Nhungamiro yeinjiniya kune Wire Boging Machina uye Iyo Yakakwana Wire Bond

Mubasa rangu kuDongxin Electronic tekinoroji, ini ndinowanzo taura neinjiniya wepamutemo seMarcus muGerman kana Kutungamira R & D Zvikwata muSouth Korea. Nhaurirano dzatinayo hadzina kana dzisingawanzo sora; Ivo vanosvetukira mune iyo microscopic nyika ye semicononductor Kukatwa, uko imwe, yakakanganiswa, inokanganiswa, idiki pane bvudzi revanhu, rinogona kupa mamirioni emadhora-madhora asina basa. Kuvimbika kweazvino Electronics yakavakwa pamusoro pekukwana kwe Wire Bond. Izvi hazvisi zvekungosanganisira maviri mapoinzi; ndezvekugadzira robust, yakasimba-nyika weld izvo zvichatsungirira kwemakore pasi pemamiriro ezvinhu anodikanwa. Chinyorwa ichi ndecheinjiniya weNewiniya anonzwisisa kuti kuita kwechigadzirwa chavo chekupedzisira kunoenderana nemhando yeumwe neumwe wega Kubatana. Isu tichaenda kupfuura izvo zvekutanga kuti tiongorore nuances Wire Boging Machina, sarudzo dzinotsoropodzwa mukati Wire zvinhu, uye fizikisi inotonga yakakwana Wire Bond.

Chii chinonzi waya yekubatanidza maitiro?

Pamusimboti wayo, Wire Bonding ndiyo maitiro yekugadzira Kubatana kwemagetsi uchishandisa Wires yakanaka kubatanidza a Semiconductor mudziyo, seDunhu rakabatanidzwa (IC), kune kwayo kurongedza kana substrate, senge dunhu redunhu rakadhindwa (PCB). Ndiyo inonyanya kushandiswa nzira yekugadzira magetsi Kubatanas muri microelectronics indasitiri nekuda kwekuchinjika kwayo uye mutengo-kushanda. Chinangwa hachisi kungoita kuti ubate muviri asi kuti ugadzire chokwadi, chakasimba-nyika weld Pakupera kwega kwega waya.

Izvi Metallurgical Bond inovimbisa nzira isina kusema yezviratidzo zvemagetsi uye kupisa, izvo zvakakosha pakuita kwemudziyo uye hurefu. Kusiyana netsika yechinyakare, the Wire Boging Process kazhinji kunoitika pane microscopic chiyero, kubata a waya Izvi zvinogona kuve zvakawanda zvakaderera pane bvudzi revanhu. Kunaka kweizvi Wire Bond ndiyo nheyo pane iyo kuvimbika kwevanovavarira kusingaverengeki zvigadzirwa zvemagetsi yakavakwa. Zvese waya Inofanirwa kuiswa zvakakwana uye yakasungwa kuti ikurudzire kubatana kusingaperi.

Ndeipi iyo main aire waya yekubatanidza maitiro?

Nepo chinangwa chiri nguva dzose chakasimba weld, kune akati wandei Wire Boging Techniquees yaishandiswa kuita izvozvo. Iyo sarudzo yenzira inoenderana nezvinhu, application, uye inofungisisa. Matanho matatu ekutanga ndeaya:

1. Thermocompression Bonding: Izvi zvepakutanga Bonding nzira inovimba pane iyo yakapusa asi inoshanda musanganiswa we kupisa uye kumanikidzwa. Chishandiso chakatsvuka chinomanikidza Kuronga waya kupokana substrate kana Bond Pad. Iko kusanganiswa kwesimba uye simba simba rinokonzera maatomu e waya uye pad padwo kusanganisa kune mumwe, kugadzira yakasimba chisungo. Iyo yakachena uye yakavimbika asi inogona kunonoka uye iyo yakanyanya kupisa haina kukodzera kune zvimwe zvinangwa zvinyoro-nyoro.

2. Ultrasonic Bonding: Iyi nzira ndeyekutonhora maitiro, iyo ndiyo yakanakira mukana. Inoshandisa chishandiso chinobvarura pane yakakwira frequency (kazhinji 20-60 KHz) kuputira waya zvinopesana naIshe Bond Pad. Izvi Ultrasonic simba inoshandiswa kuputsa nzvimbo yemukati uye gadzira yakasimba-nyika weld Kuburikidza nekukatyamadza neplastiki deformation. Izvo zvakanakira kupisa-zvinonyadzisira zvishandiso uye ndiwo mwero we Aluminium Wire kusungwa.

