Umhlahlandlela we-ENGENTER WOINDE BONDING imishini kanye nesibopho se-wire esifanele

Ngeqhaza lami ebukhwini bama-elekthronikhi be-dongxin, ngivame ukukhuluma nonjiniyela bezinqubo eziphezulu njengoMarcus eJalimane noma amaqembu aholayo e-R & D eSouth Korea. Izingxoxo esinazo azivamile kakhulu; bangena ezweni le-microscopic of i-semiconductor Ukupakishwa, lapho uxhumano olulodwa, olunephutha, oluncane kunezinwele zomuntu, lungahumusha idivaysi yesigidi yedola okungenamsebenzi. Ukwethenjwa kwesimanje Ama-Electronics yakhelwe ekupheleleni kwe isibopho sentambo. Lokhu akuyona nje ukuxhuma amaphuzu amabili; Kumayelana nokwakha amandla, isimo esiqinile bulala phambili lokho kuzohlala iminyaka ngaphansi kwezimo ezifunwayo. Le ndatshana ingeye-Exectioner enobuhlakani obuqonda ukuthi ukusebenza komkhiqizo wabo wokugcina kuncike kwikhwalithi yazo zonke ukuxhuma. Sizodlula ngaphesheya kwezisekelo ukuze sihlole ama-nuances we Imishini yokubopha i-wire, izinqumo ezibucayi ku impahla ye-wire, ne-physics elawula iphelele isibopho sentambo.

Iyiphi inqubo yokubopha isigqila?

Emgogodleni wayo, Ukubopha i-Wire inqubo kokudala Ukuxhumeka ngogesi ukusebenzisa izintambo ezinhle ukuxhuma a Idivaysi ye-semiconductor, Njengomjikelezo ohlanganisiwe (Ig), ukupakisha kwayo noma i-substrate, njengebhodi lokujikeleza eliphrintiwe (I-PCB). Kuyindlela esetshenziswa kakhulu ekwenzeni ugesi ukuxhumaku I-Microelectonics imboni ngenxa yokuguquguquka kwayo kanye nokusebenza kwezindleko. Injongo akuyona nje ukwenza ukuthintana ngokomzimba kepha wakhe isimo seqiniso, esiqinile bulala phambili ekugcineni ngakunye kwe uwaya.

Leli isibopho se-metallurgical Iqinisekisa indlela engenamthungo yamasiginali kagesi nokushisa, okubalulekile ekusebenzeni kwedivayisi nokuphila isikhathi eside. Ngokungafani ne-welding yendabuko, Inqubo Yokubopha Nge-Wire kuvame ukwenzeka ngesilinganiso semicroscopic, ukuphatha a uwaya Lokho kunganciphisa kaningi kunezinwele zomuntu. Ikhwalithi yalokhu isibopho sentambo yisisekelo lapho ukuthembeka kwabangenakubalwa Izingxenye ze-elekthronikhi yakhelwe. -Nke uwaya Kufanele ibekwe ngokuphelele futhi iboshwe ngokuqinisekisa ukuxhumana okungenaphutha.

Yiziphi izindlela eziphambili ze-wire bonding?

Ngenkathi umgomo uhlala uqinile bulala phambili, kukhona abaningana amasu wokubopha intambo wayevame ukufeza. Ukukhethwa kwendlela kuya ngezinto zokwakha, uhlelo lokusebenza, kanye nokucatshangelwa kwezindleko. Amasu amathathu aphansi yilezi:

1. Ukubopha kwe-thermocomepression: Lokhu kwangempela Indlela Yokubopha kuncike ekuhlanganisweni okulula kepha okusebenzayo kwe ukushisa nokucindezela. Ithuluzi elifudumele licindezela i- wire bonding ngokumelene nokufudumala i-substrate noma I-Bond Pad. Inhlanganisela yamandla namandla ashisayo ibangela ama-athomu we uwaya kanye nePads ukuze ahlukane komunye nomunye, ukudala okuqinile ubudlelwano. Ihlanzekile futhi ithembekile kepha ingahamba kancane futhi ukushisa okuphezulu akufaneleki ezinye izinto ezibucayi.

