Isikhokelo seNjineli kwii-Wire zoomatshini bokwahlula kunye ne-wire ye-wire efanelekileyo

Kwindima yam kwiTekhnoloji ye-Elecxin, ndihlala ndithetha neenjineli zenkqubo eziphezulu ezinjengeMarcus eJamani okanye ekhokelayo kwi-R & D e-R & D eMzantsi Korea. Iingxoxo esinazo azifane zigqithe ngaphezulu; basebenza kwiLizwe leMicroscopic ye I-Semiconductor Ukupakisha, apho unxibelelwano olungatshatanga, olunamancinane, luncinci kuneenwele zomntu, zinokunikezela ngesixhobo esingenasigidi sedola. Ukuthembeka kwale mihla i-elektroniki yakhiwe phezu kokugqibelela kwe i-wire ye-wire. Oku akukhange kubekho ngokudibanisa amanqaku amabini; Imalunga nokwenza i-goob, ilizwe eliqinileyo weld Oko kuya kuhlala iminyaka phantsi kwemeko efunekayo. Eli nqaku leli nqaku le yeyokuqondakala injineli eqingqiweyo eqonda ukuba ukusebenza kwemveliso yabo yokugqibela kuxhomekeke kumgangatho ngamnye uqhagamshelo lwe. Siza kuhamba ngaphaya kweziseko zokujonga iimvakalelo ze oomatshini bokwenza ucingo, ukhetho olubalulekileyo kwi Izixhobo ze-cire, kunye ne-physics ezilawula igqibeleleyo i-wire ye-wire.

Ithini i-wire fire fit proPlally?

Kwinkalo yayo, I-wire i-boire yinkqubo yokudala Unxibelelwano lombane ukusebenzisa iingcingo ezilungileyo Ukudibanisa a Isixhobo se-semiconductor, njengesekethe elihlanganisiweyo (NDIYABONA), ukupakishwa kwayo okanye subsare, njengebhodi yesekethe eprintiweyo (I-PCB). Yeyona ndlela isetyenziswa kakhulu yokwenza umbane uqhagamshelo lwekwi i-microelectiics Umzi mveliso ngenxa yokuguquguquka kwayo kunye nokusebenza ngendleko. Injongo ayikokwenza nje ukunxibelelana ngokwasemzimbeni kodwa ukwenza inyani, ilizwe eliqinileyo weld kwisiphelo ngasinye se ucingo.

Le I-Mentellical Bond Iqinisekisa indlela engenamthungo yemiqondiso yombane kunye nobushushu, nto leyo ibalulekile kwintsebenzo yomsebenzi kunye nobomi obude. Ngokungafaniyo ne-welling yendabuko, I-Wire Sire Sport Inkqubo ihlala ivela kwinqanaba le-microscopic, ukuphatha i-a ucingo Oko kunokuba ngamaxesha amaninzi kuneenwele zomntu. Umgangatho woku i-wire ye-wire sisiseko esikuthembekileyo Izinto ze-elektroniki yakhiwe. Yonke ucingo kufuneka ibekwe ngokugqibeleleyo kwaye ibotshwe ukuqinisekisa unxibelelwano olungenasiphoso.

Zeziphi iindlela eziphambili zocingo?

Ngelixa injongo ihlala iqinile weld, zininzi Iindlela zokubonisa isetyenziselwe ukuyifezekisa. Ukukhetha kwendlela kuxhomekeke kwizixhobo, isicelo, kunye nokuqwalaselwa kwexabiso. Iindlela ezintathu eziphambili:

1. I-thermoctoction ibotshwe: Oku kwasekuqaleni indlela yokundedwa ixhomekeke kwindibaniselwano elula kodwa esebenzayo ye ubushushu kunye noxinzelelo. Isixhobo esishushu sicinezela i I-wire wire ngokuchasene nobushushu subsare okanye I-Bond pad. Ukudityaniswa kwamandla kunye namandla e-thermal kunokubangela iatom ye ucingo kunye ne-pad ukuba ihlukane omnye komnye, idala eyomeleleyo iqhina. Icocekile kwaye ithembekile kodwa inokuthoba kwaye ubushushu obuphezulu abuqinisekanga kwizinto ezithile ezibuthathaka.

2. I-Ultrasonic Bonding: Obu buchule yinkqubo ebandayo, ebaluleke kakhulu. Isebenzisa isixhobo esitshatisayo kwi-frequency ephezulu (i-20-60 khz) ukuya kukhangela i ucingo ngokuchasene ne I-Bond pad. Le I-Ultrasonic Energy isetyenzisiwe ukwaphula i-oxide ye-oxides kwaye kudale ilizwe eliqinileyo weld ngokusebenzisa i-fictions kunye neplastiki yeplastiki. Ilungele izixhobo ezibuthathaka zobushushu kwaye ngumgangatho we i-aluminium wire I-Bound.

