Iyo yekupedzisira gwara kune iyo Wire Bond: Mashandisiro anoita Tiri Wire Simba Redu Nyika Yedu

Zita rangu ndiKevin, uye sechimwe chikamu chechikwata kuDongxin Electronic tekinoroji, ndapedza makore akadzika munyika yezvinyorwa zvemachinji-machinji uye zvepamberi zvinhu. Ndave neine hurukuro dzisingaverengeki neinjiniya yemasendu senge Marcus kuGermany, uyo anodikanwa zvachose. Ivo vanoziva kuti imwe chete, microscopic Wire Bond inogona kuve musiyano pakati pekucheka-kumucheto emagetsi sensor uye inodhura mutsara kutadza kutadza. Ichi chinyorwa chiri kwavari uye kune chero munhu anoda kunzwisisa hunyanzvi hunoshamisa hwe waya kusungwa. Isu tichaongorora zvese Wire Boging Process, kubva musainzi yakakosha kumachina epamberi inoita kuti zviitike, kukupa iwe nzwisiso inodiwa kuti isimbe iri rinonyanya kuoma danho rekugadzira.

Chii chaizvo chinonzi waya yekubatanidza maitiro mu microyelectronics?

Pamusimboti wayo, Wire Bonding ndiyo maitiro yekugadzira matinji emagetsi ekubatanidza uchishandisa yakanaka kwazvo waya. Fungidzira chipikicha chipakomborero, a semicononductor mudziyo hapana wakakura kupfuura munwe wako. Ichi chip chinoda kutaura nenyika yekunze. Waya Kubatira ibhiriji iyo inoita kuti uku kutaurirana zviitike. Iyo inobatanidza microscopic zvitima pane chip (pane nzvimbo inonzi a Bond Pad) kune magetsi akakura magetsi pane a substrate kana leftframe. Maitiro aya ndiyo inonyanya kushandiswa nzira ye Kubatana mu Semiconductor Indasitiri.

Maitiro acho pachayo chishamiso cheinjiniya. Muchina wakakosha unoshandisa musanganiswa wesimba, kupisa, uye dzimwe nguva Ultrasonic simba kugadzira yakasimba-nyika weld pakati pe waya uye Bond Pad. Izvi hazvina kufanana nekutengesa kwechinyakare; Iko hakuna chinhu chifeve. Pachinzvimbo, maatomu a waya uye iyo pad inounzwa padhuze pamwe chete kuti vanoumba yakasimba, isingagumi Metallurgical Bond Izvi zvinoumba huwandu hwakavimbika hwakajeka uye huni hwekubatanidza hunogona kutsungirira mamiriro akaomarara mukati me Chishandiso chemagetsi.

Funga nezvazvo seMicroscopic Blacksmiting. A Bonding Tool Nzvimbo dzepanyatso uye dzinodzvinyirira a yakaonda waya ne dhayamita inowanzo kuyerwa mu micons (mamirimita emamita). Chinangwa ndechekugadzira nzira isina rusununguko yeMagetsi kuyerera. Imwe neimwe smartphone, mota, uye komputa inovimba nemabhiriyoni eaya akakwana, zvidiki zvibvumirano. Kuvimbika kweumwe neumwe Wire Bond isingabvumirwe kushanda kwe zvigadzirwa zvemagetsi Ivo vanobatana.

Sei chisungo chemaya chakaoma kuitira Semiconductor mudziyo wekutama?

Kukosha kwe Wire Bond mukati Semiconductor mudziyo wekugadzira haigoni kuve yakakundwa. Iyo yekupedzisira, yakakosha nhanho mukugadzira dunhu rakabatanidzwa (IC) inoshanda. Mushure memaawa asingaverengeke nemamiriyoni emadhora anoshandiswa kugadzirwa uye kuumba kuoma silicon Wafer, ndivo vanozvininipisa waya izvo zvinounza kuhupenyu. Pasina nzira yakavimbika ye Kubatana, ane simba kwazvo IC hachisi chinhu chinopfuura chidimbu chisina basa silicon.

