
2025-09-02
Nitwa Kevin, kandi nkigice cyikoranabuhanga rya dongxike, namaze imyaka myinshi mwisi ya micro-micro-imashini. Nagize ibiganiro bitabarika hamwe na injeniyeri witondera nka Marcus mu Budage, basaba neza. Bazi ko microscopique imwe, microscopique wire Birashobora kuba itandukaniro riri hagati yo gukata igihugu cyimodoka hamwe numurongo uhenze. Iyi ngingo ni iyabo no kubantu bose bashaka kumva ikoranabuhanga ridasanzwe wire Guhuza. Tuzasesengurwa byose Inzira yo Guhuza Wire, uhereye kuri siyansi yibanze kugeza imashini zishimishije zituma bishoboka, kuguha ubushishozi bikenewe kugirango umenye iyi ntambwe yo gukora.
Imbere yayo, Amarira ya Wire ni inzira yo kurema amashanyarazi make akoresheje neza wire. Tekereza Chip ya mudasobwa igoye, a igice cya kabiri igikoresho ntanini kuruta urutoki rwawe. Iyi Chip igomba gushyikirana nisi yo hanze. Umugozi Guhuza ni ikiraro gituma iyi itumanaho ribaho. Ihuza imirongo microscopique kuri chip (ahantu hitwa a Bond Pad) kugeza kumashanyarazi manini kuri a substrate cyangwa lisframe. Iyi nzira nuburyo bukoreshwa cyane kuri Guhuza muri inganda za semiconductor.
Inzira ubwayo ni igitangaza cyubuhanga. Imashini yihariye ikoresha ihuriro ryimbaraga, ubushyuhe, kandi rimwe na rimwe Ultrasonic Ingufu zo gukora leta ikomeye gusudira hagati ya wire na Bond Pad. Ibi ntabwo ari nk'abagurisha gakondo; Nta bikoresho byuzuza. Ahubwo, atom ya wire na padi zizanwa hafi cyane kuburyo bagize imbaraga, zihoraho Metallurgical Bond. Ibi birema amashanyarazi yizewe cyane hamwe nubukanishi bushobora kwihanganira ibihe bibi imbere ya an igikoresho cya elegitoroniki.
Bitekerezeho nka microscopic yirabura. A igikoresho cyo guhuza Ahantu nyaburanga kandi ukanda a insinga hamwe na diameter akenshi bipimirwa muri microns (miriyoni ya metero). Intego ni ugukora inzira idafite amashanyarazi gutemba. Buri terefone, imodoka, na mudasobwa bishingiye kuri miliyari zibi bitunganye, bike. Ubusugire bwa buri wire ni plamount kumurimo wa ibice bya elegitoroniki Bahuza.
Akamaro ka wire in Igikoresho cya Semiconductor ntishobora gukandagira. Nintambwe yanyuma, ikomeye mugukora umuzenguruko wuzuye (Ic) imikorere. Nyuma yamasaha atabarika na miriyoni yamadorari akoreshwa gushushanya no guhimba ikigo silicon Wafer, ni abicisha bugufi wire ibyo bizana ubuzima. Nta buryo bwizewe bwa Guhuza, imbaraga nyinshi Ic ntakindi kirenze igice kidafite akamaro cya silicon.
Ubuziranenge wire iregirwa ibintu bibiri: byiza Imyitwarire y'amashanyarazi no gukomera imbaraga zubuka. The Umutungo w'amashanyarazi ni ngombwa kubikorwa. Kurwanya cyangwa kudahuza muri gusudira Irashobora gutesha agaciro ikimenyetso, ikabyara ubushyuhe budashaka, cyangwa bigatera igikoresho kunanirwa. Ibi ni ukuri cyane cyane mugukoresha inshuro nyinshi aho kuba ubunyangamugayo bwibimenyetso byose. The ubucuti hagati yinsinga Kandi padi igomba kuba ifite imbaraga nke zishoboka kugirango habeho imbaraga zinoze hamwe na post.
Byongeye kandi, aya masano agomba kuramba bidasanzwe. Bagomba kurokoka amagare yo gusiganwa ku maguru (kwagura no kwandura ubushyuhe), kunyeganyega, no guhungabana ku mubiri hejuru y'ubuzima. Icyiciro igice cya kabiriUrugero, kurugero, ugomba gukora utagira inenge muminsi munsi ya hood yimodoka, kwihanganira ubushyuhe bukabije kandi buhoraho. Intege nke wire yavunika, biganisha ku byaha. Iyi niyo mpamvu injeniyeri yibanda cyane kubyo kugera ku kuntu utunganye, idafite isuku gusudira buri gihe. Ni ishingiro ryo kwizerwa kuri electronics zose zigezweho.
