-oxide omfuno ekufuneka ikhutshiwe. Ukunqongophala kobushushu bangaphandle kwenza ukuba le nkqubo ilungele izixhobo ezinobuthathaka lobushushu.

3. I-ThermoCompaccourse: Le yeyona ntsusa I-wire bond ubuchule. Ixhomekeke kuphela kubushushu obuphezulu (ngaphezulu kwe-300 ° C) kunye noxinzelelo ukwenza i iqhina. I ucingo kwaye I-Bond pad bafuduselwe kwinqanaba lokuba iiathom zeselula ngokwaneleyo ukuba zihlukane kwaye zenze a iqhina xa ucinezelwe kunye. Ngelixa isebenza, amaqondo obushushu aphezulu ayonakalisa okanye akhuphe i-semicondcuctor itshiphu. Ngenxa yoko, le ndlela ayiqhelekanga namhlanje kodwa isasetyenziswa kwizicelo ezithile apho amandla e-ultrasonic engenakusetyenziswa. Indaleko isuka kwithermocmpint ukuya I-thermosonic bond yayilinyathelo eliphambili phambili kwishishini.

Ngaba ungayinika iinkcukacha i-chip kunye nenkqubo yokuhambisa i-wire?

I itshiphu kwaye I-Wire Sire Sport Inkqubo yinkqubo yenyathelo elizenzekelayo, elinamanyathelo ngamanyathelo aqhubeka ngaphakathi ucingo Isibonda. Masiphule ukulandelelana kwesiqhelo Ibhola ye-thermoson umjikelo, eyona ixhaphakileyo I-wire bond ubuchule.

Okokuqala, itshiphu . Le ndibano ifudunyelelwa kwiqondo lokushisa. I ucingo olucekeceke, igolide okanye igolide okanye ubhedu, inyibilikisiwe ngesixhobo esingenamsebenzi esibizwa ngokuba yi-capillary. I-spark yombane igxothwe kwi ukuphela kocingo, ukuyiphosa kwaye wenze indawo egqibeleleyo, eyaziwa ngokuba yibhola yomoya yasimahla. Kulapho inkqubo iqala khona ngokwenene.

Ingalo yerobhothi yerobhothi ishukumisa i-capillary ezantsi kwi itshiphu. Icinezela ibhola kwi-the I-Bond pad ngamandla achanekileyo. Ngaxeshanye, umatshini usebenza i-itret yamandla e-ultrasonic. Oku kudala I-Bondy yokuqalaUnxibelelwano oluqinileyo nolukhunisiweyo. Umatshini ke uphakamisa isixhobo kwaye uqalisa ukufudukela kwindawo yesibini yonxibelelwano kwi-subtate yendawo, ukuhlawula i ucingo njengoko ihamba. Indlela ethathayo ithatha i-lop e-injini enobuqili kwi ucingo. Ekugqibeleni, izixhobo zoxinzelelo ucingo ngokuchasene nendawo yokwenza I-Bond yesibini ("Isitayile" iqhina). I-Clomp ifumene i ucingo, kwaye isixhobo sinyuka siye phezulu, saphula i ucingo Kwisithende sesibini iqhina kwaye ishiya encinci umsila wocingo ilungele umjikelo olandelayo. Yonke le nto I-Wire Sire Sport Inkqubo, isuka e I-Bondy yokuqala kwi ucingo Yaphula, yenzeka kwiqhekeza lesibini.

Zeziphi izinto ezisetyenziswayo kunye neentlobo ze-wire zisetyenziswa kwi-wire wire?

Ukukhetha Izixhobo kunye ne-wire sisigqibo esibalulekileyo kwi I-Wire Sire Sport Inkqubo. Ukhetho olunefuthe ngqo kwiindleko, ukusebenza kunye nokuthembeka kwe isixhobo se-elektroniki. I iingcingo zentambo Kufuneka ube nokuqhutywa kombane okuphezulu, amandla alungile ngoomatshini, kunye nokuxhathisa. Ezintathu eziphambili iintlobo zewire isetyenziswe kwi-wire bond yigolide, ubhedu, kunye ne-aluminium.