3. Thermonic Bonding: Iyo yemazuva ano workthorse yeindasitiri, nzira iyi inosanganisa zvakanakisa zvenyika. Inoshandisa kupisa uye ultrasonic simba panguva imwe chete. The the substrate inopisa (kazhinji kusvika kwakatenderedza 150 ° C), iyo inowedzera zvinhu uye inoita kuti maitiro ekugadzira ave nyore. Ipapo, pulse ye Ultrasonic Energy inoiswa kupedzisa iyo Metallurgical Bond. Iyi nzira iri kukurumidza, yakavimbika, uye inogadzira yakasimba kwazvo Wire Bond, ichiita kuti iite hunyanzvi hwekuita goridhe waya kusungwa mukati Kugadzirwa kwepamusoro-vhoriyamu.

Kusarudzwa kwezvinhu kwakasimba sei kune waya yekubatira?

The the kusarudzwa kwezvinhu zve Kuronga waya ndechimwe chezvakanyanya kutsoropodza sarudzo mune zvese Kugadzira maitiro. The the Wire zvinhu zvakananga zvinokanganisa chisungoS zvivakwa zvemagetsi, michina yezvivakwa, kuvimbika, uye mutengo. Zvishandiso zvekutanga zvinoshandiswa nde:

• Goridhe (AU): Kwemakumi emakore, goridhe yaive iyo indasitiri chiyero che Wire Kubatira. Zvinonyanya kuramba kuora kuora, zvakanyanyisa, uye zvine zvakanaka magetsi maitiro. Kupfava kwaro kunoita kuti zvive nyore kuumba a BALL BCHAS. Nekudaro, yakakwira Mari yegoridhe yadzinga indasitiri kuti utsvage dzimwe nzira. Imwezve hanya ndiyo yekuumbwa kweBrittle goridhe-aluminium intermfetallics . Kuvimbika nyaya kana isina kunyatsogadziriswa.
• Copper (cu): Copper waya rave imwe nzira yakakurumbira kune goridhe. Inopa yepamusoro Magetsi uye anofambisa uye zvakanyanya mutengo-unoshanda. Nekudaro, mhangura yakaomesesa kupfuura goridhe, iyo inogona kukonzera kudzikisira kukuvadza pane anonzwa silicon Bond Pad kana Kuronga paramita hazvina kudzorwa zvakakwana. Izvo zvakare zvinotarisirwa kune oxidation, inoda iyo inert symphere panguva yekubatira.
• Aluminium (al): Aluminium Wire inoshandiswa zvakanyanya Wedge Bonding, kunyanya mukushandisa kwemagetsi uye zvigadzirwa zvemotokari. Iyo inodhura kwazvo uye inogadzira yakagadzikana chisungo neAluminium mapads, kudzivirira izvo nyaya dzinoonekwa ne goridhe uye aluminium. Yayo yekutanga dhizaini yakaderera Kuita uye simba rakaenzana negoridhe kana mhangura.
• Siliva (AG): Sirivheri Wires isarudzo yekubuda, kupa Kuita zviri nani pane goridhe pane yakaderera mutengo point. Tsvagurudzo iri kuenderera mberi kuti iite zvizere kuvimbika kwavo kwenguva refu.

KuDongxin, isu tinopa huwandu hwezvinhu zvakakwirira-zvakanyanyisa, kusanganisira yakachena aluminium waya, nekuti tinonzwisisa kuti kuve nekodzero waya ndiyo nhanho yekutanga yekuwana yakakwana Wire Bond.

Ibasa ripi rinotamba neyakaitwa neyakagadzirirwa waya yakavimbika?

The the waya diamita isimbe yakakosha iyo inoenderana neyemagetsi uye mechanic maitiro e Kubatana. Sarudzo ye dhayamita Iko kutengeserana-kubva pakati pekuita zvinodiwa pakuita uye zvinopesana zvemuviri.