Mhando yepamusoro Wire Bond inosimbisa zvinhu zviviri: zvakanaka magetsi maitiro uye kusimba simba rekusimba. The the zvivakwa zvemagetsi zvakakosha pakuita. Chero kupokana kana kusawirirana mu weld inogona kushatisa chiratidzo, gadzira kupisa kusingadziviswi, kana kukonzera mudziyo wokutadza. Izvi ndezvechokwadi zvakanyanya muzvinyorose-frequents The the Bond pakati paWire Uye iyo pad inofanira kuve neyakadzika kwazvo kuramba kuti ive nechokwadi chakanyatsokodzera simba uye kutumira data.

Uyezve, izvi zvinongedzo zvinofanirwa kuve zvinoshamisa. Ivo vanofanirwa kupona kubhururuka kwemvura Automotivation-giredhi semicononductor, semuenzaniso, anofanira kushanda zvisina mhosva kwemakore pasi pehodhi yemota, kutsungirira kupisa kwakanyanya uye kugara uchizununguka. Isina kusimba Wire Bond yaizopwanya, inotungamira kukundikana kwekutadza. Ichi ndicho chikonzero mainjiniya ekurongedza achitarisisa zvakanyanya pakuzadzisa yakakwana, isina-isina weld imwe neimwe nguva. Ihwohwo hwaro hwekuvimbika kune ese magetsi emazuva ano.

Ndeapi marudzi makuru eaya waya kusungwa? Kutarisa Bhora vs. Wedge Bhuku

Pane nzira mbiri dzekutanga dzinoshandiswa muindasitiri: BALL BCHASing uye Wedge Bonding. Nepo zvese zviyero zvakafanana nechinangwa chekugadzira a waya Kubatana, vanodaro nenzira dzakasiyana uye vanokodzera kushandiswa kwakasiyana. Kunzwisisa misiyano yavo ndiyo kiyi yekugadzirisa chero tambo yekugadzira.

BLOB BOBG:
Iyi ndiyo nzira yakajairika uye inokurumidza, kazhinji uchishandisa goridhe kana Copper waya. Maitiro acho anotanga nekunyungudutsa kupera kwe waya ine spark yemagetsi, iyo inoumba idiki bhora nekuda kwekunetseka kwepasi. Bhora iri rinobva rakatsikirirwa pane Bond Pad uchishandisa musanganiswa we kupisa uye kumanikidzwa, uye kazhinji Ultrasonic Energy, mune maitiro anonzi Thermonic Bonding. Izvi zvinogadzira iyo Chekutanga Bond. Muchina wobva waisa waya kune yechipiri yekubatanidza poindi uye inogadzira iyo stitch-senge Chisungo chechipiri usati wabvarura waya kuenda kunotanga zvakare.

• Zvakanakira: Kumhanya kwakanyanya, kugona kubatana mune chero nzira kubva pane yekutanga pfungwa.
• Zvinokuvadza: Inoda nzvimbo yakawanda pane chip nekuda kweiyo bhora chimiro, kupisa kwepamusoro kunogona kuve nyaya yezvinhu zvakaringana.

Wedge Bhiza:
Wedge Bonding, kana Wedge waya kusungwa, inoshandisa a Wedge-Akavezwa Chishandiso panzvimbo ye Capillary. The the waya yakamanikidzwa flat kupokana ne Bond Pad, uye Ultrasonic Energy inoiswa kuti igadzire kukakavara weld. Izvi zvinoumba zvakachena, stitch-senge chisungo. Maitiro acho anodzokororwa Chisungo chechipiri. Iyi nzira inowanzoshandiswa nayo Aluminium Wire, kunyanya mune yakakwirira-simba mashandisirwo, asi inogona kushandiswawo negoridhe waya uye ribhoni.

