I-Wedge Bond: Inqubo yokuhlanganisa isibopho se-wire for edverty ics

Ku-dongxin technology technology, izingxoxo zami ezinobunjiniyela obucocelayo njengoMarcus kusuka eJalimane zivame ukumba ezinqubweni eziyisisekelo kakhulu ngaphakathi i-semiconductor Ukukhiqiza. Asigcini nje ngokuthengisa izinto; Sinikezela ngezixazululo ezinseleleni zokuqamba amancane. Enye yezinto ezibaluleke kakhulu kulokhu idala izinkulungwane zeMicroscopic Ukuxhumeka ngogesi Ngaphakathi Circuits okuhlanganisiwe (Ikalikiso) namamojula wamandla. Ngenkathi kunezindlela eziningana, shaya ubudlelwano ivelele amandla ayo ahlukile. Le ndatshana ingeyeNjiniyela Yenqubo Edinga Ukuqonda hhayi lokho a shaya ubudlelwano , kepha kungani kuphakeme isu lokwenza umsebenzi ukuthola izinhlelo ezithile, ezifunwayo. Sizohlola ubunzima be uwaya Inqubo Yokubopha, Qhathanisa nenye indlela yayo evamile, futhi uchaze ukuthi lokhu kahle kanjani ubudlelwano ukhiye wokufinyelela ekugcineni ukuthembeka Kwanamuhla Ama-Electronics.

Iyiphi inqubo yokubopha isigqila?

Uwaya okokubopha yindlela esetshenziswa kakhulu yokwenza ukuxhumana phakathi kwe i-semiconductor ukufa (i xhoza) nalo isishuqulu kuholela noma phakathi kwama-chips amaningi ngaphakathi kokukodwa isishuqulu. Umgomo ukudala okuqinile, okuthembekile -gesi indlela ye Amasiginali kagesi namandla. Cabanga ngakho njenge-wiring microscopic. Kuhle kakhulu wire bonding, ngokujwayelekile kwenziwa aluminiyamu (Khu uzalo) noma igolide (Uhlobo), inamathiselwe ngamaphuzu amabili: okokuqala kwabafa I-Bond Pad nokwesibili ku i-substrate noma uHlelo Lokuhola.

Lokhu okunamathiselwe akwenziwa nge-soler. Esikhundleni salokho, iyinqubo yokufaka i-welding eqinile esebenzisa inhlanganisela yamandla, amandla e-ultrasonic, futhi kwesinye isikhathi ukushisa Ukwakha i-metallurgical bulala phambili. Umphumela uwukuhlala unomphela ubudlelwano Lokho kuzwakala ngomshini okuqinile nangogesi. Kunamasu amabili aphezulu okukufeza lokhu ubudlelwano: ibhola okokubopha na- shaya okokubopha. Sisinye isu lokwenza umsebenzi isebenzisa okuhlukile into yokusebenza futhi icubungule ukwakha okuqala ubudlelwano, okuholela ezinhlosweni ezihlukile kanye nezicelo. Ukuqonda ukuthi ungakwenza kanjani okuhle ubudlelwano kubalulekile kudivayisi ukuthembeka.

Ngabe i-wedge bond ihlukile kanjani esihlokweni sebhola?

Ngenkathi zombili izindlela zidala a uwaya ubudlelwano, indlela yabo nemiphumela ihluke kakhulu. Umehluko osobala kakhulu uwukuqala kokuqala ubudlelwano. A ibhola bhuda isebenzisa a -khizayo into yokusebenza futhi incibilike ukuphela kwe uwaya nge a ilangabi noma i-elekthronikhi ye-elekthronikhi yokwakha incane ibhola. Leli ibhola kucindezelwa ku I-Bond Pad Ukwakha okuqala ubudlelwano. A shaya bhuda, ngakolunye uhlangothi, usebenzisa a Ithuluzi elimise okwenziwe nge-wedge ukucindezela i- uwaya ngqo ngokumelene ne ngaphandle ngaphandle kokuncibilika, ukudala okuthambile, okufana ubudlelwano.

Lo mehluko oyisisekelo uholela ekuhlukanisweni okuningana okuyinqubo unjiniyela kumele ucabangele lapho ukhetha a okokubopha indlela.

