I-Wedge Bond: I-Poire Poire Poind Ands Scred ye-ICSPREST

KwiTekhnoloji ye-Elecxin, iincoko zam kunye neenjineli ze-meticuus njengeMarcus ukusuka eJamani zihlala zidrapha kakhulu kwiinkqubo ezisisiseko kwi I-Semiconductor ukuvelisa. Asizithengi nje izinto; Sibonelela ngezisombululo kwimiceli mngeni yexabiso elincinci. Enye yezona zinto zibaluleke kakhulu kwezi zenza amawaka emicroscopic Unxibelelwano lombane ngaphakathi kwesekethe (Ics) kunye neemodyuli zamandla. Ngelixa kukho iindlela ezininzi, wedge iqhina imele ubuchule bayo obukhethekileyo. Eli nqaku leli nqaku lenkqubo yenjineli efuna ukuqonda hayi kanye le nto i wedge iqhina Ngaba kutheni kunjalo ubuchule kwizicelo ezithile, ezifunwayo. Siza kuphonononga izinto ze ucingo I-Hander Inkqubo, yithelekise enye indlela yayo yesiqhelo, kwaye ucacisa indlela endisebenzisa ngayo oku iqhina Iqhosha lokufezekisa ekugqibeleni ukuthembeka Kule mihla i-elektroniki.

Ithini i-wire fire fit proPlally?

Ucingo boleza yeyona ndlela isetyenziswa kakhulu yokufumana ii-uqhagamshelo phakathi kwe I-Semiconductor yifa (i itshiphu) kwaye iphakheji ikhokelela okanye phakathi kweetshipsi ezininzi ngaphakathi iphakheji. Injongo kukwenza into eqinileyo, inokuthenjwa umbane indlela ye Iimpawu zombane namandla. Yicinge njenge-microscopic wiring. Intle kakhulu I-wire wire, ngokuqhelekileyo kwenziwe i-aluminium (Al) okanye igolide (Au), iqhotyoshelwe kwiindawo ezimbini: kuqala kwi-dife I-Bond pad kwaye okwesibini ukuya kwi subsare okanye isakhelo esikhokelayo.

Olu qhotyoshelweyo alwenziwe ngumthengisi. Endaweni yoko, yinkqubo eqinileyo ye-welding esebenzisa indibaniselwano yamandla, amandla e-ultrasonic, kwaye ngamanye amaxesha ubushushu Ukwenza i-metrical weld. Isiphumo sisigxina iqhina Zombini zombini zomelele kwaye zinombane. Kukho iindlela ezimbini eziphambili zokufezekisa oku iqhina: ibhola boleza kwaye wedge boleza. Nganye ubuchule isebenzisa eyahlukileyo isixhobo kunye nenkqubo yokwenza kuqala iqhina, ekhokelela kwiinzuzo ezahlukeneyo kunye nezicelo. Ukuqonda indlela yokwenza okuhle iqhina ibalulekile kwisixhobo ukuthembeka.

Ngaba umatshini wonyaka wahluka njani kwibhondini yebhola?

Ngelixa zombini iindlela zenza i ucingo iqhina, indlela yabo neziphumo zahluke ngokupheleleyo. Olona phawu lucacileyo luphawu lokuqala iqhina. A ibhola umfundi isebenzisa i i-capillary isixhobo kwaye inyibilike isiphelo se ucingo nge idangatye okanye i-spark ye-elektroniki ukwenza incinci ibhola. Le ibhola icinezelwe kwi I-Bond pad ukwenza okokuqala iqhina. A wedge umfundi, kwelinye icala, sebenzisa a Isixhobo esimisiweyo se-Wedge ukucinezela ucingo ngqo ngqo kwi umphezulu Ngaphandle kokunyibilikisa, ukudala i-flotteated, injenge iqhina.

Umahluko osisiseko ukhokelela kumahluko ophambili okuphambili injineli kufuneka iqwalasele xa ukhetha i boleza Indlela.