• Zvakanakira: Inogadzira chidiki, chepasi-chimiro chisungo, chakanakira pitch-pitch (zvakanyatsogadzirirwa) zvishandiso. Iyo inowanzoda kupisa kushoma, kuiita kuti iite yakakodzera kune tembiricha-inokanganisa zvishandiso.
• Zvinokuvadza: Kazhinji zvishoma nezvishoma pane bhora rekubatanidza, uye kutungamira kwekubatanidza kunogumira neyekutarisa kwe wedge chishandiso.

KuDongxin, isu takasarudzika mukugadzira iyo Ultra-chaiyo maturusi ezvese maitiro, kubva kumappillaries BALL BCHASers kusvika pakugara wedge Zvishandiso zvinodiwa kune inorema aluminium bonding. Sarudzo pakati BALL BCHAS uye Wedge Bond kazhinji inouya pasi kune izvo zvinodikanwa zvemushini-mutengo, density, simba, uye rudzi rwe Kuronga waya kushandiswa.

Iyo yemazuva ano otomatiki waya yekubatira bonding muchina basa sei?

Chazvino otomatiki waya Bonder inyanzvi yemobotic uye kudzora masisitimu. Yakagadzirirwa kuita zviuru zvezvibvumirano pane imwe nguva ne-sub-micron chokwadi. Iyo musimboti weiyo muchina ndeyekunyanyisa kutenderera kwekudzora maitiro anofambisa chisungo musoro pamusoro pe semicononductor mudziyo. Iyi bond yemusoro inobata iyo Bonding Tool (Chero capillary ye BALL BCHASing kana a wedge Nekuti Wedge Bonding) uye iyo spool ye Kuronga waya.

Maitiro acho anotanga kana a IC kana substrate inoremerwa muchina. Systems ine simba inoratidza nzvimbo chaiyo yemasangano emasangano uye mapoinzi anoenderana pane leftframe kana PCB. Iyo software yeSoftware inozadzisa nzira yakakwana yeumwe neumwe waya. Kune yega yega Wire Bond, Muchina unoreva nhevedzo chaiyo:

1. Kumisikidza: Iyo bond yemusoro inofambisa chishandiso zvakananga pamusoro Chekutanga Bond saiti.
2. Kubatira: Chishandiso chinodzikira, uye muchina uyu unoshandisa iyo yakarongedzwa musanganiswa wesimba, tembiricha, uye / kana Ultrasonic Energy kugadzira iyo weld.
3. Loping: Muchina unomutsa chishandiso uye unobhadhara kunze waya, kugadzira chimiro chevhu chairo chekudzora kukwirira uye kudzivirira kupfupika.
4. Chechipiri Kubatira: Musoro unoenda kunzvimbo yechipiri, uye Chisungo chechipiri yakagadzirwa.
5. Kupera: The the waya yakatsemurwa ne clamp uye kubereka kufamba, kugadzirira muchina kune inotevera Wire Bond.

Kutenderera uku kwese kunoitika mumamirimo. The the Welding Machine inogara ichiraramira zvinhu senge chisungo chesimba uye Ultrasonic Simba rekuona kuti kubatana kwese kunosangana nemhando dzakasiyana. Iyi michina, kunge yedu WS9820 otomatiki thick aluminium wire wedge bonder, ndidzo injini dzazvino microelectronics gungano, zvichigonesa kugadzirwa kukuru kweiyo yakaoma zvigadzirwa zvemagetsi.

Ndeapi marudzi akajairika emaya aya anoshandiswa kusungwa?

Sarudzo ye Kuronga waya isarudzo yakaoma yakavakirwa pamubhadharo, kuita, uye zvinodiwa application. Zvese zvinhu zvine zvimiro zvakasarudzika izvo zvinoita kuti zviite zvakakodzera mamiriro akasiyana. Matatu matatu Mhando dzeWire Inoshandiswa nhasi ndarama, ndarira, uye aluminium.

