Isikhokelo sokugqibela kwi-wire ye-wire ye-wire: Indlela i-wine encinci yamandla ehlabathi

Igama lam ndinguKevin, kunye nenxalenye yeqela kwiTekhnoloji ye-elektroniki, ndichithe iminyaka iphakathi kwihlabathi lemicro-Matting kunye ne-Advanced. Ndinencoko engathethekiyo kunye neenjineli ze-meticuus efana noMarcus eJamani, ofuna uhlobo olupheleleyo. Bayazi ukuba i-microscopic enye, microscopic i-wire ye-wire Unokuba ngumahluko phakathi kwenzwa ye-ofisi yemoto kunye nokusilela kwemveliso yeendleko. Eli nqaku leli nqaku kunye nalo nabani na ofuna ukuqonda itekhnoloji emangalisayo ye ucingo I-Bound. Siza kuphonononga yonke I-Wire Sire Sport Inkqubo, kwiSayensi esesiSiseko yoomatshini abaphambili esenza ukuba kwenzeke, ukukunika ukuqonda okufunekayo ukuze ikwazi ukwenza le nqaku lemveliso elibalulekileyo.

Ithini kanye kanye inkqubo yokuxhobisela i-wire kwi-microelectivics?

Kwinkalo yayo, I-wire i-boire yinkqubo yokudala unxibelelwano oluncinci lombane usebenzisa impilo entle kakhulu ucingo. Khawufane ucinge i-chip enzima yecomputer, a I-Semiconductor Isixhobo akukho sikhulu kunomnwe wakho. Le chip kufuneka inxibelelane nehlabathi elingaphandle. Ucingo Ukuboleka yibhulorho eyenza olu nxibelelwano lwenzeka. Idibanisa isekethe i-microscopic kwi-chip (kwindawo ebizwa ngokuba yi-A I-Bond pad) ukuya kwi-terminal enkulu yombane kwi subsare okanye i-verframe. Le nkqubo yeyona ndlela isetyenziswa kakhulu uqhagamshelo lwe kwi Umzi mveliso we-semicondcuctor.

Inkqubo ngokwayo imangaliswa yimithombo yobunjineli. Umatshini ozimeleyo usebenzisa indibaniselwano yamandla, ubushushu, kwaye ngamanye amaxesha i-ultrasonic amandla okwenza ilizwe eliqinileyo weld phakathi kwe ucingo kwaye i I-Bond pad. Oku akufani nokuthengiswa kwemveli; Akukho zixhobo zokucoca. Endaweni yoko, iiatom ze ucingo kwaye i-pad iziswe zisondele kakhulu ukuba zizomelele, zisisigxina I-metrilljelical I-Bond. Oku kudala unxibelelwano oluthembekileyo lombane oluthembekileyo kunye noomatshini obunokumelana neemeko ezinzima ngaphakathi isixhobo se-elektroniki.

Cinga ngayo njengemicroscopic i-fuckmitic. A Isixhobo sokuBonelela Iindawo ezichanekileyo kwaye zicinezela a ucingo olucekeceke nge ububanzi ihlala ilinganiswe kwii-microns (izigidi zemitha). Injongo kukwakha indlela engenamthungo yombane ukuba ihambe. Yonke i-smartphone, imoto, kunye nekhompyuter ixhomekeke kumawaka ezigidi zonxibelelwano olugqibeleleyo, oluncinci. Ingqibelelo nganye i-wire ye-wire ibaluleke kakhulu emsebenzini Izinto ze-elektroniki bayaqhagamshelana.

Kutheni le nto ingxowa ye-wire ibaluleke kakhulu kwi-semiconductor yesixhobo?

Ukubaluleka kwe i-wire ye-wire ngaphakathi Isixhobo se-Semiconductor Isixhobo ayinakuba ngaphezulu. Linyathelo lokugqibela, elibalulekileyo ekwenzeni isekethe ehlanganisiweyo (NDIYABONA) Umsebenzi. Emva kweeyure ezininzi kwaye izigidi zeedola zichithwa ziyiyile kwaye ziyila ubunzima isilicon fed, sisiphoso ucingo Oko kuyisa ebomini. Ngaphandle kwendlela ethembekileyo ye uqhagamshelo lwe, eyona inamandla NDIYABONA ayisiyonto ngaphandle kwento engenamsebenzi isilicon.