Ekugcineni, a shaya ubudlelwano kuvame ukuthandwa izinhlelo zokusebenza ezidinga amaphrofayli aphansi, ukusebenza okuvame kakhulu, noma lapho ukusetshenziswa kwe ukushisa kumele kugwenywe. Le khasi ibhola ubudlelwano ngokuvamile ishesha futhi iguquguquke ngokwengeziwe ngokwejwayelekile Ikalikiso ukupakisha. Ukukhetha kwako ubudlelwano Ukuze usebenzise kuncike ngokuphelele kwizidingo ezithile ze-elekthronikhi igandayumbe.

Yini imishini yesinyathelo ngesinyathelo sokwenza isibopho se-wedge?

Le khasi shaya ubudlelwano ungumdanso oqondile, onezinyathelo ezimbili phakathi kwe bhuda, i into yokusebenza, no uwaya. Inqubo, ngenkathi iyinkimbinkimbi ezingeni le-athomu, lingadilizwa ngokulandelana okucacile.

1. Ukwakheka kwesibopho sokuqala: I bhuda' into yokusebenza, kusetshenziswe kahle shaya, isikhundla uwaya ngaphezulu kokuqala I-Bond Pad (imvamisa ku i-semiconductor afe). Le khasi shaya icindezela phansi ku uwaya ngamandla athile. Ngasikhathi sinye, a ukudlulisela kusebenza imvamisa ephezulu amandla e-ultrasonic. Lokhu kuyahlakala ukudlidliza kusula ingaphezulu onside izingqimba futhi zibangela uwaya ngokwesisekelo ikhubaza futhi wakhe i-metallurgical eqinile ubudlelwano nge pad. Lokhu kuqala ubudlelwano Isisekelo sakho konke ukuxhumana.
2. Ukwakheka kwe-loop: Ngemuva kokuqala ubudlelwano kuqediwe, bhuda Ihambisa shaya into yokusebenza Endleleni ehlelwe ngaphambili ebheke kwesibili Iphuzu lokubopha (use i-substrate noma uHlelo Lokuhola). Lokhu kunyakaza kubunjwa uwaya kuthile uluphu Ngokuphakama okulawulwayo kanye nokwakheka, okubaluleke kakhulu ekusebenzeni nasekuvimbeleni amasekethe amafushane.
3. Isibopho sesibili nokudabula: Endaweni yesibili, shaya yehla futhi, edala a Isibopho sesibili usebenzisa izimiso ezifanayo zamandla futhi amandla e-ultrasonic. Ngokushesha ngemuva kwalokhu Isibopho sesibili yakheka, a bopha ngekilampu ubamba uwaya endaweni ngenkathi into yokusebenza iqhubekela phezulu, ukudwengula uwaya Esithendeni sikaJehova ubudlelwano. Lokhu kushiya bhuda Ilungele ukuqala okulandelayo uwaya ubudlelwano umjikelezo. Konke lokhu Inqubo Yokubopha Nge-Wire Okokukodwa ubudlelwano kwenzeka kuma-milliseconds.

Kungani impahla evuthayo yensimbi ibaluleke kangaka kwisibopho esihle?

Le khasi wire bonding akuwona nje umqhubi; Kuyingxenye yobunjiniyela obucayi bokuphepha izakhiwo ezithonya ngokuqondile ikhwalithi futhi ukuthembeka ye ubudlelwano. Izinto ezivame kakhulu ze shaya okokubopha IS aluminiyamu uwaya, kuvame ukugcwala ngenani elincane le-silicon (1 %%) ukuyinika ubulukhuni obufanele futhi ubudlelwano Izici. Khu uzalo uwaya ilungile ngoba yakha i-ultrasonic eqinile futhi ethembekile bulala phambili e- Ukushisa kwegumbi. Futhi kuthambekele ekutheni kwakha amakhompiyutha aphakathi nendawo lapho uboshwe aluminiyamu pads ku xhoza, isikhathi eside esikhulu ukuthembeka ukukhathazeka.