Ekugqibeleni, a wedge iqhina ihlala ikhethwa izicelo ezifuna iiprofayili eziphantsi, ukusebenza rhoqo, okanye apho ukusetyenziswa kwe ubushushu kufuneka kuthintelwe. I ibhola iqhina iyongxamiseka ngokukhawuleza kwaye iguqulwe ngakumbi kumgangatho Ics ukupakisha. Ukukhetha kwayo iqhina Ukuzisebenzisa kuxhomekeke ngokupheleleyo kwiimfuno ezithile ze-elektroniki imodyuli.

Ithini imixholo yenyathelo lenyathelo lokwenza umtshato we-Wedge?

I wedge iqhina Ngumdaniso ocacileyo, inyathelo ezimbini phakathi kwe umfundi, isixhobo, kwaye i ucingo. Inkqubo, ngelixa kukho ubunzima kwinqanaba leatom, linokwahlulwa kulandelelwano olucacileyo.

1. Ukuqulunqwa kweBook yokuqala: I umfundi's isixhobo, owenziwe ngendlela efanelekileyo wedge, indawo ucingo ngaphezulu kweyokuqala I-Bond pad (Ngokwesiqhelo kwi I-Semiconductor ufe). I wedge icinezela kwi ucingo ngamandla athile. Ngaxeshanye, a umtshintshi isebenza rhoqo amandla e-ultrasonic. Oku kukhululwa ukungcangcazela susa umphezulu ioksidi iileyile kwaye zibangela i ucingo ukuya kwindala bonakalisa kwaye yenza i-metrim eyomeleleyo iqhina kunye nepali. Oku kuqala iqhina sisiseko sonxibelelwano lonke.
2. Ukuqulunqwa kwe-LOP: Emva kweyokuqala iqhina igqityiwe, umfundi hambisa i wedge isixhobo Kwindlela ye-pre-pre-pro Inqaku le-Bonding (kwi subsare okanye isakhelo esikhokelayo). Le ntshukumo ihamba ucingo kwicandelo elithile iluphu Ngobude obulawulayo kunye nobume, obubalulekileyo ekusebenzeni kwaye uthintele imijikelezo emifutshane.
3. I-Bond yeSibini kunye nekratshi: Kwindawo yesibini, wedge phinda wehla, udala a I-Bond yesibini Sebenzisa imigaqo efanayo yamandla kwaye amandla e-ultrasonic. Kwangoko emva kwalonto I-Bond yesibini yenziwa, a i-clamp ubambe i ucingo endaweni ye isixhobo nyuka uye phezulu, ukhumbuza i ucingo kwi-heel ye iqhina. Oku kushiya i umfundi ilungele ukuqala elandelayo ucingo iqhina umjikelo. Yonke le nto I-Wire Sire Sport Inkqubo yenye iqhina yenzeka kwii-milliseconds.

Kutheni le nto i-cire yocingo libalulekile?

I I-wire wire ayisiyiqhubi nje kuphela; Licandelo lobunjineli ebalulekileyo egcobayo ichaphazele ngokuthe ngqo umgangatho kwaye ukuthembeka ye iqhina. Ezona zinto ziqhelekileyo ze wedge boleza i i-aluminium ucingo, bahlala bebene-silicon encinci (i-1% ye-1% i-SI) ukuba banike ubunzima obufanelekileyo kwaye iqhina Iimpawu. Al ucingo ilungile kuba iyenza i-ultrasonic eyomeleleyo nethembekileyo weld kwi ubushushu begumbi. Kukwanengxaki yokwakha i-brittletic yexesha elithile xa libhabha i-aluminium iipads kwi itshiphu, ixesha elide ukuthembeka inkxalabo.

Ubhedu ucingo ikwafumana ukuthandwa wedge boleza Ngenxa yakhe ephezulu umbane kwaye i-thermal ukuqhubela phambili. Nangona kunjalo, ubhedu Kunzima kunokuba i-aluminium kwaye ifuna eyahlukileyo iqhina Iiparameter kwaye ngamanye amaxesha zilawulwa ngaphezulu, i-inert okusingqongileyo Ukunqanda i-oxidation Ngexesha le iqhina inkqubo. Ukhetho phakathi Al kwaye Cu Kuxhomekeka kwiimfuno zentsebenzo zendlela yokusebenza ngokuchasene nobunzima bongezwa kwi ukuvelisa inkqubo. I ucingo kufuneka iguqulwe ububanzi kunye nezinto ipropathi Ukuqinisekisa ukuphindaphinda iqhina.