• Igolide (AU) wire: I-wire yegolide kukhetho lwepremiyamu. Inokuthenjwa kakhulu kuba ayinyanzelekanga, iqinisekisa indawo ecocekileyo yento egqibeleleyo iqhina. Ithambile kakhulu kwaye i-ductile, evumela ukuba yomelele iqhina ukuba kwenziwe ngamandla aphantsi kunye nobushushu. Oku kwenza UWire Wire Wire Ilungele i-chips ezibuthathaka, i-chips eziphezulu. I-CORCEY YOKUSETYENZISI I-wire yegolide yindleko zayo eziphezulu. Entle iqhina nge I-wire yegolide ihlala ilula ukuyifezekisa.
• I-Copper (CU) wire: Ucingo lobhedu iye yavela njengenye indlela esebenzayo yegolide. Ukuqhubela phambili kombane kunye ne-thermal kungcono ngakumbi kunegolide. Nangona kunjalo, ucingo lobhedu Ifaka imiceli mngeni emininzi. Ubhedu lunzima kunegolide, ukuze I-rameter ye-rameters kufuneka ilawulwe ngononophelo ukuthintela ukonakalisa i itshiphu. Ikwavayikisa ngokulula, enokuphazamisa i iqhina. Oku kufuna ukuba boleza ukwenza i-intert submosphere. Ngaphandle kwale miceli mngeni, iindleko zayo ezisezantsi zenza ukuba kukhetho oluqhelekileyo.
• I-Aluminium (Al) wire: I-aluminium wire yindawo yokusebenza yeshishini le-elektroniki. Isetyenziswa rhoqo I-Wedge Bond izicelo. Xa i i-aluminium wire ibotshwe kwi-aluminium I-Bond pad kwi itshiphu, idala inkqubo ethembekileyo ye-monollic. Oku kuyakuphephe ukusekwa kweendlela ze-Brittle-Intertoets ezinokwenzeka I-Wire ye-Wire ye-Bire ye-Bond-Bond Pis zentsimbi, ngakumbi kubushushu obuphezulu. A i-aluminium wire isebenza kakhulu. SIYABONAKALISA UKUGCINWA NGOKUGQIBELA I-wire ecocekileyo ye-aluminium kwezi zicelo zifunwayo.

Kutheni i-wire yegolide ixhaphake kakhulu kwiinkqubo zokuxhuzula?

Ngaphandle kweendleko eziphezulu, I-wire yegolide ihleli ilitye lesiseko lokunyaniseka Ukupakisha i-chip ngenxa yezizathu ezininzi eziphambili. Ukuxhaphaka kwayo ngaphakathi Iinkqubo ze-BOID yiTestamente kwipropathi yayo ekhethekileyo ekhethekileyo, eyenza ukuba iguqulwe kwaye ithembeke iqhina kulula ngaphandle kwezinye izinto. Injineli inikwe umsebenzi wokuqinisekisa isivuno esikhulu kunye nexesha elide lokusebenza, izibonelelo ze I-wire ye-wire yegolide zihlala zinyanzelisa.

Olona ncedo lubalulekileyo I-wire yegolide yindawo yayo yekhemikhali. Igolide ayihambelani okanye okanye i-oxidize phantsi kweemeko eziqhelekileyo zemosmospheric. Oku kuthetha umphezulu we ucingo ihlala iphambili kwaye ilungele boleza, Ukuphelisa umahluko omkhulu onokubangela Umgangatho weBhokisi yeBhokisi kunye noMveliso iziphene. Oku kukwindawo ekwahlukileyo kubhedu, olufuna ukubakho kwemozulu ukuthintela i-oxidation ukuba ingaphazamiseki iqhina. I I-Bound yegolide kukuxolela ngakumbi.

Ngapha koko, I-wire yegolide I-ductile kakhulu kwaye ithambile. Oku kuvumela ukulunga Ulwakhiwo lweBond kunye nomgangatho webhondi Kumkhosi ongezantsi kunye namaqondo obushushu ngexesha I-thermosonic bond. Sebenzisa amandla amancinci kunciphisa umngcipheko wokuqhekeka okanye ukonakalisa isiliko esibuthathaka itshiphu Ngaphantsi kwe I-Bond pad. Ukuthoba kwe I-wire yegolide ivumela ukuba ichaphazele ngokulula, ukudala indawo enkulu, ethembekileyo yoqhakamshelwano ye iqhina. Ngelixa Ukuphepha iibhondi zegolide Yiba yinjongo yokunciphisa iindleko, kwizicelo ezibalulekileyo zemishini apho ukusilela akuyiyo inketho, ukuthembeka okhethwe ngu-A I-wire ye-wire yegolide ihlala ifanele ixabiso leprimiyamu.