Umgangatho ophezulu i-wire ye-wire uqinisekisa izinto ezimbini: ngokugqwesileyo Ukuqhutywa kombane kunye namandla okusebenza ngokobugcisa. I Iipropathi zombane zibalulekile ekusebenzeni. Nakuphi na ukumelana okanye ukungangqinelani kwi weld Ungayithoba umqondiso, velisa ubushushu obungadibani, okanye ukuba isixhobo sikwazi ukusilela. Oku kuyinyani ngakumbi kwizicelo ezinde kakhulu apho ingqibelelo yiyo yonke into. I I-Bond phakathi kocingo Kwaye i-PAD kufuneka ibe neyona nto ixhaphakileyo ekuqinisekiseni ukosulela amandla kunye nokuhanjiswa kwedatha.

Ngapha koko, olu nxibelelwano kufuneka luhlale luhleli. Kuya kufuneka basinde ngebhayisikile ye-thermal (ukwanda kunye nokuntyisela ubushushu), ukuntywila, kunye nokothuswa komzimba ngenxa yobomi bemveliso. Ibanga le-AutoMotive I-Semiconductor, umzekelo, kufuneka isebenze ngokungagungqi kangangesithuba seminyaka phantsi kwe-hood yemoto, inyamezele ubushushu obukhulu kunye nokungcangcazela okungapheliyo. Ubuthathaka i-wire ye-wire inokuqhekeka, kukhokelela ekungaphumeleli kwecebo. Yiyo le nto iinjineli zenkqubo zigxile kakhulu ekufezekiseni impumelelo egqibeleleyo, i-void-free weld Ngalo lonke ixesha. Sisiseko sokuthembeka kwawo onke ama elektroni.

Zeziphi iintlobo eziphambili zengcingo? Ukujonga ibhola ibhola vs. Wedge Bond

Zimbini iindlela eziphambili ezisetyenziswa kushishino: Ibhondi yebholaIng kunye Wedge BondIng. Ngelixa zombini zifezekisa injongo efanayo yokwenza ucingo Unxibelelwano, benjenjalo ngeendlela ezahlukeneyo kwaye balungele izicelo ezahlukeneyo. Ukuqonda umahluko wabo kubaluleke kakhulu ukwenza nayiphi na ilayini yemveliso.

I-Bloll Bondi:
Le yeyona ndlela ixhaphakileyo nekhawulezayo, iqhele ukusebenzisa igolide okanye ucingo lobhedu. Inkqubo iqala ngokunyibilika ukuphela kocingo nge-spark yombane, eyenza ibhola encinci ngenxa yoxinzelelo lomphezulu. Le bhola icinezelwe kwi I-Bond pad Sebenzisa indibaniselwano ye ubushushu kunye noxinzelelo, kwaye rhoqo amandla e-ultrasonic, kwinkqubo ebizwa I-thermosonic bond. Oku kudala I-Bondy yokuqala. Umatshini emva koko ucingo kwindawo yesibini yokunxibelelana kwaye yenza i-stitch-njenge I-Bond yesibini Ngaphambi kokuba uqhume ucingo qala kwakhona.

• Izibonelelo: Isantya esiphezulu, ukukwazi ukubophala kulo naluphi na ulwalathiso ukusuka kwinqanaba lokuqala.
• Izinto ezingalunganga: Ifuna indawo engaphezulu kwi-chip ngenxa yokuma kwebhola, ubushushu obuphezulu bunokuba ngumcimbi wokuba nezinto ezibuthathaka.