Yintoni indima ebalulekileyo yesixhobo se-Wedge kule nkqubo?

I wedge ngokwayo yintliziyo ye wedge iqhina inkqubo. Yi isixhobo idlulisela amandla kwaye amandla e-ultrasonic isuka e umfundi kwi ucingo. Umgangatho wale nqanaba elincinci, elichanekileyo icandelo Ibaluleke kakhulu ekufezekiseni okuhle iqhina. Yenziwe kakuhle wedge inokukhokelela kwi-thermast yeengxaki, ukusuka ngokungahambelaniyo iqhina Ukuqulunqa ukonakalisa I-Bond pad kwi itshiphu.

EDongxin, sisenza izinto ezenza ukuba zenze ezi zixhobo zibalulekileyo. Umgangatho ophezulu wedge okufuneka ubenazo:

• Ijometri echanekileyo: Ubume be wedge Ingcebiso, kubandakanya imilinganiselo yayo, ii-angles, kunye nomngxunya we ucingo, kufuneka ilungele ngokufanelekileyo bonakalisa i ucingo kwaye wenze amandla iqhina.
• Izinto eziphezulu: Ziqhelekile ukuba zenziwe nge-tungsten carbide ngenxa yobunzima bayo obunzulu kwaye banxibe ukunganyangeki, qinisekisa ubomi obude bokusebenza kunye nokungaguquguquki iqhina inkqubo.
• Ukugqitywa komphezulu: I umphezulu ye wedge uqhagamshelane ne ucingo kufuneka ibe yi-Ultra-i-ultra-therting ukunqanda ukunamathela kunye nokuqinisekisa ukucoceka iqhina kunye nokuqaqamba.

Injineli njengeMarcus iyazi ukuba indleko iyonke yobunini be wedge ayisiyoxabiso layo lokuthenga, kodwa ukuthembeka kwaye ivumela ukuba isebenze. Umgangatho ophezulu wedge lutyalo-mali oluncinci olukhusela kakhulu. Yiyo le nto isiko I-Wedge Bonding Isixhobo ihlala ifuneka kwizicelo ezizodwa.

Ulawulo lobushushu luchaphazela njani umgangatho we-wire yenzuzo?

Ubushushu yinto ebaluleke kakhulu iparameter ngaphakathi ucingo boleza, kunye nenani ubushushu isetyenziselwe ukuchaza uhlobo lwe boleza.

1. I-Ultrasonic Bonding: Esi sisixhobo esiphambili se wedge iqhina. Le ubuchule inokwenziwa ubushushu begumbi, usebenzisa kuphela umatshini Amandla kunye nokusebenza okuphezulu ukungcangcazela. Oku kulungele izixhobo ezinobuthathaka ngamaqondo obushushu apho ufaka isicelo ubushushu inokulimaza icandelo.
2. I-thermoctoction ibotshwe: Le mdala ubuchule ixhomekeke kwi ubushushu (Ngokwesiqhelo i-150 ° C - 3500 ° C) kwaye inyanzele kuphela ukuba wenze iqhina ngokuqinileyo-ilizwe umaleko. Ayisebenzisi amandla e-ultrasonic.
3. I-thermosonic bondLe yeyona ndlela ixhaphakileyo esetyenziselwa ibhola boleza. Idibanisa zonke izinto ezintathu: ubushushu, ndinyanzele, kwaye amandla e-ultrasonic. Yongezwa i-thermal amandla athambisa izixhobo, avumele ngokukhawuleza kwaye ngaphezulu kokomelele iqhina ngamanqanaba asezantsi kunye namanqanaba amandla.