Ngaba uWebre uHloniphekileyo njani nakwezinye iitekhnoloji ze-bonds?

I-Wedge Bond Phakanyiswa phakathi I-wire bond the theire teknologies Ngenxa yesixhobo sayo esahlukileyo, ukuhamba kwenkqubo, kunye nokusetyenziswa. Ngokungafaniyo Ibhola iBhola, esebenzisa i-capillary ejikelezayo kwaye iqala ngebhola iqhina, I-Wedge Bond isebenzisa i wedgeIsixhobo esikhutshelweyo sokucinezela ucingo ngokuthe ngqo kumhlaba wokuxhoma. I ucingo lucinezelwa ngokuthe ngqo kwaye iqhekezwe ngamandla e-ultrasonic ukwenza i-stitch-njenge iqhina. Umahluko osisiseko ukhokelela kwiimpawu ezahlukeneyo ezahlukeneyo.

Inqaku elinye eliphambili I-Wedge Bond kukwazi kwayo ukwenza iprofayile ephantsi kakhulu iqhina. Isiphumo esikhuphileyo iqhina icekeceke kakhulu kunebhola iqhina, ukwenza I-Wedge Bond Ilungele izicelo apho imvume ethe nkqo inomda. Ikwavumela i-pitch entle kakhulu boleza, apho Iipads zebhondi kwi itshiphu ibekwe kufutshane kunye. I I-Wedge Bond Inkqubo ibonelela ngolawulo olugqwesileyo kwiprofayili ye-loop ye ucingo, ebaluleke kakhulu kwizixhobo eziphakamileyo. Oku kuchazwe yiyo le nto ngokwembeko yezixhobo ezinje Isixhobo se-Wedge esiSebenzayo Ukuhlangabezana nokuqina okuqinisekileyo.

I-Wedge Bond yeyona ndlela iphambili I-Aluminium Wire Bond. Inyathelo lokukhuphela i-ultrasonic lokuqhekeza lisebenza kakhulu kwi-National Oxcider kwi i-aluminium wire. Le nkqubo inokusebenzisa I-wire yegolide (I-Wedge yegolide) okanye iribhoni, iyenza ibe ntweni. Nangona kunjalo, I-Wedge Bond ihamba kancinci kune Ibhola iBhola Kuba isixhobo kufuneka silungelelaniswe nganye nganye iqhina. Ngaphandle koku, kwizixhobo ezinamandla ezinamandla kunye nokusetyenziswa kakuhle kwezicelo, ukuthembeka kunye nokuchaneka kwe Wedge Bond yenze ukhetho oluphezulu phakathi I-bound eyahlukileyo Itekhnoloji yeTekhnoloji. I Wedge Bond Bond yindawo yokusebenza.

Yintoni ebonisa "i-" elungileyo "kwaye uyiphumeza njani?

Entle" iqhina yenye evakalayo yombane kwaye yeyamatshini yomelele, iyakwazi ukuhlala ubomi bonke isixhobo se-elektroniki. Injineli, elungileyo iqhina ichazwa ngeendlela ezithile, ezinokulinganiswa: zanele amandla eBondo, Ukumelana kombane okuphantsi, kunye nommiselo opheleleyo, owenziwe kakuhle. Ukufezekisa oku kufanelekile iqhina yeyona njongo iphambili ye Ukulungiselela inkqubo yokuxhoma.

Ibhola elungileyo, ibhola elungileyo iqhina kufuneka ijikeleze ngokugqibeleleyo kwaye ijolise kwi I-Bond pad, ngengcaciso ebonakalayo (i-squash) ebonisa unxibelelwano oluqinileyo lwe-mettellical I-Wedge elungileyo iqhina kufuneka ibonise imeko eyahlukileyo, iyunifomu evela kwi Isixhobo sokuBonelela. Akufuneki kubekho rocks kwi iqhina okanye ojikelezileyo itshiphu, kwaye i ucingo ukuphuma kwe iqhina ( intamo yebhola okanye isithende) kufuneka sikhululeke ekunciphiseni kakhulu okanye ukonakala. Ingqibelelo ye I-wire ye-bod-bond pad Isinxibelelanisi se-inparamount.