3. I-thermosonic bond: Owona msebenzi wangoku weshishini, le ndlela idibanisa ezona zinto zilungileyo zehlabathi. Isebenzisa ubushushu kunye namandla e-ultrasonic ngaxeshanye. I subsare ifudumele (ngokuqhelekileyo ukuya kuthi ga kwi-150 ° C), ethambisa izixhobo kwaye yenza ukuba inkqubo ye-bond ibe lula. Emva koko, ipulse ye amandla e-ultrasonic isetyenziselwa ukugqibezela i I-Mentellical Bond. Le ndlela ihamba ngokukhawuleza, inokuqiniseka, kwaye idala eyomeleleyo kakhulu i-wire ye-wire, ukuyenza ukuba ibe yeyona ndlela iphambili UWire Wire Wire ngaphakathi Imveliso ephezulu.

Ngaba lubaluleke kangakanani ukhetho lwezinto zexabiso le-wires?

I Ukukhetha izinto ukwenzela i I-wire wire sesinye sezona zigqibo zibalulekileyo kuzo zonke Inkqubo yokwenziwa kwemveliso. I Izixhobo ze-cire Impembelelo ngqo iqhina's Iipropathi zombane, Iipropathi zoomatshini, ukuthembeka, kunye nexabiso. Izinto eziphambili ezisetyenzisiweyo zezi:

• Igolide (AU): Kumashumi eminyaka, igolide yayingumgangatho wecandelo I-wire bond. Inganyangeki kakhulu kukungasebenzi, i-ductile kakhulu, kwaye ilunge kakhulu Ukuqhutywa kombane. Ukuthamba kwayo kwenza kube lula ukwenza i Ibhondi yebhola. Nangona kunjalo, phezulu Ixabiso legolide iqhubela ishishini ukuba lifune ezinye iindlela. Enye inkxalabo kukusekwa kweBrittle I-Gold-Aluminium Intermetalics . Imicimbi yokuxhomekeka Ukuba ayilawulwa ngokufanelekileyo.
• Ubhedu (cu): Ucingo lobhedu iye yaba yinto ethandwayo kwigolide. Inika ngaphezulu ukuqhubela phambili kombane kunye ne-thermal kwaye kakhulu isebenza kakuhle emalini. Nangona kunjalo, ubhedu lunzima kunegolide, enokubangela ukonakala kokufumana umonakalo isilicon I-Bond pad ukuba I-rameter ye-rameters azilawulwa ngokugqibeleleyo. Ikwachaphazeleka kwi-oxidation, efuna i-Inimospheras ngexesha lenkqubo ye-Bondi.
• I-aluminium (Al): I-aluminium wire isetyenziselwa ngokubanzi Wedge BondIng, ngakumbi kwizixhobo zamandla kunye nezicelo zemoto. Ifikeleleke kakhulu kwaye iyenza izinzile iqhina ngeepads ze-aluminium, ukunqanda imiba ebonwe nayo igolide kunye ne-aluminium. Iindlela zayo eziphambili ziphantsi ukuqhubela phambili kwaye amandla athelekiswa negolide okanye ubhedu.
• Isilivere (AG): Iingcingo zesilivere Inketho evelayo, yokuhambisa ukuqhubela phambili nokuba ibhetele kunegolide kwinqanaba eliphantsi. Uphando luyaqhubeka nokubonakalisa ngokupheleleyo ukuthembeka kwabo kwexesha elide.

EDongxin, sinikezela ngeentlobo zezixhobo ezicocekileyo eziphezulu, kubandakanya I-wire ecocekileyo ye-aluminium, kuba siyayiqonda le nto yokuba nelungelo ucingo linyathelo lokuqala lokufezekisa impumelelo i-wire ye-wire.

Yeyiphi indima i-Wire iDie Sedleter idlala kwi-zungu ethembekileyo yelingo?

I Ububanzi beWire yiparamitha esisiseko echaza iimpawu zombane kunye noomatshini be uqhagamshelo lwe. Ukhetho lwe ububanzi yindawo yokusebenza phakathi kweemfuno zomsebenzi kunye nokunqongophala komzimba.