I-Wedge Bond:
Wedge BondIng, okanye I-Wedge wire bond, sebenzisa a Isixhobo esimisiweyo se-Wedge endaweni ye i-capillary. I ucingo lucinezelwe iflethi ngokuchasene ne I-Bond pad, kwaye amandla e-ultrasonic isetyenzisiwe ukwenza uqinile weld. Oku kuthetha ukuba i-noct-lincry-like. Inkqubo iphindwayo I-Bond yesibini. Le ndlela ihlala isetyenziswa i-aluminium wire, ngakumbi kwizicelo ezinamandla, kodwa zinokusetyenziselwa igolide ucingo kunye neribhoni.

• Izibonelelo: Yenza ibhondi encinci, esezantsi yeprofayili, ilungele i-pitch elungileyo (esondele kakhulu). Ngokuqhelekileyo kufuna ubushushu obuncinci, ukwenze ilungele izixhobo ezinobuthathaka kubushushu.
• Izinto ezingalunganga: Ngokwesiqhelo kuncipha kunebhola, kunye nendlela yokuqhubela phambili inqunyelwe kukuziqhelanisa wedge isixhobo.

EDongxin, sisenza izixhobo ezikhethekileyo ekudaleni izixhobo ze-Ultra kuzo zombini iinkqubo, ukusuka kwii-capillaries ze Ibhondi yebholai-ERS kwilungu wedge izixhobo ezifunekayo kwi-aluminium enzima. Ukhetho phakathi Ibhondi yebhola kwaye Wedge Bond ihlala ihla ukuya kwiimfuno ezithile zexabiso lexabiso, uxinzelelo, amandla, kunye nohlobo lwe I-wire wire isetyenzisiwe.

Isebenza njani i-wire yomatshini ozenzekelayo

Kwanamhlanje ucingo oluzenzekelayo Umfundi ongumsebenzi wobugcisa beerobhothi kunye neenkqubo zolawulo. Yenzelwe ukwenza amawaka eebhanti ngeyure ngeyure yokuchaneka kwamachaphaza. Isiseko somatshini yinkqubo yokulawula intshukumo yentshukumo eshukumayo eshukumisa intloko ye I-Semiconductor isixhobo. Le ntloko yebhondi ibambe i Isixhobo sokuBonelela (nokuba yi-capillary ye Ibhondi yebholaokanye i wedge kuba Wedge BondIng) kunye ne-spool ye I-wire wire.

Inkqubo iqala xa i NDIYABONA okanye subsare ilayishwe kumatshini. Inkqubo yoMbono enamandla ichonga iindawo ezichanekileyo zamaphepha eepads kunye namanqaku ahambelanayo kwi i-verframe okanye I-PCB. Isoftware yomatshini ibala indlela efanelekileyo nganye ucingo. Yanganye i-wire ye-wire, Umatshini uphumeza ulandelelwano oluchanekileyo:

1. Ukuma: Intloko ye-Bod ishukumisa isixhobo ngqo ngaphezulu kwe I-Bondy yokuqala indawo.
2. Bond: Isixhobo sisezantsi, kwaye umatshini usebenza ngokudibeneyo kwamandla, ubushushu, kunye / okanye amandla e-ultrasonic ukwenza weld.
3. Iphayithi: Umatshini uphakamisa isixhobo kwaye uhlawule i ucingo, ukwenza ubume obuthile bokulawula ukuphakama kwaye kuthintele ukufutshane.
4. I-Boing yesibini: Intloko ihamba kwindawo yesibini, kwaye I-Bond yesibini yenziwe.
5. Ukupheliswa: I ucingo yaphukile ngu-a i-clamp kunye nokuhambahamba, ukulungisa umatshini olandelayo i-wire ye-wire.

Lo mjikelo wonke wenzeka kwii-milliseconds. I Umatshini weWeldling Ihlala ibeka esweni izinto ezifana ne-harcer i-ultrasonic Amandla okuqinisekisa ukuba unxibelelwano dibana nonxibelelwano olugqibeleleyo. Aba booma booma, njengawethu I-WS9820 I-ALMUMUM YOKUGQIBELA I-ALMUMUM WONI, ziinjini zale mihla i-microelectiics Indibano, yenza ukuba ukuveliswa kwesininzi Izinto ze-elektroniki.

