Iyo Wedge Bond: Iyo chaiyo waya waya kurongedza maitiro ekugadzirisa kweiyo advanced ics

KuDongxin Tekinoroji yemagetsi, kutaura kwangu neinjiniya yemanyorerwo senge Marcus kubva kuGerman kazhinji ichidonha pasi penzira dzakakosha kwazvo mukati semicononductor Kugadzira. Hatisi kungotengesa zvikamu; Isu tinopa mhinduro kumatambudziko micro-maitiro. Imwe yeanonyanya kutsoropodza izvi iri kugadzira zviuru zve microscopic Kubatana kwemagetsi Mukati makatenderedza zvapera (ICS) uye magetsi emasimba. Paunenge uine nzira dzinoverengeka, the wedge chisungo inomira kunze kwekugona kwayo yakasarudzika. Ichi chinyorwa ndeche mainjiniya anoita kuti usanzwisisa kwete chete izvo a wedge chisungo ndeyekuti nei ari mukuru maitiro zvekunyepedzera, zvichinetsa zvinoshandiswa. Isu tichaongorora zvinonakidza zve waya Kubatira maitiro, enzanisa nayo kune imwe nzira yakajairika, uye tsanangura kuti kudzidzira izvi sei chisungo Kiyi yekuwana kukwana kuvimbika mune zvazvino Electronics.

Chii chinonzi waya yekubatanidza maitiro?

Waya kusungwa ndiyo inonyanya kushandiswa nzira yekugadzira kusangana pakati pa semicononductor kufa (the chip) uye yayo Package inotungamira kana pakati pezvipenga zvakawanda mukati meimwe Package. Chinangwa ndechekugadzira yakasimba, yakavimbika magetsi nzira ye Zviratidzo zvemagetsi uye simba. Funga nezvazvo seMicroscopic Wiring. Yakanaka kwazvo Kuronga waya, kazhinji yakagadzirwa ne Aluminium (Al) kana goridhe (Au), inosungirirwa pamapepa maviri: kutanga kune iyo yekufa Bond Pad uye chechipiri kuna substrate kana kutungamira furemu.

Ichi chinongedzo hachina kugadzirwa nemutengesi. Panzvimbo iyoyo, iyo yakasimba-nyika-nyika nzira inoshandisa musanganiswa wesimba, Ultrasonic Energy, uye dzimwe nguva kupisa kugadzira metallurgical weld. Mhedzisiro isingaperi chisungo Izvi ndizvo zvese zvine musoro zvine simba uye zvemagetsi kurira. Kune maviri ekutanga maitiro ekuzadzisa izvi chisungo: bhora kusungwa uye wedge kusungwa. Imwe neimwe maitiro inoshandisa zvakasiyana chishandiso uye maitiro ekugadzira yekutanga chisungo, zvichitungamira kune zvakasarudzika zvakanakira uye zvinoshandiswa. Kunzwisisa Maitiro Ekuita Kuti Uite Zvakanaka chisungo zvakakosha here kuti mudziyo kuvimbika.

Chikwata cheCustro chinosiyana sei nebhora bhora?

Nepo nzira mbiri idzi dzichigadzira a waya chisungo, maitiro avo uye mhedzisiro yakasiyana chaizvo. Kusarudzika kuri pachena kwakanyanya chimiro chevakatanga chisungo. A bhora bonde inoshandisa a Capillary chishandiso uye inonyungudika kuguma kwe waya ne murazvo kana zvemagetsi spark kuti ugadzire zvidiki bhora. Izvi bhora anobva aparadzaniswa Bond Pad kugadzira yekutanga chisungo. A wedge bonde, kune rumwe rutivi, inoshandisa a Wedge-Akavezwa Chishandiso kudzvanya waya zvakananga zvinopesana ne pamusoro pasina kuungudza, kugadzira yakajeka, yakakwenenzverwa chisungo.

Uyu mutsauko wakakosha unotungamira kumisiyano inoverengeka inoverengeka iyo maitiro Injiniya anofanira kufunga kana uchisarudza a kusungwa nzira.

Pakupedzisira, a wedge chisungo inowanzo sarudza yekunyorera inoda mari yakadzika, yakakwira-frequency kuita, kana kupi kushandiswa kwe kupisa inofanira kudzivirirwa. The the bhora chisungo inowanzo kukurumidza uye inochinja-chinja pachiyero ICS kurongedza. Kusarudzwa kweiyo chisungo kushandisa zvinoenderana zvachose pane izvo zvinodikanwa zvemagetsi module.

Ndeipi nhanho-nhanho-nhanho mechanics yekugadzira wedhi bond?