Ukufezekisa okuhle iqhina ifuna ulawulo oluhle kakhulu ngaphezulu kwe I-rameter ye-rameters: Nyanzela amandla, amandla e-ultrasonic, ixesha, kunye nobushushu. Ezi kufuneka zilungiswe kwi-the Izixhobo kunye ne-wire Ukusetyenziswa, kubandakanya ne Ubungakanani bocingo kunye nokuqina kwe I-Bond pad. Izixhobo ezikumgangatho ophakathi azinakuphikiswa; Isixhobo esinxilisayo okanye senziwe kakubi asinakukwazi ukuvelisa ukungangqinelani iqhina. Okokugqibela, ukucoceka kubalulekile. Naluphi na ungcoliseko kwi itshiphu okanye ucingo inokuthintela kufanelekile iqhina ukuyeka. I-Bood ethembekileyo Isiphumo senkqubo ekhiwe kakuhle, izixhobo eziphezulu, kunye nokubekwa kweliso eqhubekayo. Yomelele iqhina ithembekile iqhina. Yonke into iqhina izinto.

Yintoni ebandakanyekileyo kuvavanyo lweebhondi zengcingo zokunyaniseka?

Qinisekisa Ukunyaniseka yinxalenye ebalulekileyo yenkqubo yokulawula umgangatho kwimveliso ye-semicondcucto. Inkangeleko entle iqhina ayinantsingiselo ukuba ayinawo amandla afunwayo. Ke ngoko, ingqukula Ukuvavanywa kwe-wire Iibhondi zenziwa ukuqinisekisa i I-Hander Inkqubo kunye nokuqinisekisa ukusebenza kwexesha elide. Ezona mvavanyo zibalulekileyo ziqhelekileyo zezona ucingo Tsala uvavanyo kunye ne iqhina Uvavanyo lwe-Shear.

Ucingo lovavanyo Ngaba uvavanyo olungamalungelo i-wire ye-wire. Kubandakanya ukusebenzisa i-hook encinci yokutsala phezulu kwi ucingo kwi-apex ye-lop yayo de ibe ucingo ikhefu okanye enye ye-bonds iphakamisa. Amandla afunekayo ukubangela oku kungaphumeleli kulinganiswa ngegram-amandla. Le datha ithelekiswa nemigangatho yeshishini (njenge-Mil-STD-883) ukufumanisa ukuba amandla eBondo yamkelekile. Indawo yokusilela irekhodiwe, njengoko ibonelela ngolwazi lokuxilonga olubalulekileyo malunga nempilo ye i-wire ye-wire kwaye iyonke I-Hander Inkqubo.

I-Bond Tsa kunye nokuvavanywa kweShear ibonelela ngolunye ungqinisiso lokuqinisekiswa. A iqhina Uvavanyo lwe-Shear lusetyenziselwa ukulinganisa ngokuthe ngqo i iqhina kwi I-Bond pad. Isixhobo sivela ecaleni kwaye sityhala ngokuchasene ne iqhina (ibhola iqhina okanye umtshato iqhina) de itshile. Amandla afunekayo ukuze achebe iqhina ngumlinganiso ngqo womgangatho we-sterellical s. Zombini I-wire ye-wire ye-tsalela kunye ne-shear Iimvavanyo zihlala zenziwa kwisampula yokubeka iliso kuzinzo lwe Iinkqubo ze-BOID. Le meko Ukuvavanywa kwe-wire iqinisekisa ukuba yonke isixhobo se-elektroniki Oko kushiya umzi-mveliso kunemozulu kwaye inokuthenjwa i-wire ye-wire inethiwekhi.

Zeziphi izinto eziqhelekileyo zoonobangela webhongo ye-wire ye-wire kunye nendlela ezinokuthi zithintelwe ngayo?