Zeziphi ezona ntlobo ziqhelekileyo ze-wire ezisetyenziselwa ukonwaba?

Ukhetho lwe I-wire wire sisigqibo esibalulekileyo esekwe kwiindleko, ukusebenza, kunye neemfuno zesicelo. Isixhobo ngasinye sinepropathi eyahlukileyo eyenza ilungele iimeko ezahlukeneyo. Owona mkhulu iintlobo zewire Isetyenziswe namhlanje yigolide, ubhedu, kunye ne-aluminium.

I-wire yegolide: Kumashumi eminyaka, igolide yayingumgangatho we I-wire bond ngenxa yokuthembeka kwayo okuphezulu. Ayifuni ioksidii-ize, esenza kube lula ukwenza i I-Bound elungileyo Unxibelelwano. Ukuthamba kwayo kuvumela UWire Wire Wire Kwimikhosi esezantsi, ukunciphisa uxinzelelo kwi-fragile isilicon chip. Nangona kunjalo, phezulu Ixabiso legolide iqhubekile kubavelisi abaninzi ukuba bafune ezinye iindlela.

Ucingo lobhedu: Ucingo lobhedu iye yaba yinto ethandwayo. Yayo Ukuqhutywa kombane iphakamile kunegolide, kwaye iphantsi kakhulu. Nangona kunjalo, ubhedu luyaba nzima kwaye lube uthanda i-oxidation, eyenza i I-Bound ifuna Indawo ehlala ilawulwa ngakumbi (ihlala isebenzisa isikhuselo segesi) kunye neeparamitha ezingaphezulu zeqhina ukukhusela umonakalo kwi I-Bond pad.

I-Alweminium wire: I-aluminium wire ixhaphake kakhulu ngaphakathi Wedge BondIng, ngakumbi izixhobo zamandla apho zikhulu ububanzi Iingcingo ziyafuneka ukuthwala imijikelezo ephezulu. Yenza i-monollic enamandla kakhulu weld Ngeepads ze-aluminium ze-aluminium kwi-chip, ukuthintela ukwenziwa kweBrittle IGold-Aluminium amathambo (yaziwa ngokuba "sisifo esifubayo") esinokubangela ukusilela kwebhondi ngexesha. Sinikezela ngoluhlu lwe I-wire ecocekileyo ye-aluminium Ngokweenjineli ezilungiselelwe ezi zicelo zifunwayo.

Ngaba ungayichaza isayensi esemva kwe-suldomonic sheld?

A Idrasonic weld yinkqubo enomdla ehlazisayo ezimbini indawo yentsimbi ngaphandle kokunyibilika. Yindlela ye-welding yoqinileyo-yombuso, ephambili kuyo UWire Wordonic Wire. Umlingo uyenzeka xa ii-pibency zenziwe rhoqo zenziwe kwi-Bonding yencoko ephantsi koxinzelelo.

Nantsi indlela esebenza ngayo: a Ucingo lwe-Wire isebenzisa i-transducer ukuba ivelise I-Right-frequency I-Acoustic i-Acoustic i-Acoustic, iqhele ukusukela kwi-20-120 khz. Le amandla okuvuma idluliselwe kwi Isixhobo sokuBonelela kwi ucingo. I ucingo lucinezelwe ngokuchasene ne I-Bond pad, kunye nokukhawuleza, ukuqhutyeka kwe amandla e-ultrasonic Ninisa izinto ezininzi:

1. Icoca umphezulu: I-vicketions ihlukane kwaye isasaze i-upersurs engaphezulu kwaye incinci ioksidi Ii-Lays kuzo zombini ucingo kwaye i I-Bond pad. Oku kuveza intsimbi ecocekileyo, ecocekileyo, ebaluleke kakhulu Yenza ibhondi.
2. Thobisa intsimbi: Ukuxabana okukhulu kuvelisa ubushushu bendawo, obangela iplastiki ukwenziwa kwengxaki Kwisinyithi kwi-interface. Oku kuthambeko kuvumela lo mphezulu omabini ukuthoba ngokusondeleyo.
3. Ikhuthaza ukungafani kweatom: Kunye nendawo ecocekileyo kwaye icinezelwe kunye, iiatom ezivela kwi ucingo kwaye ipali inokuhlukaniswa ngomda, idala inyani I-metrilljelical I-Bond.