The the wedge chisungo chinhu chaicho, mbiri-nhanho yekutamba pakati pe bonde, ivo chishandiso, uye waya. Maitiro acho, apo kuoma paatomu mwero, inogona kuputswa mukuteerana kwakajeka.

1. Kutanga Bond Formation:The bondeS chishandiso, chikero chaicho wedge, chinzvimbo waya pamusoro pekutanga Bond Pad (kazhinji pane semicononductor kufa). The the wedge kumanikidza pasi pane waya ine rimwe simba. Panguva imwe chete, a transducer Inoshandisa yakakwira-frequency Ultrasonic Energy. Uku kutsvaira vibration Inochenesa nzvimbo oxide matanda uye anokonzera waya kupururudza deform uye gadzira yakasimba metallurgical chisungo nepad. Kutanga uku chisungo ndiyo nheyo yekubatana kwese.
2. Loop kugadzirwa: Mushure mekutanga chisungo yakakwana, iyo bonde inofambisa iyo wedge chishandiso Mukutarisa kwakarongedzwa-prege kune yechipiri Kuronga Pfungwa (pane substrate kana kutungamira chimiro). Kufamba uku kunoumbwa waya mune yakatarwa loop Nekureba kwakadzorwa uye chimiro, icho chakanyanya kuitwa chekuita uye kudzivirira zvipfupi zvapera.
3. Chisungo chechipiri uye kubvarura: Pane yechipiri nzvimbo, the wedge zvakare vanoburuka, kugadzira a Chisungo chechipiri uchishandisa zvirevo zvakafanana zveimba uye Ultrasonic Energy. Pakarepo mushure meizvi Chisungo chechipiri inoumbwa, a clamp akabata waya munzvimbo nepo chishandiso inofamba ichikwira, ichibvambura waya nechitsitsinho cha chisungo. Izvi zvinosiya bonde Kugadzirira kutanga inotevera waya chisungo kutenderera. Izvi zvese Wire Boging Process kune imwe chete chisungo kunoitika mumamirimo.

Sei iyo yekubatanidza waya yemiwaya yakanyanya kukosha kuti chisungo chakanaka?

The the Kuronga waya haisiri conductor chete; chinhu chinonzwisisika cheinjiniya chinongedzo chine zvivakwa zvakananga zvinopesvedzera kunaka uye kuvimbika ye chisungo. Zvinhu zvinowanzoitika wedge kusungwa ndizvo Aluminium waya, kazhinji akaiswa nehuwandu hushoma hweSilicon (1% si) kuti uzvipe kuomesa uye chisungo hunhu. Al waya yakanakira nekuti inoumba yakasimba kwazvo uye yakavimbika ultrasonic weld panguva kupisa kwemimba. Izvo zvakare hazvina kunyorwa kuumba brittle intermetallic compones kana yakasungwa kuenda Aluminium Pads pane chip, inguva yakareba kuvimbika kunetseka.

Mhangura waya irikuwanawo mukurumbira wedge kusungwa nekuda kwekumusoro kwayo magetsi uye Thermal Kuita. Nekudaro, Copper zvakaoma kupfuura Aluminium uye zvinoda zvakasiyana chisungo parameter uye dzimwe nguva inodzorwa, inert Nzvimbo kudzivirira oxidation Munguva ye chisungo maitiro. Sarudzo pakati Al uye Cu zvinoenderana nezvinodiwa zvekuita zvekushandisa zvinopesana nekuwedzera kwakaomarara kuoma mune Kugadzira maitiro. The the waya inofanira kuve neyakawirirana dhayamita uye zvinhu chivakwa Kuve nechokwadi chekudzokororwa chisungo.

Ndeipi basa rakaoma reiyo tedge chishandiso mune izvi?

The the wedge iye pachayo moyo we wedge chisungo maitiro. Ndizvozvo chishandiso iyo inotumira simba uye Ultrasonic Energy kubva ku bonde ku waya. Kunaka kweiyi diki, precision-mainjiniya chikamu iri paramount yekuwana yakanaka chisungo. Akagadzirwa zvisina kunaka wedge inogona kutungamira kumatambudziko mazhinji, kubva mukusawirirana chisungo Kuumbwa kukuvadza iyo inonetesa Bond Pad pane chip.

KuDongxin, isu tinonyanya kutaura nezvekugadzira aya maturusi ekutsiura. Mhando yepamusoro wedge anofanira kunge aine:

• Chaiyo geometry: Chimiro che wedge Zano, kusanganisira zviyero zvaro, angles, uye gomba re waya, inofanira kuve yakakwana kuti ive nemazvo deform the the waya uye gadzira yakasimba chisungo.
• Superior Zvinyorwa. chisungo maitiro.
• Kupfeka kusapfeka kupedzisa:The pamusoro ye wedge izvo zvinobata waya inofanira kunge iri ultra-yakatsiga kudzivirira kunamatira uye ive nechokwadi chakachena chisungo uye kubvarura-bvisa.