Goridhe Wire: Kwemakumi emakore, goridhe yaive mwero we Wire Kubatira nekuda kwekuvimbika kwakanyanya. Hazvadaro oxideize, zvichiita kuti zvive nyore kugadzira a Kurarama kwakanaka kubatana. Kupfava kwayo kunobvumira goridhe waya kusungwa kumauto akaderera, kuderedza kushushikana pane isina kusimba silicon chip. Nekudaro, yakakwira Mari yegoridhe yadzinga vagadziri vazhinji kuti vatsvage dzimwe nzira.

Copper Wire: Copper waya rave paine imwe nzira inozivikanwa. Its magetsi maitiro Kunyangwe yakakwirira kupfuura goridhe, uye zvakachipa zvakanyanya. Nekudaro, mhangura yakaomesesa uye inowedzera oxidation, inogadzira iyo kurumwa kunoda nharaunda yakadzorwa zvakanyanya (kazhinji uchishandisa inert gasi nhoo) uye zvakanyanya robust maitiro ekudzivirira kukuvara kune Bond Pad.

Aluminium Wire: Aluminium Wire yakajairika mukati Wedge Bonding, kunyanya nekuda kwesimba pane hombe dhayamita waya dzinodiwa kutakura mafungu akakwira. Iyo inoumba yakasimba kwazvo mono-metalic weld neiyo aluminium bond maps pane chip, ichidzivisa kuumbwa kweBrittle Goridhe-Aluminium Intermitallics (inozivikanwa se "chiredzo chepepuru") izvo zvinogona kukonzera kusungwa kutadza nekufamba kwenguva. Isu tinopa huwandu hwe yakachena aluminium waya zvakananga injinjwe nekuda kweizvi zvinodiwa zvinoshandiswa.

Unogona kutsanangura sainzi kuseri kweiyo ultrasonic weld?

An Ultrasonic weld chiitiko chinonakidza icho chinobatana zviviri simbi nzvimbo pasina kuvanyungudika. Iyo fomu yeiyo yakasimba-nyika tulating, iyo iri pakati Ultrasonic Wire Kubatira. Iwo mashiripiti anoitika apo yakakwira-frequency vibrations inounzwa kune yekubatanidza interface pasi pekumanikidzwa.

Heino maitiro ayo anoshanda: a Wire Bozing Machine inoshandisa transducer yekugadzira yakakwira-frequency Acoustic vibrations, kazhinji mune iyo 20-120 KHz. Izvi vibration simba inoendeswa kuburikidza ne Bonding Tool ku waya. The the waya yakamanikidzwa zvinopesana naIshe Bond Pad, uye kukurumidza, kupukunyuka kwekufamba kwe Ultrasonic Energy inozadzisa zvinhu zvinoverengeka:

1. Kuchenesa pamusoro: Iyo vibrations inorambana uye inopararira nzvimbo dzakasvibiswa uye dzakatetepa oxide materers pane zvese waya uye Bond Pad. Izvi zvinofumura simbi dzakachena, dzakachena, izvo zvakakosha kuti gadzira chisungo.
2. Inofarira simbi: Iko kusekeresa kwakanyanya kunogadzira kupisa kwemuno, zvichikonzera plastiki deformation musimbi pane iyo interface. Uku kupfava kunobvumira nzvimbo mbiri dzekuwirirana zvakanyanya.
3. Inosimudzira atomic diffusion: Nezvakacheneswa zvakacheneswa uye zvakamanikidzwa pamwe chete, maatomu kubva ku waya uye iyo pad inogona kusimbisa mwero miganhu, ichigadzira ichokwadi Metallurgical Bond

Izvo zvese Ultrasonic Bonding maitiro anotora mashoma mashoma mamirisiti. Nekushandisa Dzvinyiriro uye Ultrasonic vibration panzvimbo yehuwandu hwekunyungudika, rinodzivisa matambudziko anoenderana nekupisa kwakanyanya, achiita kuti ive yakakwana kune isina kugadzikana zvigadzirwa zvemagetsi. Kusanganiswa kwe kupisa uye ultrasonic simba ndiyo dombo rebwe Thermonic Bonding.