A yakaonda waya (kazhinji ne dhayamita pakati pemakore gumi nemashanu kusvika makumi manomwe neshanu) inoshandiswa kune chiratidzo chekubatanidza mukati microelectronics, uko nzvimbo iri pane premium. Izvi Wires yakanaka zvakakosha here gomba rakanaka Zvikumbiro, kubvumira kuzviuru zvezvibatanidzwa pane imwe chete Semiconductor mudziyo. Dambudziko ne yakaonda waya iri kuita kuti iwane zvakakwana Bond Simba uye inogona kutakura inodiwa iripo pasina kufarirwa.

Zvakare, gobvu waya kusungwa (kushandisa diameter waya Kubva pamakumi maviri kusvika pamadhora mazana mashanu) inoshandiswa mune magetsi magetsi uye emagetsi modules. Izvi zvakakura dhayamita waya inogona kubata yakakwira mafungu uye inopa yakasimba zvakanyanya, kuwedzera kusimba michina yezvivakwa. The the Wire Boging Machina for gobvu waya inofanirwa kukwanisa kuisa zvakanyanya simba rakawanda uye Ultrasonic Energy kugadzira yakakodzera weld. Kusarudza zvakakodzera waya diamita inhanho yakakosha mukugadzira yakavimbika Wire Bond zano.

Mazano emazuva ano aya anofamba sei anokwana kuita zvakakura zvakadaro?

Zvazvino Wire Boging Machina zvishamiso zveMecatronic Injiniya. Ivo havasi zvishandiso zviri nyore asi zvakanyatsonaka robotic masisitimu akagadzirirwa kumhanya uye sub-micronje chokwadi. Chairo yavo inouya kubva mukubatanidzwa kwenyaya dzinoverengeka kiyi:

• Yepamberi Robotic: Yakakwira-kumhanya x-y-z motoms masisitimu inogona kuomesa chishandiso chekubatanidza pamusoro pezvakakodzera Bond Pad nekumhanya kunoshamisa uye kudzokorora.
• Muchina kuona: Iyo yakakwira-resolution kamera uye yekuziva iyo software software inozivisa iyo chaiyo nzvimbo ye Bond Pads pane silicon kufa uye substrate. Iyi system inokonzeresa kune chero kushoma kiripisi yemushini, ichiva waya inosungirirwa chaizvo nguva dzese.
• Chairo simba uye simba rekudzora: The the Welding Machine'S Core ndiko kugona kwayo kushandisa zvakakwana zvinodzorwa zviyero zveimba, Ultrasonic Energy, uye kupisa. Izvi Kuronga paramita zvirongwa uye zvinogona kugadziridzwa mune chaiyo-nguva yekuona yakakwana chisungo kune yega yega waya.
• Maitiro Echokwadi Kuongorora: Yepamberi Sensors Tarisa iyo Wire Boging Process, kuona anomaries ayo anogona kuratidza kushaya simba chisungo. Izvi zvinobvumidza kururamisa nekukurumidza uye nechokwadi chinovimbisa kukwirira kwemhando yepamusoro.

Michina kunge yedu IGBT Kubatira Machine dzakanyatsogadzirirwa kubata iyo inoshatisa zvinodiwa zvesimba semicononductor Kugadzirwa, Kubatanidza izvi matekinoroji kuti ubudise zvakavimbika zvakanyanya Wire Bonds.

Ndeupi musiyano uripo pakati pekutanga chisungo uye chisungo chechipiri?

The the Wire Boging Process inosanganisira kugadzira kubatana kune maviri akasiyana mapoinzi: The Chekutanga Bond uye Chisungo chechipiri.

The the Chekutanga Bond inogadzirwa zvakananga ku Bond Pad ye semicononductor kufa (IC). Izvi ndizvo zvinonyanya kutsoropodza uye zvakaoma nezvevaviri, sekureva kuri kuita silicon haina kusimba uye inogona kukuvadzwa zviri nyore. Yegoridhe waya kusungwa, Chekutanga Bond kazhinji a BALL BCHAS. Emagetsi spark inonyauka kupera kwe waya Kuti ugadzire diki diki, iyo yakabva yasungwa padanho.