Mainjiniya saMarcus anoziva kuti mutengo wakakwana werudzi rwe wedge haisi mutengo wayo wekutenga, asi kuvimbika uye goho rinogonesa. Mhando yepamusoro wedge Iko kudyara kudiki kunodzivirira yakakura kwazvo. Ichi chikonzero nei tsika Wedge Bonding Tool inowanzodiwa kuti zvikumbiro zvakakosha.

Kudzidzira tembiricha kunokanganisa sei kunaka kwe waya ye waya?

Tembiricha ndeyekutsoropodza paramende mukati waya kusungwa, uye huwandu hwe kupisa yakashandiswa inotsanangura mhando ye kusungwa.

1. Ultrasonic Bonding: Iyi ndiyo mukana mukana we wedge chisungo. Izvi maitiro inogona kuitwa pa kupisa kwemimba, uchishandisa chete michina simba uye yakakwirira-frequency vibration. Izvi zvakanakira tembiricha-yekudzvara zvishandiso kana kushandisa kupisa aigona kukuvadza chikamu.
2. Thermocompression Bonding: Uyu mukuru maitiro tenderera mberi kupisa (kazhinji 150 ° C - 350 ° C) uye kumanikidza wega kuti vagadzire a chisungo kuburikidza nekusimba-nyika kusiyana. Hazvishandise Ultrasonic Energy.
3. Thermonic Bonding: Iyi ndiyo nzira yakajairika inoshandiswa bhora kusungwa. Inobatanidza zvese zvinhu zvitatu: kupisa, simba, uye Ultrasonic Energy. Iyo yakawedzerwa Thermal Energy inofarira zvinhu, ichibvumira kukurumidza uye nekuwedzera kusimba chisungo pakadzika uye masimba emasimba.

Nekuti wedge kusungwa, kuve nekugona chisungo pasina kupisa inopa kukosha kwakakosha. Nekudaro, kune zvimwe zvinoshandiswa senge Copper waya, kuwedzera huwandu hwenyika kupisa inogona kuvandudza iyo chisungo mhando. Zvakakodzera tembiricha kutonga saka chinhu chakakosha chekugadzirisa waya chisungo kune chero chakapihwa application.

Izvo ndedzipi zvikumbiro chiratidzo chechibvumirano nzira yaunofarira?

Nepo bhora kusungwa ishandare yakati wandei, pane nzvimbo dzinoverengeka dzakakwirira-dzekuita panowanikwa hunhu hwakasiyana hwe wedge chisungo Ita iyo yakakwirira, kana kunyangwe chete, sarudzo. Wedge Kubatira kunodiwa Muzviitiko izvi:

• Rf uye microwave midziyo: Pa High Frequency, chimiro uye urefu hwa waya inogona kuita seInductor, ichikanganisa kuita kwematunhu. Iyo yakaderera, flat loop uye chaiyo geometry ye a wedge chisungo zvakanyanyisa kudzora uye kufungidzira, zvichiita kuti zvikosha Rf ICS.
• Simba Magetsi. kupisa. Kurema-dhayamita Aluminium wedge chisungo inopa zvakanakisa zvazvino-kutakura kugona uye kuvimbika panguva kupisa kwakanyanya, pane goridhe bhora chisungo inogona kuve brittle.
• Zvakanaka pitch application: Sezvo machipisi anozove akanyanya kutakura, iyo nzvimbo pakati chisungo Pads inoderera. Kusiyana nebhora bhora, uko kutenderera bhora inodudzira kupatsanura kushoma (pitch), iyo yakatetepa, mu-mutsara stitch a wedge chisungo inobvumira zvakanyanya kugadzikana.
• Tembiricha-inonzwa zvikamu: Kune sensors kana zvishandiso zvemidziyo isingagoni kushivirira iyo kupisa inodiwa kune thermonic bhora chisungo, kugona kuita yakakwirira-mhando ultrasonic wedge chisungo panguva kupisa kwemimba mukana wekutsoropodza. The the wedge chisungo zvakare yakajairika mukati IGBT Kubatanidza Machina.

Ndeapi ma parameter akakosha kuti adzorere chisungo chakakwana?