2. Isibopho se-ultrasonic: Le ndlela iyinqubo ebandayo, okuyinzuzo yayo eyinhloko. Isebenzisa ithuluzi elinyakazisa imvamisa ephezulu (imvamisa engama-20-60 Khz) ukuklwebhula i uwaya ngokumelene ne I-Bond Pad. Leli Kusetshenziswa amandla e-Ultrasonic ukwehlisa imichilo engaphezulu koxides futhi udale isimo esiqinile bulala phambili ngokuhlukunyezwa kanye noguquko lwepulasitiki. Ilungele amadivaysi abucayi okushisa futhi iyindinganiso ye I-Aluminium Wire ukubopha.

3. Isibopho se-thermosonic: I-Worthersorse yanamuhla yomkhakha, le ndlela ihlanganisa okungcono kakhulu komhlaba womabili. Isebenzisa Amandla okushisa namandla e-ultrasonic ngasikhathi sinye. Le khasi i-substrate Kuyashisa (imvamisa kuze kube cishe ngo-150 ° C), okuthambisa izinto zokwakha futhi yenza inqubo yokubopha imali ibe lula. Ngemuva kwalokho, ukushaya kwenhliziyo ye amandla e-ultrasonic isetshenziswa ukuphothula isibopho se-metallurgical. Le ndlela ishesha, iyathembeka, futhi idala iqine kakhulu isibopho sentambo, okwenza kube yindlela evelele ye Igolide Wire Bonding phakathi kwa- Ukukhiqizwa kweVolumu ephezulu.

Ukukhetha okubaluleke kangakanani ku-Wire Bonding?

Le khasi Ukukhetha kwezinto ezibonakalayo Okwe wire bonding kungenye yezinqumo ezibucayi kakhulu kulo lonke Inqubo Yokukhiqiza. Le khasi impahla ye-wire kunomthelela ngqo ubudlelwano' Izakhiwo zikagesi, Izakhiwo zemishini, ukuthembeka, nezindleko. Izinto ezisetshenziswayo ezisetshenzisiwe yilezi:

• Igolide (au): Kwaphela amashumi eminyaka, igolide kwakuyindinganiso yezimboni isibopho socingo. Kumelana kakhulu nokugqwala, i-ructile kakhulu, futhi ihle kakhulu ukuqina kukagesi. Ukuthamba kwalo kwenza kube lula ukwakha a ibhondi yebhola. Kodwa-ke, okuphezulu izindleko zegolide iqhube umkhakha ukuthola ezinye izindlela. Okunye ukukhathazeka ukwakheka kwe-brittle I-Gold-Aluminium Intermetalics (evame ukubizwa ngokuthi "inhlupheko onsomi") lapho isibopho sifinyelela kuma-aluminium pads, okungaholela esikhathini eside Izinkinga Zokuthembela Uma kungalawulwa kahle.
• I-Copper (CU): Ucingo lwethusi usephenduke enye indlela ethandwayo yegolide. Inikeza okuphakeme Ukusebenza kukagesi nokwe-Thermal futhi kuningi kakhulu kuqiza kahle. Kodwa-ke, ithusi linzima kunegolide, elingenza umonakalo onobunzima obucayi anzini I-Bond Pad nxa amapharamitha ahlanganisa azilawulwa ngokuphelele. Kubuye kuthambekele kwi-oxidation, kudinga umoya we-inert ngesikhathi senqubo yokubopha.
• I-Aluminium (Al): I-Aluminium Wire isetshenziselwa kabanzi bond bondIng, ikakhulukazi kumadivayisi wamandla kanye nezicelo zezimoto. Kuyabizeleka kakhulu futhi kwakha isitebekile ubudlelwano nge-aluminium pads, ukugwema izingqinamba ezibonwayo igolide ne-aluminium. Izingqinamba zayo eziyinhloko ziphansi ukubangelanisa namandla aqhathaniswa negolide noma ithusi.
• Isiliva (AG): Izintambo zesiliva kuyindlela evelayo, ukunikela ukubangelanisa okungcono kakhulu kunegolide endaweni ephansi yamanani. Ucwaningo luyaqhubeka lubonakala ngokugcwele ukuthembeka kwabo kwesikhathi eside.