The the Chisungo chechipiri yakagadzirwa pane inotungamira kana substrate iyo inobatanidza kufa kune iyo yakasara yepakeji kana PCB. Ichi chinangwa chinowanzove chisina hanya kupfuura kufa. Mubhora bhora, iyo Chisungo chechipiri idhi-yakaumbwa "stitch" chisungo. Mushure meizvi chisungo inoumbwa, iyo waya yakanyorwa uye kubvarurwa kuti itange kutenderera inotevera waya. Mu aluminium waya kusungwa, zvese zviri zviviri Chekutanga Bond uye Chisungo chechipiri vari Wedge BondS, yakagadzirwa uchishandisa wedhi-yakavezwa chishandiso pasina kugadzira bhora. Kuvimbika kweVose Chekutanga Bond uye Chisungo chechipiri yakakosha kuti ubudirire Kubatana.

Nei kuzadzisa yakasimba metallurgical weld yakakosha?

Kuzadzisa ichokwadi Metallurgical Bond ndicho chinangwa chikuru che Wire Bond maitiro. Izvi zvakasiyana zvakanyanya kubva kune yakapfava inotonhora weld kana kupokana kwakakodzera. A Metallurgical Bond inyanzvi yekuwirirana pane maatomu kubva ku waya uye Bond Pad Goverana Electrons, kugadzira imwe, kuenderera mberi mesimbi chimiro. Rudzi urwu rwe weld Ko kutsoropodzwa nekuda kwezvikonzero zviviri zvikuru:

1. Maitiro emagetsi: Akakwana Metallurgical Bond inopa yakaderera inogoneka magetsi kuramba. Murombo weld inogona kugadzira yakakwira-kupokana interface iyo inogadzira kupisa, inoshatisa chiratidzo chekuvimbika, uye inogona kupedzisira yatungamira mukutadza kwemudziyo.
2. Kuvimbika Kwese - Yakasimba weld yakakosha pakupona kushushikana kwe Thermal cycling. Sechigadzirwa chirahwe kumusoro uye chinotonhorera pasi, zvigadzirwa zvinowedzera uye chibvumirano pamitengo dzakasiyana (kuwedzera kwekuwedzera). Isina kusimba chisungo achaneta uye kutadza pasi pekunetseka uku, kunyanya mukati Nzvimbo dzeHarsh kunge manyorerwo or erospace application. The the Bond Simba inotorwa kubva kune yakanaka Metallurgical Bond anofunga kuti waya Kubatanidza kunoramba kuchine simba kune iyo yefirimu rese.

Ndeipi iyo kiyi parameter yekudzora pane welding mushini we waya kusungwa?

Kune mainjiniya saMarcus, achidzora Welding Machine ndezve mastering kiyi Kuronga paramita. Kuwana izvi kodzero iyi kwakakosha kune inodzokororwa uye yakakwirira-goho rekubereka. Nepo hunhu chaihwo hunobva pane Chairo waya waya application, iyo core parameter ndeye:

• Simba (kana kumanikidzwa): Uku ndiko kuwanda kwekumanikidza kwesimba rekubhomba rinoshanda kune waya uye Bond Pad. Kunyanya kusimba kunokonzerwa neisina kusimba chisungo; zvakawandisa zvinogona kukuvadza semicononductor kufa.
• Ultrasonic simba: Uku ndiko kukwirira kweiyo yakakwira-frequency vibrations. Iyo inopa simba rekutsvuka rinodiwa kuti gadzira chisungo. Simba rinofanira kunyatso kuganhurirwa waya diamita uye zvinhu.
• Nguva: Iyi ndiyo nguva iyo iyo iyo Ultrasonic simba rinoshandiswa, kazhinji rakayerwa mumamiriseconds.
• Tembiricha. MuTramossic Bonding, uku ndiko kupisa kweiyo nzvimbo yakashata yakabata iyo substrate.

Optimizing iyi yakawanda-dimensional "recipe" inokoshesesa Kurarama kwakanaka. Zvinoda hunyanzvi uye kuongororwa kwehunyanzvi kuti uwane chiyero chakakwana chekusanganiswa kwe waya, kufa, uye substrate.

Unotongedzera sei zvakajairika WIRE WIRE Bond?