Kuzadzisa inodzokororwa, yakakwira-goho wedge chisungo zvinoda chaizvo kutonga pamusoro kiyi kusungwa paramita. Iyi manejimendi mana inoumba iyo "recipe" yeakanaka chisungo:

1. Simba: Iyo huwandu hwesimba rekunamatira rinoshandiswa ne wedge ku waya. Kunyanya kusimba kunokonzerwa neisina kusimba chisungo; zvakawandisa zvinogona kukuvadza Bond Pad kana kufa pasi.
2. Ultrasonic simba: Kukura kweiyo ultrasonic scrubing chiito. Iyi simba inodiwa kupaza kuburikidza oxide matanda uye gadzira iyo weld, asi simba rakawandisa rinogona kukonzera iyo chisungo kuve wakanyanya kutetepa uye usina simba.
3. Nguva: Iyo nguva iyo iyo simba uye isimba reUltrasonic rinoshandiswa. Izvi zvinoda kuve zvakaringana zvakakwana kuti ugadzire zvakakwana chisungo asi ipfupi zvakakwana kuti uwedzere kuendesa.
4. Tembiricha: Panguva inowanzoitwa kupisa kwemimba, kune zvimwe zvinoshandiswa, zvichisimudza iyo substrate tembiricha inogona kuderedza imwe inodiwa parameter uye kugadzirisa iyo chisungo.

Kutsvaga iyo yakakwana yekuita hwindo yeiyi parameter ndiyo core basa re waya kusungwa Injiniya. Zvinoda kuyedza uye nekunzwisisa kwakadzama kwezvinhu nemidziyo, seyedu Otomatiki thick aluminium wire wedge bonder.

Ko tangi yemusungwa rinogona kutadza uye chii chinokonzeresa?

Ehe, se chero Kugadzira maitiro, a wedge chisungo inogona kukundikana. Kunzwisisa kuti nzira dzekutadza dzakakosha pakugadzirisa dambudziko uye kugadzirisa kugadzirisa. Kukundikana Kwakajairika Kunosanganisira:

• Bond simudza:The chisungo Zvinyure zvakazara kubva ku Bond Pad. Izvi zvinowanzo kukonzerwa nekusvibiswa pane pamusoro kana zvisiri izvo chisungo parameter (i.e., isina kukwana ultrasonic simba kana simba).
• Chitsitsinho: Mafomu ekupaza mune waya pa "chitsitsinho" cha chisungo, pane waya inobuda chisungo. Iyi inzvimbo yekushushikana yekunetseka uye inogona kukonzerwa neanonyanya kupinza wedge chishandiso kana kunyanyisa michina deformation panguva ye chisungo.
• Pad kukuvara: Iyo simba uye ultrasonic simba kupaza kana crater the Bond Pad kana silicon matanda pasi payo. Uku ndiko kutadza njodzi kazhinji kunokonzerwa nekunyanyisa kusungwa simba.
• Asingaenderane Bond Yokuumbwa: Saizi uye chimiro che chisungo kusiyana kubva kune imwe chisungo kune inotevera. Izvi zvinogona kuve nekuda kwekupfekwa wedge, zvisingapindirani waya mhando, kana dambudziko ne bonde .

Kudzivirira uku kukundikana kunoda kuomarara maitiro kutonga, yakakwirira-mhando inokatyamadza senge wedge uye waya, uye kugadziriswa kweiyo kusungwa zvishandiso. Kusimba kwe chisungo ndicho chinangwa chikuru.

Dongxin anotsigira sei mainjiniya ekutsigira mukuita wedhigiri wedge?

Mastering the wedge chisungo Rwendo rwekuenderera mberi kuvandudza, uye tinozviona isu sevakabatana parwendo irwu. For an Injiniya SaMarcus, rutsigiro kubva kune mutengesi anoenda kure nekupfuura kungoendesa chigadzirwa. Isu tinopa hunyanzvi hwehunyanzvi kubatsira kugadzirisa iyo yakawedzera kusungwa zvinonetsa.

Tsigiro Yedu Inosanganisira:

• Tsika mudziyo dhizaini: Isu tinoshanda zvakananga neinjiniya kuti vagadzire uye kugadzira tsika wedge neiyo chaiyo geometry inodiwa kune yavo chaiyo application, ingave iri yeiyo Ultra-yakanaka pitch kana kurema dhayamita waya.
• Nyanzvi yesainzi: Isu tinobatsira vatengi vedu sarudza kodzero waya uye nzwisisa kutaurirana kwezvinhu ku chisungo interface Kuve nechokwadi chekuti nguva yakareba kuvimbika.
• Process optimization kubvunza: Chikwata chedu chine ruzivo rwakadzama mu waya Kubatira maitiro. Tinogona kubatsira kugadzirisa matambudziko ekutadza, vanokwanisa isa paramita, uye kugadzirisa goho. Isu tinonzwisisa zvazvinotora kuti tigadzire vakakwana chisungo.

Chinangwa chedu ndechekupfuura anotengesa; Isu tinovavarira kuva technical sosi iyo inopa mainjiniya ekusundira miganhu yezvinobvira ne wedge chisungo. Zvakanaka chisungo ndiko kutanga kwechigadzirwa chikuru.