Kuba wedge boleza, ukuba nokukwazi iqhina ngaphandle ubushushu ibonelela bhetyebhetye kakhulu. Nangona kunjalo, ngeendlela ezithile ezinjalo ubhedu ucingo, ukongeza inani eliphakathi le ubushushu inokuphucula i iqhina umgangatho. Kufanelekile ubushushu ulawulo yindawo ephambili yokuphucula i ucingo iqhina nasiphi na isicelo esinikiweyo.

Zeziphi izicelo zonxibelelwano lwe-Wedge I-Pogeed Indlela ethandwayo?

Ngelixa ibhola boleza Ngaba i-sorhorse yolawulo lweekhontrentelo, kukho iindawo zokusebenza eziphezulu kakhulu apho iimpawu zako wedge iqhina yenze ibalaseleyo, okanye ukuphela kwendlela, ukhetho. Wedge I-Bound iyathandwa Kwezi meko:

• I-RF kunye nezixhobo ze-microwave: E indala ephezulu, ubume kunye nobude be ucingo Unokwenza njengomntu ophantsi, echaphazela intsebenzo yesekethe. Iphantsi, iflethi iluphu kunye nejometri echanekileyo ye wedge iqhina zilawulwa kakhulu kwaye zinokuqikelelwa, zenza ukuba zibalulekile Rf Ics.
• Amandla e-elektronikiIzixhobo ezinjenge-Igbts kunye neMosfets zithwala imijelo ephezulu kwaye kufuneka ikhuphe ibalulekile ubushushu. Inzima-ububanzi i-aluminium wedge iqhina ibonelela ngomthamo wokuthwala ngokugqwesileyo kwaye ukuthembeka kwi amaqondo obushushu aphezulu, apho igolide ibhola iqhina inokuba brittle.
• Izicelo zePitch ezihle: Njengamachiza agqwetheke kakhulu, indawo phakathi iqhina iipads ziyancipha. Ngokungafaniyo nebhola, apho umjikelo ibhola ichaza ubuncinci bendawo yokuhlala (i-pitch), i wedge iqhina ivumela ukuqina okukhulu.
• Izinto ezinobuthathaka kubushushu: Kwizixhobo okanye izixhobo ze-optical ezingakwazi ukunyamezela i ubushushu ifunekayo kwi-thermosonic ibhola iqhina, amandla okwenza i-ultrasonic ephezulu kakhulu wedge iqhina kwi ubushushu begumbi sisibonelelo esibalulekileyo. I wedge iqhina ixhaphake kakhulu I-Igbt Bond.

Yeyiphi imitha ephambili yokulawula iqhina eligqibeleleyo?

Ukufezekisa isivuno esitsha, esiphezulu wedge iqhina ifuna i-precise ulawulo ngaphezulu kwesitshixo boleza Iiparamitha. Ezi paramitha zine zenza "iresiphi" elungileyo iqhina:

1. Amandla: Isixa semikhosi eqhotyoshelweyo esetyenzisiweyo yi wedge kwi ucingo. Amandla amancinci kakhulu kubangela ubuthathaka iqhina; kakhulu kakhulu kakhulu I-Bond pad okanye ukufa phantsi kwento.
2. Amandla e-ultrasonic: Ubunzulu besenzo sokunyuka kwe-ultrasonic. La mandla kufuneka aphule ioksidi iileyile kwaye wenze i weld, kodwa amandla agqithisileyo kunokubangela i iqhina ukuba uthambile kakhulu kwaye ubuthathaka.
3. IxeshaIxesha apho amandla okwenza amandla kunye namandla e-Ultrasonic asetyenziswa. Oku kufuneka kube kudala ngokwaneleyo ukwenza i-pro iqhina Kodwa mfutshane ngokwaneleyo ukuze wandise igalelo.
4. Ubushushu: Ngelixa idla ngokwenziwa ubushushu begumbi, kwezinye iinkqubo, ukuphakamisa i subsare ubushushu inokunciphisa ezinye iiparamitha ezifunekayo kwaye iphucule i iqhina.