A ucingo olucekeceke (Ngokwesiqhelo nge ububanzi phakathi kwe-15 ne-75 microns) isetyenziselwa uqhagamshelo lomqondiso kwi i-microelectiics, apho indawo ikwiprimiyamu. Ezi iingcingo ezilungileyo zibalulekile isitayile esihle Izicelo, zivumela amawaka onxibelelwano kwilinye Isixhobo se-semiconductor. Umngeni nge-a ucingo olucekeceke Ukuqinisekisa ukuba yanele amandla eBondo kwaye unokuthwala okufunekayo okwangoku ngaphandle kokukhathazeka.

Ngokuchaseneyo, mnyama ucingo Bond (usebenzisa I-Diameter icingo Ukusuka kwi-100 ukuya kwi-500 microns) isetyenziswa kwiimodyuli zamandla kunye neemodyuli zemoto. Oku kukhulu ububanzi ucingo inokujongana nemijikelezo ephezulu kwaye ibonelela kakhulu, ngakumbi Iipropathi zoomatshini. I oomatshini bokwenza ucingo ubukhulu ucingo kufuneka ikwazi ukusebenzisa amandla amakhulu kwaye amandla e-ultrasonic ukwenza into efanelekileyo weld. Ukukhetha ngokufanelekileyo Ububanzi beWire linyathelo elibalulekileyo ekufumaneni ukuthembeka i-wire ye-wire Isicwangciso-qhinga.

I-wire yocingo yanamhlanje iphumeza njani oomatshini bokungafaniyo?

Yanamhlanje oomatshini bokwenza ucingo zimangalisiwe kubunjineli. Ayizizo izixhobo zilula kodwa iinkqubo zerobhothi ezinobunkunkqele ezenzelwe ngesantya kunye nokuchaneka kwamachaphaza. Ukuchaneka kwabo kuvela kudityaniswa kwetekhnoloji yesitshixo yeqhosha:

• Iirobhothi eziphambili: Iinkqubo eziphakamileyo ze-X-Y-Z-Z-Z I-Bond pad ngesantya esimangalisayo kunye nokuphindaphinda.
• Umbono womatshini: Ikhamera yekhamera yekhamera kunye ne-Camction Isoftware ichonge indawo eyiyo I-Bond pads kwi isilicon ukufa kwaye subsare. Le nkqubo inyanzelisa ngokuzenzekelayo nayiphi na into encinci yesixhobo, uqinisekisa i ucingo iqhotyoshelwe ngokuchanekileyo rhoqo.
• Ukuchaneka Kulawulo kunye nolawulo lwamandla: I Umatshini weWeldlingIsiseko esiphambili kukukwazi kwayo ukusebenzisa izixa ezilawulwa ngokuchanekileyo, amandla e-ultrasonic, nobushushu. Ezi I-rameter ye-rameters ziyasebenza kwaye zinokuhlengahlengiswa ngexesha lokwenyani ukuqinisekisa ukuba kufanelekile iqhina Kuyo yonke into ucingo.
• Inkqubo yexesha lokwenyani: Iinzwane eziphambili zibeka esweni i I-Wire Sire Sport Inkqubo, fumanisa i-anomalies enokubonisa ubuthathaka iqhina. Oku kuvumela ukulungiswa kwangoko kwaye kuqinisekisa iziphumo ezikumgangatho ophezulu.

Oomatshini banjenga bethu I-Igbt Bond zenzelwe ngokukodwa ukuphatha iimfuno ezinzima zamandla I-Semiconductor ukuvelisa, ukudibanisa ezi teknoloji ukuvelisa eyona inokuthenjwa i-wire ye-wires.

Nguwuphi umahluko phakathi kweqhina lokuqala kunye neqhina lesibini?

I I-Wire Sire Sport Inkqubo kubandakanya ukudala unxibelelwano ngamanqaku amabini ahlukeneyo: I-Bondy yokuqala kwaye i I-Bond yesibini.

I I-Bondy yokuqala yenziwe ngqo kwi I-Bond pad ye I-Semiconductor ukufa (NDIYABONA). Oku kubaluleke kakhulu ngakumbi kwaye ucelomngeni kwezi zinto zimbini, njengoko usisiseko isilicon ibuthathaka kwaye ingonakaliswa lula. Yegolide ucingo I-Boing, i I-Bondy yokuqala Ngokwesiqhelo Ibhondi yebhola. I-spark yombane inyibiliki ukuphela kocingo Ukwenza indawo encinci, leyo ibotshwe kwipali.