Ithusi uwaya nayo iyathola ukuthandwa shaya okokubopha Ngenxa yophakeme wayo -gesi na- impamba Ukuvuselelwa. Noma kunjalo, ithusi kunzima ukwedlula aluminiyamu futhi kudinga okuhlukile ubudlelwano amapharamitha futhi kwesinye isikhathi alawulwa ngokwengeziwe, inert indawo ezungezile ukuze ugweme i-oxidation Ngesikhathi ubudlelwano inqubo. Ukukhetha phakathi Khu uzalo na- Cu kuya ngezidingo zokusebenza kohlelo lokusebenza ngokuqhathaniswa nobunzima obungeziwe ku Ukukhiqiza inqubo. Le khasi uwaya kumele ube nokuvumelana ibanga elinquma phakathi ububanzi besingelezi kanye ne-Material impahla Ukuqinisekisa ukuphindeka ubudlelwano.

Iyini indima ebalulekile yethuluzi le-wedge kule nqubo?

Le khasi shaya ngokwayo yinhliziyo ye shaya ubudlelwano inqubo. Yi- into yokusebenza odlulisa amandla futhi amandla e-ultrasonic ukusuka bhuda ku uwaya. Ikhwalithi yalokhu okuncane, ukunemba-ubunjiniyela ingxenye kubaluleke kakhulu ukufeza okuhle ubudlelwano. Kwenziwa kabi shaya kungaholela ezinkingeni eziningi, kusuka ezingahambisani ubudlelwano ukwakheka kokulimaza ubucayi I-Bond Pad use xhoza.

E-Dongxin, sisebenza ngokukhethekile ekwakheni la mathuluzi abucayi. Ikhwalithi ephezulu shaya kumele ube:

• I-geometry eqondile: Ukwakheka kwe shaya Ithiphu, kufaka phakathi ubukhulu bayo, ama-angles, nomgodi we uwaya, kumele kube okuphelele kahle ikhubaza le khasi uwaya futhi wakha okuqinile ubudlelwano.
• Izinto eziphakeme: Ngokuvamile kwenziwa nge-tungsten carbide ngobulukhuni bawo obukhulu futhi bagqoke ukumelana, ukuqinisekisa impilo ende yokusebenza kanye nokuguquguqukayo ubudlelwano inqubo.
• Ukuqedwa komhlaba okungenaphutha: I ngaphandle ye shaya oxhumana nabo uwaya kumele kube bushelelezi ukuvikela ukunamathela futhi kuqinisekiswe ihlanzekile ubudlelwano bese udiliza.

Unjiniyela onjengoMarcus uyazi ukuthi izindleko zizonke zobunikazi ze shaya akuyona intengo yayo yokuthenga, kepha ukuthembeka futhi uyinike amandla. Ikhwalithi ephezulu shaya kungukutshalwa kwemali okuncane okuvikela enkulu kakhulu. Yingakho ngokwesiko Ithuluzi Lokuhlanganisa Bonding kuvame ukudingeka izicelo ezikhethekile.

Ukulawulwa kokushisa kuyithinta kanjani ikhwalithi yesibopho se-wire?

Izinga lokushisa nokubanda kuyinto ebucayi ipharameter phakathi kwa- uwaya okokubopha, nenani le ukushisa kusetshenziswe kuchaza uhlobo lwe okokubopha.

1. Isibopho se-ultrasonic: Leli yinzuzo esemqoka ye shaya ubudlelwano. Leli isu lokwenza umsebenzi ingenziwa at Ukushisa kwegumbi, usebenzisa kuphela -omshini Force kanye nemvamisa ephezulu ukudlidliza. Lokhu kulungele amadivaysi abucayi bokushisa lapho kusebenza khona ukushisa kungalimaza ingxenye.
2. Ukubopha kwe-thermocomepression: Lokhu kudala isu lokwenza umsebenzi kuthembela ku- ukushisa (imvamisa ngo-150 ° C - 350 ° C) namandla okudala ubudlelwano ngesimo esiqinile ukungcola. Akusebenzi amandla e-ultrasonic.
3. Isibopho se-thermosonic: Le yindlela evame kakhulu esetshenziselwa ibhola okokubopha. Kuhlanganisa zonke izinto ezintathu: ukushisa, amandla, futhi amandla e-ultrasonic. Okungeziwe impamba Amandla athambisa izinto zokwakha, avumela ukuqina okusheshayo nokuthe xaxa ubudlelwano emandleni aphansi namazinga wamandla.