Yonke I-Ultrasonic Bonding Inkqubo ithatha kuphela i-milliecond ezimbalwa. Ngokusebenzisa uxinzelelo kunye ne-ultrasonic Ukunyibilikisa endaweni yokunyibilika ngenxa yokunyibilika, kuthintela iingxaki ezinxulumene nobushushu obuphezulu, zenza ukuba zigqibelele Izinto ze-elektroniki. Indibaniselwano ye ubushushu kunye namandla e-ultrasonic lilitye lezinto zangoku I-thermosonic bond.

Zeziphi izinto ezichaphazela umgangatho weqhina ye-wire?

Ukufezekisa okugqibeleleyo i-wire ye-wire Ngokungaguquguqukiyo kwizigidi zonxibelelwano lucelomngeni oluntsonkothileyo. Njengenjineli, uyazi ukuba umgangatho ugqitywe ngumlinganiso obuthathaka wezinto ezininzi ezahlukeneyo. Ukuphambuka kancinci kuyo nayiphi na yazo kungakhokelela kwiqhina elibuthathaka okanye elingaphumelelanga.

Izinto eziphambili ezisemgangathweni:

• Ubunyulu bokwenyama: Umgangatho we I-wire wire kunye nokucoceka kwe I-Bond pad isiseko. Nakuphi na ukungcola okanye ungcoliseko lungancama ukwakhiwa kwesomeleleyo weld. Oku kubandakanya ukubethwa kwentsimbi kwi subsare.
• I-parameter ye-rameter: Ezi ziisethingi zomatshini ukuba injineli kufuneka isebenze. Babandakanya:
  • Nyanza: Inzima kangakanani isixhobo ucingo. Amandla amancinci kakhulu akhokelela kwiqhina elibuthathaka; kakhulu inokonakalisa i-chip.
  • Amandla e-Ultrasonic: Isixa se amandla e-ultrasonic isetyenzisiwe. Oku kufuneka kwenziwe ngokugqibeleleyo ukucoca umphezulu ngaphandle kokubangela imicro-rocks.
  • Ixesha: Ixesha lokufumana amandla kunye namandla asetyenziswayo.
  • Iqondo lokushisa: Ubushushu busebenza kwi subsare, enceda ukuba ithathe izixhobo.
• Imeko yesixhobo: I Isixhobo sokuBonelela-I wedge okanye i-capillary-yinto enokuthengisela iphazamisa ngokuhamba kwexesha. Isixhobo esinxilisayo okanye esingcolisekileyo siya kuvelisa iibhondi ezingahambelaniyo. Sibonile kuqala ukuba sisixhobo esiphezulu, esihlala ixesha elide, esiko I-Boinding Manyana, ungaphucula ngokumangalisayo isivuno kwaye unciphise ixesha lokuphumla imigca yemveliso.
• I-LOPGGRY: Ubume be ucingo I-loop ibalulekile. Ukuphakama okungalunganga kwe-lop kunokukhokelela kwimijikelezo emifutshane kunye nezinye iingcingo okanye ukuthathelwa ingqalelo komonakalo ngexesha elilandelayo lokungafuneki.

Ukuzibandakanya kwezi zinto kufuna ulwazi olunzulu lwenkqubo, izixhobo ezisemgangathweni, kunye ne-gooust Umatshini weWeldling. Yinkqubo eqhubekayo yokubeka esweni, ukuvavanywa, kunye nokucocwa.

Ngaba i-selling yelding ithelekiswa njani ne-wire yendabuko?

Ngelixa I-wire bond Itekhnoloji enkulu ye-chip uqhagamshelo lwe, I-Laser Welling ivela njengenye indlela enamandla yeentlobo ezahlukeneyo zonxibelelwano kwiNdibano ye-elektroniki, ngakumbi kwizinto ezinkulu ezinjengeemitha zebhetri kunye neebhabhasi.