I I-Bond yesibini yenziwa kwi-verframe okanye subsare idibanisa ukufa kwiphakheji yonke okanye I-PCB. Ithagethi ngokubanzi ayibuthwala ngakumbi kuno-dis. Kwibhola ebila, I-Bond yesibini Ngaba yi-Wedge-Statt " iqhina. Emva kwale nto iqhina yenziwa, i ucingo ikhutshiwe kwaye iqwengiwe ukuba iqale umjikelo welandelayo ucingo. Kwi-aluminium ucingo I-Bound, zombini I-Bondy yokuqala kwaye I-Bond yesibini zikhona Wedge BondS, yenziwe usebenzisa isixhobo esimiweyo somtshato ngaphandle kokwenza ibhola. Ingqibelelo ye I-Bondy yokuqala kwaye I-Bond yesibini ibalulekile kwimpumelelo uqhagamshelo lwe.

Kutheni le nto ifezekisa i-METTALMPUGN EBALULEKILEYO?

Ukufezekisa iyinyani I-Mentellical Bond yeyona njongo iphambili ye i-wire ye-wire inkqubo. Oku kusisiseko ngokwahlukileyo kwi-supld elula okanye i-fanctions efanelekileyo. A I-Mentellical Bond Unxibelelwano olukhona apho ii-atom ezivela kwi ucingo kwaye i I-Bond pad Yabelana ngee-elektroni, udala isakhiwo esingatshatanga. Olu hlobo lwe weld Ibalulekile kwizizathu ezibini eziphambili:

1. Ukusebenza kombane: Igqibelele I-Mentellical Bond inika olona thintelo lusezantsi lokunganyangeki. Ihlwempu weld Unokwenza unxibelelwano oluphezulu lokuxhathisa okuphezulu ovelisa ubushushu, ingqibelelo yesibonakaliso, kwaye ekugqibeleni ikhokelele ekungaphumeleli kwecebo.
2. Ukuthenjwa kwexesha elide: Yomelele weld ibalulekile ekusindeni uxinzelelo lwe i-thermal ukuhamba ngebhayisikile. Njengesixhobo esijonge phezulu kwaye sipholile, izixhobo zanda kunye nemvumelwano kumanqanaba ahlukeneyo (Ukwanda kwe-shirmal). Ubuthathaka iqhina iya kuba nokudinwa kwaye iphumelele phantsi koxinzelelo, ngakumbi ngaphakathi iindawo ezinzima njengokhetho lweemoto okanye izicelo ze-aerospace. I amandla eBondo ifunyenwe ngokulungileyo I-Mentellical Bond iqinisekisa i ucingo Unxibelelwano luhlala luhleli kwi-Liessepan epheleleyo.

Yeyiphi imilinganiselo ephambili yokulawula umatshini we-welding we-wire?

Injineli njengeMarcus, ukulawula i Umatshini weWeldling imalunga nokusebenzisa isitshixo I-rameter ye-rameters. Ukufumana ezi meko kubalulekile kwaye zinemifutshane. Ngelixa amaxabiso axhomekeka kwi Ucingo oluthile Isicelo, iiparameter eziphambili zezi:

• Nyanzela (okanye uxinzelelo): Esi sisixa semisebenzi yomzimba isixhobo sokuxhobisa sisebenza kwi ucingo kwaye I-Bond pad. Amandla amancinci kakhulu kubangela ubuthathaka iqhina; kakhulu kakhulu kakhulu I-Semiconductor ufe.
• Amandla e-Ultrasonic: Olu luphawu lwezinto eziphezulu ze-free. Inika amandla okreqa efunekayo Yenza iBond. Amandla kufuneka aphathwe ngononophelo Ububanzi beWire kunye nezinto.
• Ixesha: Eli lixesha apho kusetyenziswa amandla ombane, ngokuqhelekileyo ukulinganiswa kwii-milliseconds.
• Iqondo lokushisa: Kwi-thermosonic boing, eli liqondo lobushushu elishushu ebambe i subsare.

Ukuqhubela phambili le "recope" ibaluleke kakhulu I-Bound elungileyo. Ifuna uvavanyo lobuchule kunye novavanyo lokufumana ibhalansi efanelekileyo kuyo nayiphi na indibaniselwano enikiweyo ucingo, Die, kwaye subsare.

Uthini ukusilela kwe-wire ye-wire ye-wire?

