Umhlahlandlela wokugcina we-Wire Bond: Yeka ukuthi i-Tiny Wire World yethu

Igama lami nginguKevin, futhi njengengxenye yeqembu kwa-Dongxin technology, sengichithe iminyaka ekujuleni kwemishini ye-micro-mailsing kanye nezinto ezithuthukisiwe. Ngibe nezingxoxo ezingenakubalwa ngonjiniyela onobuhlakani obufana noMarcus eJalimane, abafuna ukunemba ngokuphelele. Bayazi ukuthi okukodwa, okuyinto microscopic isibopho sentambo Kungaba umehluko phakathi kwenzwa yokusika ezenzakalelayo kanye nokwehluleka komugqa obizayo. Le ndatshana ingeyabo nanoma ngubani ofuna ukuqonda ubuchwepheshe obumangalisayo be uwaya ukubopha. Sizohlola konke Inqubo Yokubopha Nge-Wire, kusukela kwisayensi eyisisekelo kuya emishini esezingeni eliphezulu eyenza ukuthi kwenzeke, ikunikeze ukuqonda okudingekayo ukuze ukwazi lesi sinyathelo sokukhiqiza esibucayi.

Inqubo ye-wire Bonding yenqubo enjani microelectronics?

Emgogodleni wayo, Ukubopha i-Wire inqubo yokwakha ukuxhumana okuncane kukagesi usebenzisa inhlawulo enkulu uwaya. Cabanga nge-chip eyinkimbinkimbi yekhompyutha, a i-semiconductor idivaysi ayikho enkulu ukwedlula umunwe wakho. Le chip idinga ukuxhumana nomhlaba wangaphandle. Uwaya Ukubopha yibhuloho elenza lokhu ukuxhumana kwenzeke. Ixhuma amaseliphu amancane kakhulu kwi-chip (endaweni ebizwa ngokuthi a I-Bond Pad) kuma-terminals amakhulu kagesi ku i-substrate noma I-LoveFrame. Le nqubo yindlela esetshenziswa kakhulu ye ukuxhuma ku Umkhakha we-semiconductor.

Inqubo ngokwayo iyisimangaliso sobunjiniyela. Umshini okhethekile usebenzisa inhlanganisela yamandla, ukushisa, futhi kwesinye isikhathi uhlobo lwe-ultrasonic amandla ukudala isimo esiqinile bulala phambili phakathi kwe uwaya kanye I-Bond Pad. Lokhu akufani nokuthengisa kwendabuko; Azikho izinto ze-filler. Esikhundleni salokho, ama-athomu we uwaya Futhi i-pad ilethwe eduze kangangokuba yakha onamandla, unomphela metlurgical Bond. Lokhu kudala ukuxhumana okuthembekile okuthembekile nokwenziwa kwemishini okungamelana nezimo ezinzima ngaphakathi insizakalo ye-elektroniki.

Cabanga ngakho njenge-microscopic blacksmithith. A Ithuluzi Lokubopha izindawo ezinembile futhi zicindezela a ucingo omncane nge a ibanga elinquma phakathi ububanzi besingelezi kuvame ukukalwa ngama-microns (izigidi zemitha). Umgomo ukudala indlela engenamthungo kagesi ukugeleza. Yonke i-smartphone, imoto, nekhompyutha ithembela ezigidini zalezi zinto eziphelele, ezincane. Ubuqotho balowo nalowo isibopho sentambo kubaluleke kakhulu emsebenzini we Izingxenye ze-elekthronikhi bayaxhuma.

Kungani isibopho se-wire sibucayi kakhulu kudivayisi ye-semiconductor?

Ukubaluleka kwe isibopho sentambo phakathi kwa- Ukuhlunga kwedivayisi ye-Semicondector ayikwazi ukweqiwa ngokweqile. Kuyisinyathelo sokugcina, esibalulekile ekwenzeni umjikelezo ohlanganisiwe (Ig) ukusebenza. Ngemuva kwamahora amaningi futhi izigidi zamadola zisetshenziselwa ukuklama futhi zisebenzisa inkimbinkimbi anzini wafela, kuthobekile uwaya Lokho kuletha impilo. Ngaphandle kwendlela ethembekile ye ukuxhuma, enamandla kakhulu Ig akulutho ngaphezu kwengxenye engenamsebenzi anzini.