Hariho uburyo bubiri bwibanze bukoreshwa mu nganda: umupiraing na Wedge Bonding. Mugihe byombi bigera ku ntego imwe yo gukora a wire guhuza, babikora muburyo butandukanye kandi bikwiranye na porogaramu zitandukanye. Gusobanukirwa itandukaniro ryabo nurufunguzo rwo kwemeza umurongo uwo ariwo wose.
Guhuza umupira:
Ubu ni uburyo busanzwe kandi bwihuse, mubisanzwe ukoresheje zahabu cyangwa umuyoboro w'umuringa. Inzira itangira gushonga iherezo ry'insinga hamwe numubatsi wamashanyarazi, ikora umupira muto kubera impagarara zo hejuru. Uyu mupira noneho ukanda kuri Bond Pad ukoresheje ihuriro rya ubushyuhe n'umuvuduko, kandi kenshi Ingufu za Ultrasonic, muburyo bwitwa Amarira ya Thermosonic. Ibi birema Uwiteka umuhuza wa mbere. Imashini noneho izunguruka wire kumurongo wa kabiri ingingo kandi utanga ubudozi umuhuza wa kabiri mbere yo guta wire hanze kugirango utangire.
Wedge ihuza:
Wedge Bonding, cyangwa Wedge Wire, Koresha a Igikoresho cya Wedge aho kuba a Capillary. Uwiteka insinga zirakanda Kuringaniza Bond Pad, na Ingufu za Ultrasonic ikoreshwa mugukora amahano gusudira. Ibi bigize icyerekezo cyiza, kidoda. Inzira isubirwamo kuri umuhuza wa kabiri. Ubu buryo bukoreshwa kenshi Umuyoboro wa Aluminium, cyane cyane mumashanyarazi menshi, ariko birashobora kandi gukoreshwa kuri zahabu wire na lente.
Kuri Dongxin, twihariye mugukora ibikoresho bya ultra-byerekana inzira zombi, uhereye kuri capillaries umupiraers to tonost wedge Ibikoresho bikenewe kubunganira aluminim. Guhitamo hagati umupira na Wedge Bond akenshi amanuka kubisabwa byihariye ryibikoresho, ubucucike, imbaraga, nubwoko bwa Guhuza insinga gukoreshwa.

Igezweho insinga yikora Bonder ni igihangano cya robo na sisitemu yo kugenzura. Yashizweho kugirango ikore ibihumbi nibihumbi kumasaha hamwe na Micron. Intangiriro yimashini nuburyo bukoreshwa muburyo bwo kugenzura butera Bond hejuru ya igice cya kabiri igikoresho. Uyu mutwe wumugabo ufashe igikoresho cyo guhuza (haba capillary kuri umupiraing cyangwa a wedge kuri Wedge Bonding) hamwe na spool ya Guhuza insinga.
Inzira itangira iyo an Ic cyangwa substrate yapakiwe muri mashini. Sisitemu ikomeye iyerekwa igaragaza ahantu nyaburanga padi hamwe ningingo zijyanye na lisframe cyangwa Pcb. Imashini ya mashini noneho ibara inzira nziza kuri buri wire. Kuri buri wire, imashini ikora neza:
Uru ruziga rwose ruba muri milisegonda. The imashini isurwa guhora ukurikirana ibintu nkimbaraga za qund kandi Ultrasonic imbaraga zo kwemeza ko buri murongo uhura nubuziranenge bukomeye. Izi mashini, nkuwacu Ws9820 Automatic Thick Aluminium Wire wedge Bonder, moteri zigezweho amashanyarazi Inteko, Gushoboza Umusaruro rusange ibice bya elegitoroniki.
Guhitamo Guhuza insinga nicyemezo gikomeye gishingiye ku giciro, imikorere, hamwe nibisabwa. Buri kintu gifite imitungo yihariye ituma ikwiriye mubihe bitandukanye. Ibyingenzi bitatu Ubwoko bw'insinga Byakoreshejwe muri iki gihe ni zahabu, umuringa, na alumunum.
| Ibikoresho | Umutungo w'ingenzi | Porogaramu rusange |
|---|---|---|
| Zahabu (au) | Byiza gukora, kurwanya ruswa, umuyoboro | Ibikoresho byo kwizerwa cyane, guhuza-pit-pit |
| Umuringa (CU) | Hejuru gukora, imbaraga nziza, igiciro gito | Ibikoresho byoroheje, ibikoresho bya elegitoroniki |
| Aluminium (al) | Igiciro gito, Bonds neza kuri Aluminium Pads, yoroshye | Ibikoresho byinshi, binini diameter wire Guhuza |
Umugozi wa zahabu: Mu myaka ibarirwa muri za mirongo, zahabu yari urwego rwa Amarira Kubera kwizerwa kwizerwa. Ntabwo oxydeIZE, yorohereza kurema a Ubucuti bwiza guhuza. Ubwitonzi bwayo bubyemerera Guhuza zahabu ku mbaraga zo hasi, kugabanya imihangayiko kuri fragile silicon Chip. Ariko, hejuru igiciro cya zahabu yakuyeho abakora benshi gushaka ubundi buryo.