Nokuba kwinkqubo elawulwayo kakhulu, ukusilela kunokwenzeka. Ukuqonda unobangela wabo unesitshixo sokugcina umgca wokuveliswa kweSivuno esiphezulu. Nantsi imicimbi embalwa eqhelekileyo:

• I-Box Phakama: Kulapho I-Bondy yokuqala (ibhola okanye umtshato) awuthobeli kwi I-Bond pad. Esona sizathu sixhaphakileyo kukungcolisa kumgangatho wepad (E.G., ii-oxide, iikhemikhali zentsalela). Inokubangelwa kukungachanekanga I-rameter ye-rameters, njengamandla awonelanga okanye amandla e-ultrasonic.
• I-heel rack: I ucingo ikhefu "i-heel" okanye inqaku elicekeceke I-Bond yesibini. Oku kuhlala kubangelwa kukungahambi kakuhle kwe ucingo ukusuka kumandla amakhulu aphezulu okanye isixhobo esinxilisayo. Isixhobo esisemgangathweni esiphezulu, njenge Isixhobo se-Wedge esiSebenzayo, unokunciphisa lo mbandela.
• UWire Sag okanye ukutshayela: I ucingo I-loop yi-visshapen, enokuba mfutshane ngokuchasene ne-theacent ucingo. Oku kunokubangelwa kukungcungcutheka okungalunganga kwi oomatshini bokwenza ucingo okanye ngemikhosi ye-elektrostatic ngexesha lokungenisa elilandelayo leplastiki.
• I-crater: Umkhosi wokuxhobisa uphakame kakhulu, uqhekeza ubuthathaka isilicon ungqimba phantsi kwe I-Bond pad. Olu luyinto yokusilela kwentlekele kwaye lufuna uhlengahlengiso kwangoko lwamandla.

Yeyiphi indlela yexesha elizayo kwitekhnoloji ye-wire?

I I-wire bond Umzi-mveliso uhlala uguquka ukuba uhlangabezane neemfuno zesizukulwana esilandelayo i-elektroniki. Iindlela ezininzi eziphambili zibumba ikamva layo:

• I-Ultra-pitch: Njengoko iitshipsi ziba nzima ngakumbi, inani leepads le / o pads liyanda, ndibanyanzele kufutshane. I-wire bond ilungelelanisa kunye isitayile esihle Izakhono ezingaphantsi kwe-35 microns, ifuna oomatshini abachanekileyo kunye nembumbulu I-Diameter icingo.
• Izinto ezintsha zeWire: Ukuphuhliswa kwe-palladium-ye-palladium ucingo lobhedu, isilivere ebiweyo ucingo, kwaye ezinye izabelo zijolise ekudibaniseni izibonelelo zentsimbi ezahlukeneyo-njenge ukuqhubela phambili yobhedu ngokuxhathisa i-corrosion yeentsimbi ezixabisekileyo.
• Amandla e-elektroniki: Ukunyuka kwezithuthi zombane kunye namandla ahlaziyiweyo kuyaphosela imfuno yexabiso ucingo I-Bound isetyenziswa kakhulu ububanzi i-aluminium wire kunye ne-ribbons yobhedu ukuze iphathe amakhulu ee-AMPS zangoku.
• Ukwanda kwe-Automation kunye ne-AI: Kwikamva oomatshini bokwenza ucingo iya kubandakanya ubukrelekrele ngakumbi, isebenzisa i-AI ukuze inyuse I-rameter ye-rameters Ngexesha lokwenyani kunye nokuqikelela iimfuno zesondlo, ukunyusa isivuno kunye nokunciphisa ixesha lokuphumla.

Iqhosha lezitshixo

Ukunceda i i-wire ye-wire luhambo oluqhubekayo lokuchaneka kunye nolawulo lwenkqubo. Nazi ezona zinto zibalulekileyo ekufuneka uzikhumbule:

• Injongo yi-stentellical yedld: Impumelelo i-wire ye-wire yi-atomic yokwenyani weld, qinisekisa ukuba umbane obalaseleyo, i-thermal, kunye nokusebenza koomatshini.
• Imicimbi yendlela: I-thermosonic bonding ngumgangatho weshishini, ukudibanisa ubushushu kunye amandla e-ultrasonic ngokukhawuleza kwaye womelele iqhina.
• Ukukhetha izinto kubalulekile: Ukhetho lwe I-wire wire (igolide, ubhedu, i-aluminium) luluhlu oluntsonkothileyo phakathi kweendleko, ukuqhubela phambili, kunye nokuthembeka.
• Oomatshini basebenza: Yanamhlanje oomatshini bokwenza ucingo Zichaneke kakhulu iinkqubo zerobhoti ezilawula yonke imiba yenkqubo, ukusuka kwindawo yokusebenzisa amandla athembekileyo ngqo.
• Iiparamitha kufuneka zigqibelele: Impumelelo yayo yonke ucingo Kuxhomekeka kwiresiphi efanelekileyo yokufumana amandla, amandla, ixesha, kunye neqondo lokushisa, elilungiselelwe isicelo esithile.