Ikhwalithi ephezulu isibopho sentambo iqinisekisa izinto ezimbili: okuhle kakhulu ukuqina kukagesi namandla aqinile emishini. Le khasi Izakhiwo zikagesi zibalulekile ekusebenzeni. Noma yikuphi ukumelana noma ukungahambisani ne bulala phambili Kungalimaza isiginali, ukhiqize ukushisa okungafuneki, noma udale ukuthi idivaysi yehluleke. Lokhu kuyiqiniso ikakhulukazi ezihlelweni zemvamisa ephezulu lapho ubuqotho besiginali buyikho konke. Le khasi Bopha phakathi kocingo Futhi i-pad kumele ibe nokumelana okuphansi kakhulu ukuqinisekisa amandla asebenzayo nokuhanjiswa kwedatha.

Ngaphezu kwalokho, lokhu kuxhumana kumele kukhuleke kakhulu. Kufanele basinde ngokuhamba ngebhayisikile okushisayo (ukunwebeka nokuthola inkontileka ngokushisa), ukudlidliza nokushaqeka ngokomzimba empilweni yomkhiqizo. Ibanga lemoto i-semiconductor, ngokwesibonelo, kumele basebenze ngokungafanele iminyaka ngaphansi kwe-hood yemoto, bakhuthazelela amazinga okushisa aphezulu nokuthuthumela njalo. Okubuthakathaka isibopho sentambo bekungaphazamisa, kuholele ekuhlulekeni kwamadivayisi. Kungakho onjiniyela bezinqubo bagxile kakhulu ekuzuzeni okuphelele, okungenanyama bulala phambili Njalo ngesikhathi esisodwa. Kuyisisekelo sokwethenjwa kwazo zonke i-elekthronikhi yanamuhla.

Yiziphi izinhlobo eziphambili ze-wire bonding? Ukubheka eBalv vs Bonding

Kunezindlela ezimbili eziyinhloko ezisetshenziswa embonini: ibhondi yebholaing futhi bond bonding. Ngenkathi zombili zifinyelela inhloso efanayo yokudala a uwaya Ukuxhumana, bakwenza ngezindlela ezihlukile futhi balungele izinhlelo ezihlukile. Ukuqonda ukwahluka kwabo kubalulekile ekwakheni noma yimuphi umugqa wokukhiqiza.

Bir monding:
Le yindlela evame kakhulu futhi esheshayo, ngokujwayelekile usebenzisa igolide noma ucingo lwethusi. Inqubo iqala ngokuncibilika ukuphela kocingo ngogesi kagesi, owakha ibhola elincane ngenxa yokungezwani komhlaba. Le bhola icindezelwa ku I-Bond Pad usebenzisa inhlanganisela ye ukushisa nokucindezela, futhi kaningi amandla e-ultrasonic, ngenqubo ebizwa ngokuthi isibopho se-thermosonic. Lokhu kudala isibopho sokuqala. Umshini bese ufaka i- uwaya kwiphuzu lesibili lokuxhuma futhi kwakha ukushuba okufana Isibopho sesibili Ngaphambi kokudwengula i uwaya ukuze uqale futhi.

• Izinzuzo: Ijubane eliphakeme, amandla okubopha kunoma iyiphi indlela kusuka endaweni yokuqala.
• Okubi: Dinga isikhala esengeziwe ku-chip ngenxa yokwakheka kwebhola, ukushisa okuphezulu kungaba yinkinga yezakhi ezibucayi.

I-Wedge Bonding:
Bond bonding, noma hlanganisa isibopho socingo, isebenzisa a Ithuluzi elimise okwenziwe nge-wedge esikhundleni se -khizayo. Le khasi ucingo lucindezelwe flat ngokumelene ne I-Bond Pad, futhi amandla e-ultrasonic isetshenziswa ukudala ukungezwani bulala phambili. Lokhu kwakha isibopho esihle, esinjenge-stitch-like. Inqubo iphindwa ku Isibopho sesibili. Le ndlela ivame ukusetshenziswa nge I-Aluminium Wire, ikakhulukazi ezinhlelweni ezinamandla amakhulu, kepha futhi zingasetshenziselwa igolide uwaya neribhoni.