I-Wire Ding Holl Eyona nto ixhalabisa inkxalabo ephambili kwimveliso ye-elektroniki, njengoko benokukhokelela ekungasebenzi kakuhle nasekukhunjweni kwexabiso. Ezi ntsizi zinokulandelwa ngokubuyiselwa kwimicimbi kwenye yeenkalo ezintathu: Izixhobo, kulawulo lwenkqubo, okanye uxinzelelo lweposi. Ukuqonda ezi zizathu zeengcambu linyathelo lokuqala lokuthintela ukuthintela. Ihlulekile i-wire ye-wire ayiphumelelanga iqhina.

Esona sizathu sibalulekileyo sobuthathaka iqhina Ungcoliseko. Nayiphi na impahla yangaphandle kwi I-Bond pad okanye ucingo-Unjengeeside, uthuli, okanye intsalela yekhemikhali-inokwenza into njengesithintelo, ukuthintela i-metrical eyomeleleyo iqhina ukuyeka. Oku kuphakamisa isidingo semigaqo-nkqubo ecocekileyo yegumbi lokucoca. Omnye umba omkhulu awuchanekanga I-rameter ye-rameters. Kakhulu amandla anokuqhekeza itshiphu, ngelixa amandla amancinci kakhulu okanye amandla e-ultrasonic kunokubangela into engavanga, okanye isuswe, iqhina. Inkqubo yewindows elungileyo iqhina ingaba mxinwa, ifuna ukugcwala koomatshini bokuchaza. Kulapho ubuchule bomthengisi obufana Itekhnoloji ye-elektroniki ye-Dongxin iba yinto ebalulekileyo.

Ukusilela kunokwenzeka kwakhona emva kwe i-wire ye-wire yenziwe. I-Brittle Intermetallic complets, ngakumbi ngaphakathi I-Gold-Aluminium Bond iinkqubo, zinokukhula ngokuhamba kwexesha kwaye zikhokelele kubuthathaka iqhina. Uxinzelelo lwendlela yezinto zokupakisha kwefowuni ngexesha lokuhamba ngebhayisikile le-thermal lunokubangela ukuba ne-digigue kwi ucingo, ekhokelela kwikhefu kwisithende se iqhina. Ukuphepha ezi I-Wire Ding Holl Ifuna indlela epheleleyo: Sebenzisa izixhobo ezisemgangathweni eziphezulu, ukulawula ngokudibeneyo I-Hander Inkqubo, Uyilo loxinzelelo lomatshini, kunye nokwenza uvavanyo lokuthenjwa okungqongqo. Yonke iqhina kwi isixhobo se-elektroniki kufuneka igqibelele.

Iqhosha lezitshixo

• I-cire yeqhina ibalulekile: I i-wire ye-wire Unxibelelwano olusisiseko lwenza ukuba i-semicondcuctor itshiphu ukusebenza ngaphakathi isixhobo se-elektroniki. Nganye iqhina likhonkco elibalulekileyo.
• Ayifani nomthengisi: A i-wire ye-wire yindawo echanekileyo, yombulisi-uqinile, kanti umthengisi yiglue yentsimbi. I iqhina yomelele kakhulu kwaye incinci.
• Iinkqubo ezintathu eziphambili: Iinkqubo ze-BOID Njenge-thermosonic, i-ultrasonic, kunye ne-thermocmpint isetyenziswa, kunye I-thermosonic bond ukuba yeyona ixhaphakileyo ilunge kakhulu kwisantya kunye nokhuseleko kwi itshiphu.
• Imicimbi yezinto ezibonakalayo: Ukhetho phakathi I-wire yegolide, ucingo lobhedu, kwaye i-aluminium wire kukurhweba phakathi kweendleko, ukusebenza, kunye neemfuno zesicelo ezithile. Ifanelekileyo ucingo Iqhosha lokuhle iqhina.
• Umgangatho ulinganiseka: Entle iqhina iphezulu amandla eBondo kunye nokuxhathisa kombane ophantsi. Oku kuqinisekiswa ngovavanyo olonakalisayo ucingo tsala kwaye iqhina Ukuvavanywa kwe-Shear.
• Ukusilela kuyazisela: Uninzi I-Wire Ding Holl stem ukusuka kungcoliseko, alichanekanga I-rameter ye-rameters, okanye uxinzelelo lomatshini. Inkqubo yomeleleyo kunye nezinto ezisemgangathweni eziphezulu zezona zinto ziphambili. Injongo yinto egqibeleleyo iqhina, ngalo lonke ixesha.