Umuyoboro w'umuringa: Umuyoboro w'umuringa yahindutse ubundi buryo buzwi. Yayo Imyitwarire y'amashanyarazi ni hejuru kuruta zahabu, kandi bihendutse cyane. Ariko, umuringa urakomeye kandi ukunda okiside, ikora Guhuza birasaba Ibidukikije bigenzurwa (akenshi ukoresheje gaz ya ruzi ninkide) hamwe nuburyo bukomeye bwo gutunganya ibipimo kugirango birinde ibyangiritse kuri Bond Pad.
Umutsinga wa Aluminium: Umuyoboro wa Aluminium ni rusange Wedge Bonding, cyane cyane kubikoresho byimbaraga aho binini diameter Insinga zirakenewe kugirango utware imigezi myinshi. Ikora mono-metallic ikomeye gusudira hamwe na baluminium bond padi kuri chip, irinde gushiraho umwobo zahabu-aluminium Intermethics . Dutanga urutonde rwa insinga ya aluminium byashizweho muburyo bwo gusaba porogaramu.
An Ultrasonic Weld ni inzira ishimishije yifatanije bibiri Ibyuma utashonga. Nuburyo bwo gusudira-leta, ni urusati Ultrasonic Wire. Ubumaji bubaho iyo kunyera inshuro nyinshi bitangijwe mubufatanye bukoreshwa nigitutu.
Dore uko ikora: a imashini ifatanye ikoresha transducer kugirango itange inshuro nyinshi kunyeganyega kwa acoustic, mubisanzwe murwego rwa 20-120 KHZ. Ibi Ingufu za Vibration yimurirwa binyuze muri igikoresho cyo guhuza Kuri wire. Uwiteka insinga zirakanda kurwanya Uwiteka Bond Pad, hamwe no kwihuta, gukubitwa Ingufu za Ultrasonic asohoza ibintu byinshi:
Byose Ultrasonic inzira ifata miliderance nkeya. Ukoresheje igitutu na ultrasonic kunyeganyega aho kwishongora, birinda ibibazo bifitanye isano nubushyuhe bwinshi, bituma butunganye kugirango byoroshye ibice bya elegitoroniki. Uku guhuza ubushyuhe n'ingufu za ultrasonic Ese imfuruka yikigezweho Amarira ya Thermosonic.

Kugera wire Guhora muri miriyoni zihuza ni ikibazo kitoroshye. Nka injeniyeri, uzi ko ireme rigenwa nuburyo bworoshye bwimpinduka nyinshi. Gutandukana gato murimwe murimwe birashobora kuganisha ku nkunga ikomeye cyangwa yananiwe.
Ibintu by'ingenzi bifite ireme:
Kumenya Ibi bintu bisaba uburyo bwo gutunganya byimbitse, ibikoresho byiza cyane, hamwe nimbaraga imashini isurwa. Nuburyo buhoraho bwo gukurikirana, kwipimisha, no gutunganya.
Mugihe Amarira ni tekinoroji yiganje kuri chip-urwego Guhuza, laser gusudira ni kugaragara nkuburyo bukomeye kuburyo butandukanye bwihuza mumateraniro ya elegitoroniki, cyane cyane kubigize ibice binini nka tanyo ya bateri na busbars.
Laser gusudira ikoresha urumuri rwibanze rwumucyo kugirango ushonge kandi fuse Ibyuma bitandukanye ibice hamwe. Bitandukanye na leta ikomeye gusudira ya Ultrasonic, laser gusudira Kurema Fusion gusudira mugushonga ibikoresho.
Kugereranya:
| Ibiranga | Ultrasonic Wire | Laser gusudira |
|---|---|---|
| Uburyo | Ikomeye-Leta gusudira (ubushyuhe na ultrasonic) | Guhuza gusudira (gushonga) |
| Igipimo | Microscopique (insinga nziza Kuri Chip Pads) | Micro to macro (battri ya bateri, guhuza) |
| Shyurwa | Byanze bikunze, ubushyuhe buke muri rusange | Wibanze cyane, ariko urashobora gukora akarere gakomeye kanduye |
| Ibikoresho | Ibice byihariye (Au-au, al-al, AU-AL) | Ubwoko butandukanye bwibishabyo bisa kandi bidasa |
| Umubonano | Bisaba guhuza umubiri nigitutu | Inzira itari yo, yemerera gusudira ahantu hakomeye |
Amarira kuba indashyikirwa mukurema ibihumbi bito, byukuri muburyo bworoshye igice cya kabiri gupfa. Ubushyuhe buke bwo kwinjiza birinda kwangirika kwangiza; Laser gusudiraKu rundi ruhande, nibyiza ko hashyirwaho ibishushanyo bikomeye, byubatswe kubice binini aho ubushyuhe bwinshi bwemewe. Ntabwo wakoresha laser gusudira Guhuza Micron wire kuri an Ic, ariko nibyiza ko gusudira umuringa wijimye kuri bateri. Nibihangano byuzuzanya bikemura ibibazo bitandukanye mumashyamba yagutse yo gukora ibikoresho bya elegitoroniki.