• Izinzuzo: Kwakha ibhondi encane, ephansi-ephrofayili, elungele izicelo ezinhle (ezihlukaniswe kakhulu). Ngokuvamile kudinga ukushisa okuncane, okwenza kube lula kumadivayisi abucayi bokushisa.
• Okubi: Ngokuvamile kancane kunokubopha ibhola, futhi ukuqondisa kokubopha kukhawulelwe ukuqondiswa kwe shaya ithuluzi.

EDongxin, sisebenza ngokukhethekile ekwakheni amathuluzi aqondile e-Ultra kuzo zombili izinqubo, ezivela kuma-capillaries for ibhondi yebholai-ers to the rofus shaya Amathuluzi adingekayo ukuze kubuyiselwe esindayo lwe-aluminium. Ukukhetha phakathi ibhondi yebhola na- bond bond kuvame ukwehlela ezidingweni ezithile zezindleko zedivayisi, ubuningi, amandla, nohlobo lwe wire bonding kusetshenziswa.

Ngabe isebenza kanjani umshini wesimanje ozenzakalelayo we-wire bonding?

Okungokwesimanje ucingo oluzenzakalelayo I-BOMBER iyingcweti yamarobhothi kanye nezinhlelo zokulawula. Yenzelwe ukwenza izinkulungwane zamabhondi ngehora nge-Sub-Microncy. Umnyombo womshini uwuhlelo lokulawula ukunyakaza oluyinkimbinkimbi olushukumisela ikhanda lebhondi ngaphezulu kwe i-semiconductor idivaysi. Le nhloko yebhondi iphethe Ithuluzi Lokubopha (kungaba capillary for ibhondi yebholaing noma a shaya ingomane bond bonding) kanye ne-spool ye wire bonding.

Inqubo iqala lapho i Ig noma i-substrate ilayishwe emshinini. Uhlelo olunamandla lokubona luveza izindawo eziqondile zamaphampu webhondi namaphoyinti ahambisanayo ku- I-LoveFrame noma I-PCB. Isoftware yomshini bese ibala indlela efanelekile ngayinye uwaya. Ngakunye isibopho sentambo, umshini wenza ukulandelana okuqondile:

1. Ukubeka: Ikhanda lebhondi lihambisa ithuluzi ngqo ngaphezulu kwe isibopho sokuqala isiza.
2. I-Bonding: Ithuluzi lehlile, futhi umshini usebenza inhlanganisela ehleliwe yamandla, lokushisa, kanye / noma amandla e-ultrasonic ukwakha bulala phambili.
3. Ukuhamba: Umshini uphakamisa ithuluzi futhi ukhokha i- uwaya, kwakha ukwakheka okuqondile kokulawula ukuphakama nokuvimbela ukufushanisa.
4. Isibopho sesibili: Ikhanda liya esizeni sesibili, kanye Isibopho sesibili kwenziwa.
5. Ukuqedwa: Le khasi uwaya iphukile yi-a bopha ngekilampu futhi ukudiliza ukunyakaza, ukulungiselela umshini olandelayo isibopho sentambo.

Lo mjikelezo wonke kwenzeka ema-milliseconds. Le khasi umshini we-welding ihlala iqapha izici ezinjenge-bond force futhi uhlobo lwe-ultrasonic Amandla okuqinisekisa ukuthi konke ukuxhumana kuhlangana namazinga aqinile wekhwalithi. Le mishini, efana neyakho I-WS9820 I-automal automal aluminium wire wedge bonder, yizinjini zesimanje I-Microelectonics Umhlangano, enika amandla ukukhiqizwa kwesisindo senkimbinkimbi Izingxenye ze-elekthronikhi.

Yiziphi izinhlobo ezivame kakhulu ze-wire ezisetshenziselwa ukubopha izibopho?