Ndezvipi zvinhu zvinokanganisa kunaka kweiyo waya ye waya?

Kuzadzisa yakakwana Wire Bond nguva nenguva kuyambuka mamirioni eungano idambudziko rakaoma. Semununoni, iwe unoziva kuti mhando inotsanangurwa neyekukutu zviyero zvemazhinji marara. Kutsanangurwa kushoma mune chero chipi zvacho chavo kunogona kutungamira kune isina kusimba kana yakundikana chisungo.

Zvinhu zvemhando yepamusoro:

• Kuchena kwezvinhu: Kunaka kwe Kuronga waya uye kuchena kwe Bond Pad ndezvehuhu. Chero kusvibiswa kana kusvibiswa kunogona kudzivirira kuumbwa kweakasimba weld. Izvi zvinosanganisira simbi plating pane substrate.
• Kuronga paramita: Iyi ndiyo machina marongero ayo mainjiniya anofanirwa kurerutsa. Zvinosanganisira:
  • Simba: Hanyaya chishandiso chinodzivirira sei waya. Kunyanya kusimba kunokonzerwa nechisungo chisina kusimba; zvakawandisa zvinogona kukuvadza chip.
  • Ultrasonic simba: Huwandu hwe Ultrasonic Energy kuiswa. Izvi zvinoda kuiswa zvakakwana kuti uchenese pasi pasina kukonzera micro-trocks.
  • Nguva: Iyo nguva yekumanikidza simba uye simba rinoshandiswa.
  • Tembiricha. Kupisa kunoiswa kune substrate, iyo inobatsira kupfava zvinhu.
• Tool Mamiriro: The the Bonding Tool-Izvi wedge kana capillary-chikamu chinodiwa chinopfeka nguva nenguva. Chishandiso chakapfeka kana chakasvibiswa chinoburitsa zvisungo zvisingapindirani. Isu tazvionera pachedu kuti sei munhu wepamusoro-soro, kwenguva refu chishandiso, senge yedu tsika Kubatira Machine Consleables, kudzikamisa zvikuru kubereka uye kuderedza nguva yekubvisa mitsara yekugadzira.
• Loop geometry: Chimiro che waya chiuno zvakare chakatsoropodza. Hurefu hwechikepe chisina kujairika chinogona kutungamira kumazita-madiki nemamwe waya kana kuve nekukanganiswa kukuvadza panguva yakazotevera yekugadzira scapapuring.

Kusimbisa zvinhu izvi kunoda kurongeka kwakadzika kwezivo, zvakakwirira-zvemhando zvigadzirwa, uye robust Welding Machine. Iyo inoenderera mberi maitiro ekutarisa, kuyedza, uye kunatswa.

Laser anofamba sei achienzaniswa neyakagadzirwa yechinyakare?

Nepo Wire Kubatira ndiyo dhizaini tekinoroji yechip-chikamu Kubatana, laser weldering iri kubuda seimwe nzira ine simba yemhando dzakasiyana dzekubatana mumagetsi emagetsi, kunyanya kune zvakakura zvikamu kunge mabhegi ebhatiri nemabhazi.

Laser Weldinging inoshandisa danda rakanyanya kutaridzika rechiedza kuti inyungudike uye fuse simbi dzakasiyana siyana zvikamu pamwe chete. Kusiyana neiyo yakasimba-nyika weld ye Ultrasonic Bonding, laser weldering inogadzira fusion weld Nekunyungudika izvo zvinyorwa.

Kuenzanisa:

Wire Kubatira inodarika pakugadzira zviuru zvechidiki, zvakaringana kubatana pane zvisina kufanira semicononductor kufa. Iyo yakadzika kupisa yekuisa inodzivirira kukuvadza kune inokatyamadza yekorosi. Laser Weldinging, kune rumwe rutivi, zviri nani kusika yakasimba, yakarongedzwa maWelds pane zvikamu zvakakura zvinowanikwa nekupisa kwakanyanya kunogamuchirika. Haushandise laser weldering Kuti ubatanidze 25-Micron waya kune IC, asi yakakwana kuti tirambe tabu tabu tab yebhatiri terminal. Iwo matekinoroji anowedzera anogadzirisa matambudziko akasiyana munzvimbo yakakura kwazvo yezvemagetsi kugadzira.