Kunyangwe muchimiro chakadzorwa zvakanyanya, kutadza kunogona kuitika. Kunzwisisa zvinokonzeresa midzi yavo ndeye kiyi yekuchengetedza yakakwirira-yechibereko rwonzi rwonzi. Heano nyaya shoma dzakajairika:

• Bond simudza: Izvi ndipo apo Chekutanga Bond (bhora kana wedge) hainamananisi Bond Pad. Chikonzero chakajairika chakanyanya kusvibiswa pane pad pamusoro (i.e., oxides, makemikari akasara). Inogona zvakare kukonzerwa ne isiriyo Kuronga paramita, semaoko asina kukwana kana Ultrasonic Energy.
• Chitsitsinho: The the waya inopwanya pa "chitsitsinho" kana iyo yakaonda nzvimbo ye Chisungo chechipiri. Izvi zvinowanzo kukonzerwa nekunyanyisa kusvibisa kwe waya kubva kune yakawandisa kusungwa simba kana chishandiso chakasarudzika chekubatanidza. Chishandiso chemhando yepamusoro, senge a Yakagadzirirwa Wedge Bonding Tool, inogona kuderedza nyaya iyi.
• Wire Sag kana kutsvaira: The the waya loop ndeye missharpen, zvingangopfupi kupfupikisira padhuze waya. Izvi zvinogona kukonzerwa neasina chaya waya kushushikana pane Wire Boging Machina kana nemagetsi emauto electroces panguva inotevera purasitiki yekuwedzera.
• Cratose: Simba rekusungwa rakanyanya kukwirira, richikanganisa isina kusimba silicon dura pasi pe Bond Pad. Uku ndiko kutadza njodzi uye kunoda kugadziridzwa kwekukurumidza kusimba.

Ndeapi maitiro emangwana mune waya yekubatanidza tekinoroji?

The the Wire Kubatira indasitiri iri kugara ichishanduka kuzadzisa zvinodiwa zvinotevera-chizvarwa Electronics. Madekombe anoverengeka ari kuumba ramangwana rayo:

• Ultra-yakanaka pitch: Sezvo machipisi anova akaomarara, nhamba yeI / o Pads inowedzera, ichivanamatira pedyo pamwechete. Wire Kubatira inochinjika nayo gomba rakanaka kugona pazasi 35 microons, inoda michina chaiyo uye yakanaka diameter waya.
• New Wire Wire: Kuvandudzwa kwepalladium-coated Copper waya, sirivha yakarongedzwa waya, uye zvimwe zvinopihwa zvinangwa zvinobatanidza zvakanakira masimbi akasiyana-sema Kuita yedonhedhi ine iyo corrosion kuramba kwesimbi inokosha.
• Simba Magetsi: Iko kusimuka kwemotokari yemagetsi uye simba rekuvandudza riri kusundira kudiwa kwehupamhi waya Kubatira uchishandisa yakakura dhayamita Aluminium Wire uye kunyange mbichana yemhangura kubata mazana emamapipi emari iripo.
• Kuwedzera otomatiki uye AI: Remangwana Wire Boging Machina ichabatanidza zvakanyanya kungwara, uchishandisa AI kune kuzviratidza pachako Kuronga paramita Muchokwadi-nguva uye kufanotaura zvinodiwa zvekugadzirisa, kuenderera mberi nekuwedzera goho uye kuderedza nguva yekudzora.

Key Deaaroways

Mastering the Wire Bond rwendo rwekuenderera mberi rwekunyatsoita uye kugadzirisa maitiro. Hechino zvinhu zvinonyanya kukosha kuti urangarira:

• Chinangwa iSimbi Yesimba Weld: Kubudirira Wire Bond ishoko rechokwadi weld, kuona magetsi akakwirira, Thermal, uye maitiro ekuita.
• Maitiro ehunyanzvi: Thermonic Bonding ndiyo indasitiri chiyero, kusanganisa kupisa uye Ultrasonic Energy for the fast and st chisungo.
• Kusarudzwa kwezvinhu kwakakosha: Sarudzo ye Kuronga waya . Kuita, uye kuvimbika.
• Machina ndiwo anogonesa: Zvazvino Wire Boging Machina dzakanyatsojeka marobhoti masisitimu inodzora zvese zvikamu zvechirongwa, kubva pamamiriro ekushandisa simba razvino rekubatanidza simba.
• Paramita inofanira kuve yakakwana: Kubudirira kwese kwese waya Zvinoenderana nesarudzo yakakwana yesimba, simba, nguva, uye tembiricha, yakagadziriswa kune chaiyo application.