Ukukhethwa kwe wire bonding Isinqumo esibucayi esekwe kwizindleko, ukusebenza, kanye nezidingo zohlelo lokusebenza. Indwangu ngayinye inezakhiwo ezihlukile ezenza zilungele izimo ezihlukile. Ezintathu eziphambili Izinhlobo zocingo Kusetshenziswe namuhla kukhona igolide, ithusi ne-aluminium.

Ucingo lwegolide: Amashumishumi eminyaka, igolide kwakuyindinganiso ye isibopho socingo ngenxa yokwethenjwa kwayo okuphezulu. Akukona onsideYebo, okwenza kube lula ukudala a ukubopha okuhle ukuxhumana. Ukuthamba kwaso kuvumela Igolide Wire Bonding emandleni aphansi, ukunciphisa ukucindezela kokubuthaka anzini chip. Kodwa-ke, okuphezulu izindleko zegolide iqhube abakhiqizi abaningi ukuthi bafune ezinye izindlela.

Ucingo lwethusi: Ucingo lwethusi usephenduke enye indlela ethandwayo. -Kuthile ukuqina kukagesi iphakeme kakhulu kunegolide, futhi kushibhile kakhulu. Kodwa-ke, ithusi linzima futhi lithambekele kulo i-oxidation, okwenza ukubopha kudinga indawo elawulwa kakhudlwana (imvamisa isebenzisa isihlangu segesi e-inert) kanye namapharamitha aqinile anamandla ukuvikela ukulimala ku I-Bond Pad.

I-Aluminium Wire: I-Aluminium Wire kuvame kakhulu ngaphakathi bond bonding, ikakhulukazi amadivayisi kagesi lapho kukhulu ibanga elinquma phakathi ububanzi besingelezi Izintambo ziyadingeka ukuthwala imijikelezo ephezulu. Kwakha i-mono-metallic enamandla kakhulu bulala phambili Nge-Aluminium Bond Pads ku-Chip, ukugwema ukwakheka kwe-brittle igolide-aluminium I-Intermetalics (eyaziwa ngokuthi "inhlupheko onsomi") engadala ukwehluleka kwebhondi ngokuhamba kwesikhathi. Sihlinzeka uhla lwe I-Aluminium Wire Emsulwa ngokuqondile njiniyela kulezi zicelo ezifunwayo.

Ungakwazi yini ukuchaza isayensi ngemuva kwe-ultrasonic weld?

A I-Ultrasonic Weld inqubo ethokozisayo ejoyina amabili I-Metal Surfaces ngaphandle kokuncibilikisa. Kuyindlela yokufudumala okuqinile, okuyi-Central to ukubopha ngentambo ye-ultrasonic. Imilingo yenzeka lapho kulethwa ukuvezwa okuthe xaxa ku-interface ye-bonding ngaphansi kwengcindezi.

Nakhu ukuthi kusebenza kanjani: a umshini wokubopha wire isebenzisa i-transducer ukukhiqiza imvamisa ephezulu Ukudlidliza kwe-acoustic, ngokujwayelekile ebangeni le-20-120 kHz. Leli ukudlidliza amandla idluliselwa ku- Ithuluzi Lokubopha ku uwaya. Le khasi ucingo lucindezelwe ngokumelene ne I-Bond Pad, ukunyakaza okusheshayo, okuklabayo kwe amandla e-ultrasonic Ifeza izinto eziningana:

1. Ihlanza ingaphezulu: Ukudlidliza kuyahlukana futhi kusabalalisa abangcolisiwe kakhulu futhi kube mncane onside izingqimba zombili uwaya kanye I-Bond Pad. Lokhu kuveza insimbi emsulwa, ehlanzekile, ebalulekile ku- yakha isibopho.
2. Thambisa insimbi: Ukungqubuzana okukhulu kwakha ukushisa okwenziwe kwasendaweni, okubangela ipulasitiki isimobaso Ensimbi exhumeka. Lokhu kuthambisa kuvumela izindawo ezimbili ukuba zivumelane ngokusondelene.
3. Ikhuthaza Ukuphazamiseka kwe-Atomic: Ngezindawo ezihlanzwa futhi zicindezelwe ndawonye, ​​ama-athomu avela ku uwaya Futhi i-pad ingaphazamisa ngaphesheya komngcele, idala iqiniso metlurgical Bond.