Ukufumana le windows efanelekileyo yezi paramitha ngumsebenzi ophambili we ucingo boleza injineli. Ifuna uvavanyo kunye nokuqonda okunzulu kwezixhobo kunye nezixhobo, njengethu I-Alumnum ye-Aluminum ye-Aluminum ye-Allge.

Ngaba umtshato u-bodge usilele kwaye zithini izinto ezibangela?

Ewe, njengayo nayiphi na ukuvelisa inkqubo, a wedge iqhina inokusilela. Ukuqonda imodyuli yokusilela kubalulekile ekuphuculeni ukuthoba nokuphuculwa kwenkqubo. Ukusilela okuqhelekileyo kubandakanya:

• I-Box Phakama: I iqhina Ukuzila ngokupheleleyo kwi I-Bond pad. Oku kuhlala kubangelwa ngungcoliseko kwi umphezulu okanye ayichanekanga iqhina Iiparamitha (i.G., amandla angonelanga amandla okanye amandla).
• I-heel rack: Iifom ze-rack kwi ucingo Kwi "heel" ye iqhina, apho ucingo phuma i iqhina. Le yindawo yoxinzelelo yenqaku kwaye inokubangelwa kukubukela kakhulu wedge isixhobo okanye kakhulu umatshini ishedyuli ngexesha iqhina.
• Umonakalo we-pad: Amandla kunye ne-Ultrasosonic Elters okanye crater I-Bond pad okanye imilambo ye-silicon engaphantsi kwawo. Le yintlekele i-paratirophic ihlala ibangelwa kukungaphezulu boleza amandla.
• Ukuqulunqwa kwebhondi: Ubungakanani kunye nobume be iqhina yahluka kwenye iqhina ukuya kwelinye. Oku kunokubangelwa kukunxiba wedge, engahambelaniyo ucingo umgangatho, okanye ingxaki nge umfundi ngokwayo.

Ukuthintela ezi ntsizi kufuna inkqubo engqongqo ulawulo, eyona nto iphambili enokuthetheka njenge wedge kwaye ucingo, kunye nokugcinwa kwesiqhelo kwe boleza izixhobo. Ubungqingqwa be iqhina yeyona njongo iphambili.

Ngaba iinjineli ezixhasa i-dongxin Ngaba iinjineli zeDongxin Ngaba iinjineli zeDongin ziyixhasa njani ekuthandeni iqhina lomtshato?

Ukunceda i wedge iqhina luhambo oluqhubekekayo lokuphucula, kwaye sizibona ngathi singamaqabane kolo hambo. Ye injineli NjengoMarcus, inkxaso evela kumthengisi ihamba ngaphaya nje kokuhambisa imveliso. Sibonelela ngobuchule bobuchwephesha ukunceda ekusombululeni okune boleza Imiceli mngeni.

Inkxaso yethu ibandakanya:

• Uyilo lwesixhobo esisebenza: Sisebenza ngqo ziinjineli ukuba ziyile kwaye zenze isiko wedge ngejometri efanelekileyo efunekayo kwisicelo sabo esithile, nokuba yeyokuphindezela i-pitch okanye inzima ububanzi ucingo.
• Ingcali yesayensi yezinto ezibonakalayo: Sinceda abathengi bethu bakhetha ilungelo ucingo kwaye uqonde indlela yokuphathwa kwezinto kwi iqhina isinxibelelanisi sokukhangela Ukuqinisekisa ixesha elide ukuthembeka.
• Inkqubo yokwakhiwa kwenkqubo: Iqela lethu linamava anzulu kwi ucingo I-Hander Inkqubo. Singanceda ukusilela kwingxaki, ngokufanelekileyo iiparameter, kwaye ziphucule isivuno. Siyayiqonda into efunekayo ukuze senze igqibeleleyo iqhina.

Injongo yethu kukuba ngaphezulu komthengisi; Sijonge ukuba ngumthombo wobugcisa oxhobisa iinjineli ukuba ityhutyha imida yento enokwenzeka wedge iqhina. Entle iqhina sisiqalo semveliso enkulu.