Uwiteka Inzira yo Guhuza Wire ni ukuze, ariko burigihe bisunikwa ku kabuza ku muvuduko uhoraho wo guhanga udushya mu nganda za elegitoroniki. Abashakashatsi bahura nibibazo byinshi byingenzi bisaba ibisubizo bishya nibikoresho byiza.
Imwe mu mbogamizi nini ni miniaturisation. Mugihe chips irushaho gukomera, bisaba byinshi kandi byinshi i / o guhuza ahantu hato. Ibi biganisha ku guhuza ultra-nziza, aho padi ishyirwa hafi cyane. Ibi bisaba ukuri bidasanzwe kuva imashini ifatanye na ntoya, irasobanutse neza Guhuza idasanzwe Igikoresho cya Wedge. Gutesha agaciro gato birashobora gutera umuzunguruko mugufi.
Indi mbogamizi ni ukuzamuka kw'ibikoresho bishya n'inzego zikoreshwa rigoye. Kurugero, guhuza ubwoko bushya bwibisohoka cyangwa gucuruza hamwe na papa zishyizwe hamwe (3d-acs) itangiza impinduka nshya. The coefficient ya kwaguka guhuza hagati y'ibikoresho bitandukanye birashobora gushira imihangayiko kuri wire Mugihe cyo gukora, biganisha ku bibazo byizerwa. Byongeye kandi, inzibacyuho umuyoboro w'umuringa kubika amafaranga yatangijwe ibibazo bijyanye okiside no gukomera, bisaba kugenzura ibintu binini.
Hanyuma, kubutegetsi bwa electronics, nkibi mubinyabiziga by'amashanyarazi na Imashini zihuza, ikibazo kiratandukanye. Hano, biremereye diameter aluminium wire cyangwa ibibaringo bikoreshwa mugukemura imigezi myinshi. Ingorane ziri mu gutanga bihagije Ultrasonic imbaraga zo gukora urufunguzo gusudira udangiza ibikoresho binini, bihenze. Aha niho ubuziranenge bwa ibikoresho byo guhuza n'imbaraga za imashini isurwa bigeragezwa rwose.
Guhitamo neza Guhuza insinga n'ibikoresho ntabwo ari icyemezo cyo kugura gusa; Nuburyo bwubuhanga bufite ingaruka zitaziguye, kwizerwa, nibiciro. Kuri injeniyeri, iki cyemezo gisaba uburyo butunganijwe bufata ibisabwa bidasanzwe.
Ubwa mbere, usesengure gusaba. Nibikoresho byingufu-byingufu bisaba nini diameter Umuyoboro wa Aluminium gucunga ubu? Cyangwa ni igicucu cyo hejuru Ic ibyo bikenera ultra-nziza cyangwa umuyoboro w'umuringa Kumabaniko nziza? Guhitamo wire Ibikoresho-Zahabu, Umuringa, cyangwa Aluminium-nintangiriro. Iki cyemezo kizaterwa nintego zabigenewe (zahabu yumuringa), zikeneye kwizerwa (kurwanya Zahabu irwanya ruswa), no kurwanya ibyuma bya Bond Pad (aluminium wire kuri Aluminium PADS kugirango wirinde zahabu-aluminium Intermethics).
Rimwe insinga ikoreshwa, intambwe ikurikira irahitamo igikoresho cyo guhuza. Geometrie ya wedge cyangwa capillary agomba guhuza diameter Kandi ubunini bwa padi. Igikoresho gifite ibipimo bitari byo bishobora kuganisha ku gushinja umubano, kwangirika kwinsinga, cyangwa ibisubizo bidahuye. Kurugero, a Wedge Bond Mumwanya ufunze urashobora gusaba igikoresho ufite umwirondoro muto. Ibikoresho byigikoresho ubwacyo-nka cungsten carbide cyangwa titanium-nabyo ni ngombwa kubikorwa byubuzima bwayo n'imikorere. Gushora mubikoresho byiza byurugero rwihariye butuma habaho igikoresho cyihariye cyo guhuza ibikoresho, aricyo cyingenzi kuba injeniyeri udashobora kwihanganira inzira zitandukanye. Igorofa yo insinga zitandukanye Ubwoko nibikoresho byateganijwe ni formula kugirango igende neza kandi isubirwamo Amarira imikorere.