Konke isibopho se-ultrasonic Inqubo ithatha kuphela ama-millisecond ambalwa. Ngokusebenzisa ingcindezi ne-ultrasonic Ukudlidliza esikhundleni sokuncibilika ngobuningi, kugwema izinkinga ezihambisana nokushisa okuphezulu, okwenza kube kulungele ubuthakathaka Izingxenye ze-elekthronikhi. Le nhlanganisela ye Amandla okushisa namandla e-ultrasonic yitshe lesisekelo sanamuhla isibopho se-thermosonic.

Yiziphi izinto ezithinta ikhwalithi yesibopho se-wire?

Ukuthola okuphelele isibopho sentambo Njalo ezigidini zokuxhuma kuyinselelo eyinkimbinkimbi. Njengonjiniyela, uyazi ukuthi leyo mfanelo inqunywa esele esele yokuguquguquka okuningi. Ukuphambuka okuncane kunoma ngubani kubo kungaholela esibonelweni esibuthakathaka noma esihlulekile.

Izici ezisezingeni elifanele:

• Ukuhlanzeka kwezinto ezibonakalayo: Izinga le wire bonding nokuhlanzeka kwe I-Bond Pad ziyisisekelo. Noma yikuphi ukungcola noma ukungcoliswa kungavimba ukwakheka okuqinile bulala phambili. Lokhu kufaka phakathi i-perating yensimbi ku- i-substrate.
• Amapharamitha wokubopha: Lezi izilungiselelo zomshini ukuthi unjiniyela kufanele azikhulise. Kubandakanya:
  • Phoqa: Ithuluzi licindezela kangakanani uwaya. Amandla amancane kakhulu aphumela ngesibopho esibuthakathaka; Kuningi kungalimaza i-chip.
  • Amandla e-Ultrasonic: Inani le amandla e-ultrasonic kusetshenziswe. Lokhu kudinga ukuguqulwa ngokuphelele ukuhlanza ingaphezulu ngaphandle kokubangela imifantu emincane.
  • Isikhathi: Isikhathi lapho amandla namandla asetshenziswayo.
  • Lokushisa: Ukushisa kusetshenziswe ku i-substrate, okusiza ukuthambisa izinto zokwakha.
• Isimo sethuluzi: Le khasi Ithuluzi Lokubopha-The shaya noma i-capillary-iyingxenye esetshenziswayo eguga ngokuhamba kwesikhathi. Ithuluzi eligqokwa noma elingcolisiwe lizokhiqiza izibopho ezingahambisani. Sikubone mathupha ukuthi ithuluzi eliphakeme kakhulu, elihlala isikhathi eside, njengezifiso zethu Ukudla okubopha ngomshini, ingathuthukisa kakhulu isivuno futhi inciphise isikhathi sokuphumula imigqa yokukhiqiza.
• I-Loop geometry: Ukwakheka kwe uwaya I-loop nayo ibucayi. Ukuphakama okungalungile kwe-loop kungaholela emigqeni emifushane nezinye izintambo noma zithambekele ekulimaleni ngezinyathelo ezilandelayo zokukhiqiza njenge-isikhunta.

Ukukwazi lezi zinto kudinga ulwazi olujulile lwenqubo, izinto ezisezingeni eliphakeme, nokuqina umshini we-welding. Kuyinqubo eqhubekayo yokuqapha, ukuhlola, nokucwengisisa.

Ngabe i-laser wellding ifana kanjani nesibopho sentambo yendabuko?

Lapho isibopho socingo ubuchwepheshe obuvelele be-chip-level ukuxhuma, I-Laser Welding Kuyavela njengenye indlela enamandla yezinhlobo ezahlukahlukene zokuxhumeka e-Electronics Assembly, ikakhulukazi izakhi ezinkulu ezifana namathebhu webhethri namabhasi.