I-Laser Welling isebenzisa i-beam egxile kakhulu ekukhanyiseni inyibilike kwaye ifune intsimbi eyahlukeneyo amalungu kunye. Ngokungafaniyo nelizwe eliqinileyo weld ye I-Ultrasonic Bonding, I-Laser Welling kudala i-fusion weld ngokunyibilika umxholo.

Thelekisa:

I-wire bond egqwesileyo ekudaleni amawaka amawaka omxholo omncinci, ochanekileyo malunga nesikhuselo I-Semiconductor ufe. Igalelo eliphantsi lobushushu lithintela umonakalo kwisekelo elibuthathaka. I-Laser WellingKwelinye icala, kungcono ukwenza i-wels eqinileyo, eyakhiwe ngokwamaso kumalungu amakhulu apho ubushushu obuphezulu buyamkelekile. Awuzukusebenzisa I-Laser Welling Ukudibanisa i-25-Microron ucingo kwi NDIYABONA, kodwa igqibelele ekwenzeni ithebhu yobhedu obukhulu kwithebhu yebhetri. Zitekhnoloji ezigqibeleleyo ezigqibeleleyo ezisombulula imiceli mngeni eyahlukeneyo yemveliso ye-elektroniki.

Yeyiphi imiceli mngeni ephambili kwi-wire wire fire fire namhlanje?

I I-Wire Sire Sport Inkqubo Ivuthiwe, kodwa ihlala ityhiliselwa kumda wayo ngokuthintela isantya esingenamali kwimveliso ye-elektroniki. Iinjineli zijamelene nemiceli mingeni emincinci efuna izisombululo ezitsha kunye nezixhobo ezingcono.

Enye yeyona miqobo inkulu IIMPAWU. Njengoko ii-chips zinamandla ngakumbi, zifuna ngakumbi kwaye ziqhagamshele ngakumbi kwindawo encinci. Oku kukhokelela kwi-pitch ye-Ultra, apho iipads zebhondi zibekwe kufutshane. Oku kufuna ukuchaneka okukhethekileyo kwi Ucingo lwe-Wire kwaye incinci, ngakumbi I-Bonding Sebenzisa okhethekileyo Isixhobo esimisiweyo se-Wedge. Nakuphi na ukungalunganga okuncinci kunokubangela isekethe emfutshane.

Omnye umngeni kukunyuka kwezinto ezintsha kunye nezixhobo ezinzima zesixhobo. Umzekelo, uqhayise kwiindidi ezintsha zokutshatisa okanye ukujongana neephakheji ezifakwe ezifakwe ezifakiweyo (i-3D-ics) zazisa izinto ezintsha. I i-coandes ye Ukwanda kwe-shirmal I-Mismatch phakathi kwezixhobo ezahlukeneyo inokubeka uxinzelelo kwi i-wire ye-wire Ngexesha lokusebenza, kukhokelela kwimiba yokuthembeka. Ngaphaya koko, inguqu ukuya ucingo lobhedu ukugcina iindleko ezinikezelweyo Imiceli mngeni enxulumene i-oxidation kunye nobunzima, befuna ukulawula ngenkqubo.

Okokugqibela, kuba amandla e-elektroniki, njengale kwizithuthi zombane kwaye I-Igbt Bond, umngeni wahlukile. Apha, inzima ububanzi i-aluminium ucingo okanye iiribhoni zisetyenziselwa ukuphatha imijelo ephezulu. Ubunzima bulele ekuhanjisweni ngokwaneleyo i-ultrasonic amandla ukwenza i-gooust weld Ngaphandle kokonakalisa isixhobo esikhulu, esibizayo. Kulapho umgangatho we Izixhobo zokuBola kunye namandla e Umatshini weWeldling zivavanywa ngokwenene.

Ukhetha njani ucingo olululo lwendlela kunye nezixhobo zesicelo sakho?