EDongxin, sinikeza uhla lwezinto zokuhlanza okuphezulu, kufaka phakathi I-Aluminium Wire Emsulwa, ngoba siyakuqonda ukuthi ukuba nelungelo uwaya isinyathelo sokuqala sokufinyelela esiphelele isibopho sentambo.

Iyiphi indima ububanzi obuyindidayo ku-Wire Bond ethembekile?

Le khasi ububanzi bentambo yipharamitha eyisisekelo echaza izici zikagesi nezemishini ze ukuxhuma. Ukukhethwa kwe ibanga elinquma phakathi ububanzi besingelezi kungukuhweba phakathi kwezidingo zokusebenza kanye nezinkinga zomzimba.

A ucingo omncane (imvamisa nge ibanga elinquma phakathi ububanzi besingelezi phakathi kwama-microns ayi-15 no-75) kusetshenziselwa ukuxhumana kwesiginali ku I-Microelectonics, lapho isikhala sikwi-premium. Lezi izintambo ezinhle zibalulekile pitch enhle Izicelo, ezivumela izinkulungwane zokuxhumeka kokukodwa Idivaysi ye-semiconductor. Inselelo nge ucingo omncane kuqinisekiswa ukuthi kunganele Amandla eBond futhi ingathwala okudingekayo okukhona ngaphandle kokushisa ngokweqile.

Ngakolunye uhlangothi, obukhulu uwaya ukubopha (usebenzisa ububanzi bezintambo Kusuka kuma-micron ayi-100 kuye kwangama-500) kusetshenziswa kumandla we-elekthronikhi wamandla kanye namamojula wezimoto. Lokhu kukhulu ibanga elinquma phakathi ububanzi besingelezi uwaya Iyakwazi ukuphatha amasondo aphezulu futhi inikeze okuqinile kakhulu, okunamandla ngokwengeziwe Izakhiwo zemishini. Le khasi Imishini yokubopha i-wire ubukhulu uwaya kumele ikwazi ukusebenzisa amandla amaningi kakhulu futhi amandla e-ultrasonic ukwakha okufanele bulala phambili. Ukukhetha okufanele ububanzi bentambo isinyathelo esibalulekile ekwakheni okuthembekile isibopho sentambo Isu.

Imishini yesimanje yokufaka intambo ifinyelela kanjani ukunemba okuphakeme kangaka?

-Isimanje Imishini yokubopha i-wire zimangaza ubunjiniyela be-metatronic. Aziwona amathuluzi alula kepha amasistimu ama-robotic anenkimbinkimbi enzelwe ukunemba nokunemba okungaphansi komlimi. Ukucaciswa kwabo kuvela ekuhlanganiseni ubuchwepheshe obuningi obubalulekile:

• Amarobhothi athuthukile: Izinhlelo eziphakeme ze-X-Y-Z-Z zingenisa ithuluzi lokubopha ngaphezulu I-Bond Pad ngesivinini esimangalisayo nokuphindaphinda.
• Umbono Womshini: Ikhamera enesinqumo esiphakeme nesoftware yokuqashelwa iphethini ikhomba indawo ngqo ye I-Bond Pads ku anzini afe futhi i-substrate. Lolu hlelo lunxephezela ngokuzenzakalelayo nganoma yikuphi ukuphathwa kabi kwensiza, eqinisekisa uwaya inamathiselwe ngqo ngaso sonke isikhathi.
• Amandla aqondile nokulawula amandla: Le khasi umshini we-weldingI-CORORE YABO Ikhono layo lokusebenzisa amanani alawulwa ngokuqondile alawulwa, amandla e-ultrasonic, nokushisa. Lezi amapharamitha ahlanganisa zihlelekile futhi zingashintshwa ngesikhathi sangempela ukuze kuqinisekiswe ukuthi kuphelele ubudlelwano Kuwo wonke umuntu uwaya.
• Ukuqapha Inqubo Yesikhathi sangempela: Izinzwa ezithuthukile ziqapha Inqubo Yokubopha Nge-Wire, ukuthola ama-anomalies angakhombisa ubuthakathaka ubudlelwano. Lokhu kuvumela ukulungiswa ngokushesha futhi kuqinisekise ukuphuma kwekhwalithi ephezulu.

Imishini efana neyethu Umshini wokubopha ama-Igbt ziklanyelwe ngokukhethekile ukuphatha izimfuno ezinzima zamandla i-semiconductor Ukukhiqiza, ukuhlanganisa lobu buchwepheshe ukukhiqiza okuthembeke kakhulu isibopho sentambos.

Uyini umehluko phakathi kwesibopho sokuqala kanye nesibopho sesibili?

Le khasi Inqubo Yokubopha Nge-Wire kubandakanya ukudala ukuxhumana namaphuzu amabili ahlukile: isibopho sokuqala kanye Isibopho sesibili.

Le khasi isibopho sokuqala yenziwa ngqo ku I-Bond Pad ye i-semiconductor kufa (Ig). Lokhu kubaluleke kakhulu futhi kuyinselele kwalokhu okubili, njengokuyisisekelo anzini iyantekenteke futhi ingalimala kalula. Ngegolide uwaya ukubopha, the isibopho sokuqala ngokujwayelekile a ibhondi yebhola. Inhlansi kagesi incibilikisa i ukuphela kocingo Ukwakha indawo encane, eyayihlanganiswa ephepheni.

Le khasi Isibopho sesibili yenziwa ku-leadframe noma i-substrate exhumanisa abafayo nephakethe ngalinye noma I-PCB. Le nhloli ngokuvamile ibucayi kunabafe. Ebholeni lokubopha ibhola, Isibopho sesibili Ingabe "ukushukumiswa" okwenziwe nge-wedge ubudlelwano. Ngemuva kwalokhu ubudlelwano yakheka, the uwaya iboshwe futhi idwengulwe ukuqala umjikelezo olandelayo uwaya. E-aluminium uwaya ukubopha, bobabili isibopho sokuqala na- Isibopho sesibili bakhona bond bonds, wadala usebenzisa ithuluzi elibunjwe nge-wedge ngaphandle kokwenza ibhola. Ubuqotho bobabili isibopho sokuqala na- Isibopho sesibili kubalulekile ukuze uphumelele ukuxhuma.

Kungani ukufeza i-metallurgical eqinile ebaluleke kangaka?

Ukuthola iqiniso isibopho se-metallurgical umgomo wokugcina we isibopho sentambo inqubo. Lokhu kuhluke ngokuyisisekelo kusuka ku-weld elibandayo elibandayo noma ukungqubuzana okulungile. A isibopho se-metallurgical ukuxhumana kwe-intertomic lapho ama-athomu evela uwaya kanye I-Bond Pad Yabelana ngogesi, ukudala isakhiwo esisodwa, esiqhubekayo sensimbi. Lolu hlobo lwe bulala phambili kubalulekile ngenxa yezizathu ezimbili eziphambili:

1. Ukusebenza kukagesi: Okuphelele isibopho se-metallurgical inikeza ukumelana kukagesi okuphansi kakhulu. Ompofu bulala phambili Kungadala isikhombimsebenzisi esilinganiselwe esikhiqiza ukushisa, ukucekela phansi ukuthembeka kwesiginali, futhi ekugcineni kungaholela ekuhlulekeni kwamadivayisi.
2. Ukwethembeka kwesikhathi eside: Okunamandla bulala phambili kubalulekile ukuze usinde izingcindezi ze impamba Ukuhamba ngebhayisikile. Njengoba idivaysi ishisa futhi ipholile, izinto zokwakha kanye nenkontileka ngamanani ahlukene (Ukunwebeka okushisayo). Okubuthakathaka ubudlelwano kuzokhathala futhi kwehluleke ngaphansi kwale ngcindezi, ikakhulukazi ngaphakathi Izimo ezinokhahlo njengezicelo zezimoto noma ze-aerospace. Le khasi Amandla eBond kususelwa kokuhle isibopho se-metallurgical iqinisekisa uwaya Ukuxhumana kuhlala kuhlala kungukuphila konke kwedivayisi.

Yimaphi amapharamitha asemqoka ongawalawula emshinini we-welding ukuze abuyiselwe ngocingo?

Ngonjiniyela njengoMarcus, olawula i- umshini we-welding imayelana nokwenza kahle ukhiye amapharamitha ahlanganisa. Ukuthola leli lungelo kubalulekile kwinqubo ephindaphindekayo nephezulu. Ngenkathi amanani ngqo ancike ku- ukubopha izintambo ezithile Isicelo, amapharamitha ayinhloko yile:

• Amandla (noma ingcindezi): Leli inani lamandla omzimba ithuluzi lokubopha lisebenza ku uwaya na- I-Bond Pad. Amandla amancane kakhulu aphumela ekubuthakathaka ubudlelwano; kakhulu kungalimaza i-semiconductor afe.
• Amandla e-Ultrasonic: Lokhu kungukuphakanyiswa kokuvezwa okuthe xaxa. Inikeza amandla okukhohla adingekayo ku Dala isibopho. Amandla kufanele ahlelwe ngokucophelela ububanzi bentambo nezinto ezibonakalayo.
• Isikhathi: Lesi isikhathi lapho kusetshenziswa khona amandla we-ultrasonic, ngokujwayelekile kulinganiswa kuma-millisecond.
• Lokushisa: Esibhodlweni se-thermosonic, lokhu kushisa kwesigaba esifudumele kubambe i-substrate.

Ukwenza kahle le "iresiphi" enobukhulu obuningi kubalulekile ukubopha okuhle. Kudinga ubuchwepheshe nokuhlolwa kwe-Empirical ukuthola ibhalansi ephelele yanoma iyiphi inhlanganisela enikeziwe ye uwaya, die, futhi i-substrate.

Uxazulula kanjani ukwehluleka kwebhondi evamile?

Noma inqubo elawulwa kakhulu, kungenzeka ukwehluleka. Ukuqonda izimpande zabo zembangela kuyisihluthulelo sokugcina umugqa wokukhiqiza ophezulu. Nazi izindaba ezimbalwa ezijwayelekile:

• I-Bond Phakamisa: Yilapho isibopho sokuqala (ibhola noma wedge) akunamathele ku I-Bond Pad. Imbangela evame kakhulu ukungcoliswa komhlaba (e.g., oxides, amakhemikhali asele). Kungabangelwa futhi okungalungile amapharamitha ahlanganisa, njengamandla anganele noma amandla e-ultrasonic.
• Isithende Crack: Le khasi uwaya iphuka "isithende" noma iphuzu elincane kakhulu le Isibopho sesibili. Lokhu kuvame ukubangelwa ukuguqulwa ngokweqile kwe uwaya kusuka kumandla amakhulu abugqilayo noma ithuluzi lokuguga. Ithuluzi eliphakeme, njenge Ithuluzi elenziwe ngesibopho se-Wedge, inganciphisa le nkinga.
• Intambo ye-sag noma ukukhukhula: Le khasi uwaya I-Loop yi-misshapen, kungenzeka ukuthi ifinyezeke eduze uwaya. Lokhu kungabangelwa ukungezwani okungalungile ngocingo ku Imishini yokubopha i-wire noma ngamandla kagesi ngesikhathi esilandelayo sepulasitiki.
• Ukugenca: Amandla eBonding aphezulu kakhulu, aqhekeka ngokubuthaka anzini ungqimba ngaphansi I-Bond Pad. Lokhu ukwehluleka okuyinhlekelele futhi kudinga ukulungiswa ngokushesha kwamandla okubopha.