I-Laser Welding Isebenzisa ugongolo olugxile kakhulu lokukhanya ukuncibilika kanye ne-fuse insimbi ehlukahlukene izingxenye ndawonye. Ngokungafani nesimo esiqinile bulala phambili iwa- isibopho se-ultrasonic, I-Laser Welding kwakha ukuhlanganiswa bulala phambili ngokuncibilikisa lokho okuqukethwe.

QAPHELA:

Isibopho socingo ama-excels ekwakheni izinkulungwane zokuxhumeka okuncane, okuqondile kubuthakathaka i-semiconductor afe. Ukufakwa okushisa okuphansi kuvimbela ukulimala kwezezimali ezibucayi. I-Laser Welding, ngakolunye uhlangothi, kungcono ukudala ama-welds aqinile, ahlelekile ezingxenyeni ezinkulu lapho ukushisa okuphezulu kwamukeleka khona. Ubungeke usebenzise I-Laser Welding Ukuxhuma i-25-micron uwaya ku Ig, kepha ilungele ukushiswa kwe-welding ithebhu yethusi elibanzi kwi-terminal yebhethri. Bangubuchwepheshe obuhambisana nobuchwepheshe obuxazulula izinselelo ezahlukene ezweni elibanzi lokukhiqiza ngogesi.

Yiziphi izinselelo ezibalulekile kwinqubo yokubopha isigqila namuhla?

Le khasi Inqubo Yokubopha Nge-Wire uvuthiwe, kepha kuhlala kudonswa imingcele yawo ngejubane elingapheli lokuvuselelwa komkhakha wezogesi. Onjiniyela babhekene nezinselelo ezinkulu eziningana ezidinga izixazululo ezintsha nezinto ezingcono.

Enye yezingqinamba ezinkulu kunazo zonke i-miniaturization. Njengoba ama-chips eba namandla ngokwengeziwe, adinga ukuxhumana okungaphezulu kwe-I / O esikhaleni esincane. Lokhu kuholela ekubondweni kwe-Ultra-Fine Pitch, lapho kufakwa khona ama-bond pads asondelene ndawonye. Lokhu kudinga ukunemba okuhlukile kusuka ku- umshini wokubopha wire futhi incane, eqondile ukubopha imali okukhethekile Ithuluzi elimise okwenziwe nge-wedge. Noma yikuphi ukungahambi kahle okuncane kungadala umjikelezo omfushane.

Enye inselelo ukukhuphuka kwezinto ezintsha kanye nezinhlaka zedivayisi eziyinkimbinkimbi. Isibonelo, ukubopha izinsolo ezinhle zezigatshana noma ezisebenzisana namaphakeji afakwe okugcwele (3D-ICS) wethula okuguquguqukayo okusha. Le khasi coefflicafleant iwa- Ukunwebeka okushisayo Ukuhlaselwa phakathi kwezinto ezahlukahlukene kungabeka ingcindezi ku- isibopho sentambo Ngesikhathi sokusebenza, okuholela ezindabeni zokwethenjwa. Ngaphezu kwalokho, ukuguqukela ku ucingo lwethusi Ukugcina izindleko zokwethula izinselelo ezihlobene i-oxidation Futhi ubunzima, edinga izilawuli zenqubo ezinzima.

Ekugcineni, ukuze ama-elekthronikhi we-Power, njengaleyo esezimotweni zikagesi futhi Imishini yokubopha, inselelo yehlukile. Lapha, esindayo ibanga elinquma phakathi ububanzi besingelezi aluminiyamu uwaya noma izimbambo zisetshenziselwa ukuphatha amasondo aphezulu. Ubunzima bukhona ekuletheni ngokwanele uhlobo lwe-ultrasonic Amandla wokwenza i-robust bulala phambili Ngaphandle kokulimaza idivaysi enkulu, ebizayo yamandla. Yilapho ikhwalithi ye Amathuluzi okubopha namandla kaJehova umshini we-welding zivivinywa ngempela.

Ukhetha Kanjani i-Wire Bonding Wire Of Fain Of Of isicelo Isicelo sakho?