Ukukhetha ngokuchanekileyo I-wire wire kwaye izixhobo asisosigqibo nje sokuthenga; Luhlobo lobunjineli obubalulekileyo obuchaphazela ngokuthe ngqo isivuno, ukuthembeka, kunye neendleko. Kwinjineli yenkqubo, esi sigqibo sifuna indlela ecwangcisiweyo ethathela ingqalelo iimfuno ezizodwa zesixhobo.

Okokuqala, hlaziya isicelo. Sisixhobo esinamandla esifuna inkulu ububanzi i-aluminium wire ukuphatha okwangoku? Okanye ngaba yidijithali ephezulu NDIYABONA oko kufuna igolide ecocekileyo okanye ucingo lobhedu Ukuhamba kakuhle? Ukhetho lwe ucingo Izinto zezinto ezibonakalayo, ubhedu, okanye i-aluminium-yindawo yokuqala. Esi sigqibo siza kuphenjelelwa ziithagethi zeendleko (i-Copper vs), iimfuno zokuthembeka (ukuchasana kwegolide ukuvelisa), kunye nokunyibilikisa I-Bond pad (ialuminium ucingo kwi-Alweminium pads ukuthintela IGold-Aluminium i-intermetatics).

Kanye ucingo lusetyenziswa, inyathelo elilandelayo ukukhetha i Isixhobo sokuBonelela. Ijometri ye wedge okanye i-capillary kufuneka ihambelane ne Ububanzi beWire Nombindi webhongo lobume ngokugqibeleleyo. Isixhobo esinemilinganiselo engalunganga inokukhokelela ekuqulunweni kweBold Bond, umonakalo wocingo, okanye iziphumo ezingahambelaniyo. Umzekelo, a Wedge Bond Kwisithuba esiqinileyo sinokufuna isixhobo ngeprofayili encinci kakhulu. Izinto ezibonakalayo zesona-njenge-tungsten ye-tungsten okanye i-titanium-ibalulekile kubomi bayo kunye nokusebenza kwayo. Ukutyala imali kwizixhobo ezisemgangathweni okuphuma kumveliso okhethekileyo kuqinisekisa ukungqinelana kwesixhobo, eyona nto iphambili kwiinjineli ezingakwaziyo ukunyamezelana kwenkqubo. Indibaniselwano elungileyo ye ucingo olwahlukeneyo Iindidi kunye nezixhobo zokuchazela yifom yefomula yokuphumelela kwaye iphinde iphinde ifumaneke I-wire bond ukusebenza.

Iqhosha lezitshixo

• I-wire bonds ibalulekile: Yeyona ndlela iphambili yokwenza unxibelelwano lombane owenza umsebenzi wezixhobo ze-semicondcuctor.
• Iindidi ezimbini eziphambili ezikhoyo: Ibhola iBhola ikhawuleza kwaye iguquguqukayo, ngelixa I-Wedge Bond ichanekile kwaye ilungele isitayile esihle okanye iprofayile esezantsi.
• Yisayensi yokuchaneka: Inkqubo ixhomekeke kwisicelo esilawulwayo samandla, ubushushu, kunye i-ultrasonic amandla okwenza imeko eyomeleleyo, eyomeleleyo weld.
• Ukukhetha izinto ezibonakalayo kubalulekile: Ukukhethwa kwegolide, ubhedu, okanye i-aluminium ucingo Kuxhomekeka kurhwebo phakathi kwendleko, ukusebenza kunye neemfuno zokuthembeka.
• Umgangatho uxhomekeke kwizinto ezininzi: Ukufezekisa okugqibeleleyo i-wire ye-wire Ifuna izixhobo zokucoceka eziphezulu, iiparamitha ezihle, kunye nomgangatho ophezulu, oqinileyo Izixhobo zokuBola.
• Itekhnoloji isekhona: I-Minimination, izixhobo ezitsha, kunye nokusetyenziswa kwamandla aphezulu kuyaqhubeka ukutyhala imida yento I-Wire Sire Sport Inkqubo unokufezekisa.