Ingomane shaya okokubopha, ukuba nekhono ubudlelwano phandle kwa- ukushisa ihlinzeka ngokuguquguquka okukhulu. Kodwa-ke, kwezinye izinto ezifana ithusi uwaya, engeza inani elilinganiselayo le ukushisa ingathuthukisa i- ubudlelwano Ikhwalithi. -Yikho ngqo izinga lokushisa nokubanda ukuphatha Ngakho-ke isici esibalulekile sokwenza kahle uwaya ubudlelwano nganoma yisiphi isicelo esinikeziwe.

Yiziphi izinhlelo zokusebenza ze-Wedge Bond Indlela Encamelayo?

Lapho ibhola okokubopha Ingabe i-Workorse eguquguqukayo, kunezindawo ezimbalwa zokusebenza okuphezulu lapho izici ezihlukile ze shaya ubudlelwano Kwenze kube okuphakeme, noma okuwukuphela kwakhe, ukukhetha. Shaya ukubopha kukhethwa Kulezi zimo:

• Amadivayisi we-RF ne-Microwave: Nge imvamisa ephezulu, ukwakheka nobude be uwaya ingasebenza njenge-inductor, ithinta ukusebenza kwesekethe. Okuphansi, okuyisicaba uluphu kanye ne-geometry eqondile ye-a shaya ubudlelwano zilawulwa kakhulu futhi ziyaqagela, zizenza zibalulekile Into eminyaka eyisiteleka evamilekayo Ikalikiso.
• Amandla Electronics: Amadivayisi anjenge-IGBTS kanye nama-Mosfets aphethe amasondo aphezulu futhi kufanele aqede okubalulekile ukushisa. Okusindayo-ibanga elinquma phakathi ububanzi besingelezi aluminiyamu shaya ubudlelwano ihlinzeka umthamo omuhle kakhulu ophethe futhi ukuthembeka e- amazinga okushisa aphezulu, lapho igolide ibhola ubudlelwano kungaba brittle.
• Izicelo ezinhle ze-Pitch: Njengoba ama-chips egcwele kakhulu, isikhala phakathi ubudlelwano Amaphakethe ancipha. Ngokungafani nokubopha ibhola, lapho umjikelezo ibhola ibeka izikhala eziphansi (iphimbo), umugqa omncane, ophakathi we-a shaya ubudlelwano ivumela ukuhlukaniswa okunzima kakhulu.
• Izingxenye ezibucayi zokushisa: Okwezinzwa noma amadivayisi we-optical ahluleka ukubekezelela ukushisa okudingekayo kwe-thermosonic ibhola ubudlelwano, amandla okwenza i-ultrasonic esezingeni eliphakeme shaya ubudlelwano e- Ukushisa kwegumbi kuyinzuzo ebucayi. Le khasi shaya ubudlelwano kuvame kakhulu ngaphakathi Imishini yokubopha.

Yini amapharamitha asemqoka ukulawula isibopho esiphelele?

Ukuzuza okuphindaphindwayo, okuvundwayo okuphezulu shaya ubudlelwano kudinga ukunemba ukuphatha ngaphezulu kokhiye okokubopha amapharamitha. Lawa mapharamitha amane akha "iresiphi" ukuze ahle ubudlelwano:

1. Ukucindezela: Inani lamandla okubopha asetshenziswa yi shaya ku uwaya. Amandla amancane kakhulu aphumela ekubuthakathaka ubudlelwano; kakhulu kungalimaza I-Bond Pad noma ukufa ngaphansi.
2. Amandla e-Ultrasonic: Ukuqina kwesenzo se-Ultrasonic Scrubbing Action. La mandla ayadingeka ukuze ahlukane onside izingqimba futhi wakhe bulala phambili, kepha amandla ngokweqile angadala ubudlelwano ukuze ube mncane ngokweqile futhi ubuthakathaka.
3. Isikhathi: Isikhathi lapho amandla namandla e-ultrasonic asetshenziswa kuwo. Lokhu kudinga ukuba yinde ngokwanele ukwakha okuphelele ubudlelwano Kepha emfushane ngokwanele ukukhulisa ukukhishwa.
4. Izinga lokushisa nokubanda: Ngenkathi kuvame ukwenziwa Ukushisa kwegumbi, kwezinye izinhlelo zokusebenza, ziphakamisa i- i-substrate izinga lokushisa nokubanda kunganciphisa amanye amapharamitha adingekayo futhi athuthukise ubudlelwano.