Ukukhetha okulungile wire bonding futhi amathuluzi akuyona nje isinqumo sokuthenga; Kungukukhetha okubucayi kobunjiniyela abathinta ngokuqondile ukuveza, ukuthembeka kanye nezindleko. Ngonjiniyela wenqubo, lesi sinqumo sidinga indlela ehlelekile ebheka izidingo ezihlukile zedivayisi.

Okokuqala, hlaziya uhlelo lokusebenza. Ingabe kuyithuluzi eliphakeme elidinga kakhulu ibanga elinquma phakathi ububanzi besingelezi I-Aluminium Wire ukuphatha okwamanje? Noma ingabe kuyidijithali ephezulu kakhulu yedijithali Ig lokho kudinga igolide le-Ultra-Fine noma ucingo lwethusi Ngesibopho esihle se-pitch? Ukukhethwa kwe uwaya I-Material-Gold, yethusi, noma i-aluminium-yiphuzu lokuqala. Lesi sinqumo sizothonywa okuhlosiwe kwezindleko (I-Copper VS. GOLD), Izidingo Zokuthembela (Ukumelana Kwegolide Kokugqwala), kanye ne-metallization of the I-Bond Pad (aluminium uwaya kumaphilisi we-aluminium ukuvimbela igolide-aluminium Intermetalics).

Kanye Kusetshenziswa ucingo, igxathu elilandelayo likhetha Ithuluzi Lokubopha. Ijometri ye shaya noma i-capillary kumele ifane ububanzi bentambo kanye nobukhulu bebhondi pad ngokuphelele. Ithuluzi elinezici ezingalungile lingaholela ekwakhekeni okumpofu kwebhondi, ukulimala kocingo, noma imiphumela engahambisani. Isibonelo, a bond bond Esikhaleni esiqinile kungadinga ithuluzi elinephrofayili elincanyana kakhulu. Okuqukethwe yithuluzi okufana ne-tungsten Carbide noma i-titanium-kubalulekile futhi ngokuphila kwayo kanye nokusebenza kwayo. Ukutshala imali kumathuluzi aphezulu avela kumenzi okhethekile aqinisekisa ukuvumelana kwamathuluzi kuya ku-Tool-to-tohuluzi, okuyinto ekhathazayo onjiniyela abangakwazi ukubekezelela ukuhlukahluka kwenqubo. Inhlanganisela efanele ye ucingo oluhlukahlukene Izinhlobo namathuluzi okunemba yifomula yempumelelo futhi ephindaphindwayo isibopho socingo ukusebenza.

Ukuthathwa Key

• Ukubopha ngentambo kubalulekile: Yindlela eyinhloko yokwakha ukuxhumana kagesi okwenza amadivaysi e-semiconductor asebenze.
• Izinhlobo ezimbili eziphambili zikhona: Ukubopha ibhola iyashesha futhi iguquguqukayo, ngenkathi hlanganisa isibopho inembile futhi ilungele izinhlelo zokusebenza ze-pitch noma iphrofayili ephansi.
• Kuyisayensi yokunemba: Inqubo incike ekusetshenzisweni okulawulwa amandla, izinga lokushisa, kanye uhlobo lwe-ultrasonic Amandla ukudala isimo esiqinile, esiqinile bulala phambili.
• Ukukhetha okubonakalayo kubalulekile: Ukukhethwa kwegolide, ithusi, noma i-aluminium uwaya Kuya ngokuthengisa phakathi kwezindleko, ukusebenza, kanye nezidingo zokwethenjwa.
• Ikhwalithi incike ezintweni eziningi: Ukuthola okuphelele isibopho sentambo Dinga izinto zokuhlanza okuphezulu, amapharamitha womshini olungiselelwe, kanye nekhwalithi ephezulu, eqinile Amathuluzi okubopha.
• Ubuchwepheshe busavela: I-miniaturization, izinto ezintsha, kanye nezinhlelo zokusebenza eziphezulu ziqhubeka nokucindezela imingcele yalokho Inqubo Yokubopha Nge-Wire ingafinyelela.