Yiziphi izindlela zesikhathi esizayo kubuchwepheshe bokubopha ngocingo?

Le khasi isibopho socingo Imboni ihlala ivela ukuze ihlangabezane nezidingo zesizukulwane esilandelayo Ama-Electronics. Izitayela ezimbalwa ezibalulekile zibumba ikusasa lazo:

• I-Ultra-Fine Pitch: Njengoba ama-chips eba yinkimbinkimbi ngokwengeziwe, inani le-I / O Pads liyanda, libephoqa ukuthi basondele ndawonye. Isibopho socingo iyavumelana ne pitch enhle Amakhono angaphansi kwama-microns angama-35, edinga imishini eqondile eqondile futhi enobuhle ububanzi bezintambo.
• Izinto zokwenziwa ezintsha ze-wire: Ukuthuthukiswa kwe-palladium ucingo lwethusi, isiliva eliboshwe uwaya, namanye ama-alloys ahlose ukuhlanganisa izinzuzo zezinsimbi ezihlukile - njenge ukubangelanisa yethusi ngokumelana nokugqwala kwezinsimbi eziyigugu.
• I-Power Electronics: Ukukhuphuka kwezimoto zikagesi namandla avuselelekayo kucindezela isidingo sobukhulu uwaya ukubopha usebenzisa ezinkulu ibanga elinquma phakathi ububanzi besingelezi I-Aluminium Wire Futhi izimbambo zethusi zethusi ukuphatha amakhulu ama-amps wamanje.
• Ukwanda okuzenzakalelayo ne-AI: -Phambili Imishini yokubopha i-wire kuzofaka ubuhlakani obuthe xaxa, kusetshenziswa i-AI ukuzenzela ngokwakho amapharamitha ahlanganisa Kusikhathi sangempela kanye nokubikezela izidingo zokugcina, okwengeziwe ngokwandisa isivuno kanye nokunciphisa isikhathi sokuphumula.

Ukuthathwa Key

Ukukwazisa i- isibopho sentambo uluhambo oluqhubekayo lokunemba nokulawula inqubo. Nazi izinto ezibaluleke kakhulu okufanele uzikhumbule:

• Umgomo yi-metallurgical weld: Kuphumelele isibopho sentambo yi-athomu yeqiniso bulala phambili, qinisa ugesi ophakeme, impamba, nokusebenza kwemishini.
• Indlela Yendlela Ebalulekile: I-Thermosonic Bonding iyindlela ejwayelekile embonini, ehlanganisa ukushisa futhi amandla e-ultrasonic Okokushesha futhi okuqinile ubudlelwano.
• Ukukhetha okubonakalayo kubalulekile: Ukukhethwa kwe wire bonding (Igolide, ithusi, i-aluminium) liyinkimbinkimbi yokuhweba phakathi kwezindleko, ukubangelanisa, kanye nokuthembela.
• Imishini yibanikeli: -Isimanje Imishini yokubopha i-wire ziyizinhlelo eziqonde ngqo zamarobhothi ezilawula zonke izici zenqubo, ukusuka endaweni yokubeka ekusebenziseni amandla aphezulu okubopha.
• Amapharamitha kumele aphelele: Impumelelo yazo zonke uwaya Kuya ngeresiphi ephelele yamandla, amandla, isikhathi, nokushisa, ehambisana nesicelo esithile.