Ukuthola iwindi lenqubo elifanele lawa maparamitha ngumsebenzi oyisisekelo we uwaya okokubopha unjiniyela. Kudinga ukuhlolwa kanye nokuqonda okujulile kwezinto zokwakha nemishini, efana neyethu I-automal automated aluminium wire wedge bonder.

Ngabe i-wedge bond yehle futhi yiziphi izimbangela?

Yebo, njenganoma yikuphi Ukukhiqiza inqubo, a shaya ubudlelwano angehluleka. Ukuqonda izindlela zokwehluleka kubalulekile ekuxazululeni inkinga nokuthuthukisa ukuthuthukiswa. Ukwehluleka okujwayelekile kufaka:

• Ukopishwa kwebhondi: I ubudlelwano kuvinjwa ngokuphelele kusuka ku I-Bond Pad. Lokhu kuvame ukubangelwa ukungcoliswa ku ngaphandle noma akulungile ubudlelwano amapharamitha (e.g., amandla anganele i-ultrasonic noma amandla).
• Isithende ufa: Amafomu okuqhekeka ku uwaya ku- "Heel" kaJehova ubudlelwano, lapho uwaya uphuma ubudlelwano. Leli yiphuzu lokuhlushwa lokucindezela futhi lingadalwa yibukhali ngokweqile shaya into yokusebenza noma ngokweqile -omshini deformation ngesikhathi ubudlelwano.
• Ukulimala kwe-pad: Amandla kanye nokuqhekeka kwamandla e-ultrasonic noma i-crater I-Bond Pad noma izingqimba ze-silicon ngaphansi kwazo. Lokhu ukwehluleka okuyinhlekelele okuvame ukubangelwa ngokweqile okokubopha Force.
• Ukwakheka kwebhondi okungahambisani: Usayizi nokwakheka kwe ubudlelwano ziyehluka kusuka koyedwa ubudlelwano kuya olandelayo. Lokhu kungenziwa ngenxa yokugqokwa shaya, ukungahambelani uwaya ikhwalithi, noma inkinga nge bhuda uqobo.

Ukuvimbela lokhu kwehluleka kudinga inqubo enzima ukuphatha, Ukudla okuseqophelweni eliphezulu njenge shaya na- uwaya, nokulondolozwa okujwayelekile kwe okokubopha imishini. Ukuqina kwe ubudlelwano umgomo wokugcina.

Ngabe uDongxin uxhasa kanjani onjiniyela ekwazini kwe-Wedge Bond?

Ukukwazisa i- shaya ubudlelwano Uhambo lokuthuthuka okuqhubekayo, futhi sizibona njengabalingani kulolo hambo. Ye unjiniyela NjengoMarcus, ukwesekwa okuvela kumphakeli kuya kude kakhulu kokuthumela umkhiqizo. Sinikeza ubuchwepheshe bobuchwepheshe ukusiza ukuxazulula okunzima kakhulu okokubopha Izinselelo.

Ukuxhaswa kwethu kufaka phakathi:

• Idizayini yamathuluzi yangokwezifiso: Sisebenza ngqo nonjiniyela ukuklama nokwenza inkambiso shaya nge-geometry eqondile edingekayo kwisicelo sabo esithile, noma ngabe kulungile iphimbo noma esindayo ibanga elinquma phakathi ububanzi besingelezi uwaya.
• Isayensi Yesayensi Yezinto Ezibonakalayo: Sisiza amaklayenti ethu ukuthi akhethe okulungile uwaya futhi uqonde ukusebenzisana okubonakalayo ku- ubudlelwano isikhombibe Ukuqinisekisa isikhathi eside ukuthembeka.
• Inqubo yokwenza kahle Ukubonisana: Iqembu lethu linokuhlangenwe nakho okujulile ku uwaya Inqubo Yokubopha. Singasiza ukwehluleka ukuxazulula inkinga, uthuthukise amapharamitha, futhi uthuthukise isivuno. Siyaqonda ukuthi kudingani ukwakha okuphelele ubudlelwano.

Umgomo wethu ukuba ngaphezu komphakeli; Sihlose ukuba ngumthombo wezobuchwepheshe onika amandla onjiniyela ukucindezela imingcele yalokho okungenzeka nge shaya ubudlelwano. Okuhle ubudlelwano kungukuqala komkhiqizo omuhle.