Ndedzipi matambudziko akakosha mumamiriro ekurongedza waya nhasi?

The the Wire Boging Process Kukura, asi kunogara kusundidzirwa kumiganhu yayo nekumhanya kusingaperi kweinzvimbo yemagetsi. Mainjiniya anotarisana nematambudziko makuru akati wandei anoda mhinduro nyowani uye zvinhu zviri nani.

Imwe yehurongwa hukuru huri miniaturization. Sezvo machipisi anozove ane simba, iwo anoda zvimwe uye zvakanyanya i / o kubatana munzvimbo diki. Izvi zvinotungamira ku Ultra-yakanaka pitch bonding, uko maBond mapadhi anoiswa anoshamisa pamwe chete. Izvi zvinoda kurongeka kwakasiyana kubva ku Wire Bozing Machine uye zvidiki, zvakanyanya kunyatsojeka Kuronga Kushandisa chakakosha Wedge-Akavezwa Chishandiso. Chero kushoma kiripiti kunogona kukonzera dunhu pfupi.

Rimwe dambudziko ndiko kusimuka kwezvinhu zvitsva uye zvimiro zvakaoma zvekushandisa. Semuenzaniso, kusungirirwa kumhando matsva ekutsanangudza kana kubata neakasarudzika-die mapakeji (3D-ics) anounza mutsva akasiyana. The the coeffient ye kuwedzera kwekuwedzera mismt pakati pezvisikwa zvakasiyana zvinogona kuisa kushushikana pane Wire Bond panguva yekushanda, zvichitungamira kune kuvimbika nyaya. Uyezve, shanduko yacho ku Copper waya kuponesa mitengo yakaunzwa matambudziko ane chekuita nazvo oxidation uye kuomarara, kunoda maitiro akasimba.

Pakupedzisira, yesimba remagetsi, senge idzo dziri mumotokari dzemagetsi uye IGBT Kubatanidza Machina, dambudziko rakasiyana. Apa, zvinorema dhayamita Aluminium waya kana mbabvu dzinoshandiswa kubata mifungo yakakwira. Iko kuoma kunorara mukununura zvakakwana Ultrasonic simba rekugadzira robust weld Pasina kukuvadza iyo yakakura, inodhura magetsi mudziyo. Apa ndipo panowanikwa mhando ye Kubatanidza Zvishandiso uye simba re Welding Machine vanonyatso kuedzwa.

Unosarudza sei iyo chaiyo yekubatanidza waya uye zvishandiso zvekushandisa kwako?

Kusarudza iyo chaiyo Kuronga waya uye zvishandiso hazvisi chisarudzo chekutenga chete; Iko kusarudzwa kwakakosha kweinjiniya kunokanganisa zvakananga, kuvimbika, uye mutengo. Kuti uwane mainjiniya anoita, iyi sarudzo inoda nzira yakarongeka inoenderana nezvinodiwa zvemudziyo.

Kutanga, ongorora chikumbiro. Icho chishandiso chakakwirira-simba chinoda hombe dhayamita Aluminium Wire Kugadzirisa zvazvino? Kana kuti ndeye yakakwira-density digital IC izvo zvinoda Ultra-yakajeka goridhe kana Copper waya Kubatira-pirch-pirch? Sarudzo ye waya Zvinyorwa-goridhe, mhangura, kana aluminium - ndiyo yekutanga pfungwa. Ichi chisarudzo chichavharirwa nemitengo yemitengo Bond Pad (Aluminium waya pane aluminium mapads kudzivirira Goridhe-Aluminium intermfallics).

Kamwe chete waya inoshandiswa, nhanho inotevera iri kusarudza iyo Bonding Tool. Iyo geometry ye wedge kana capillary inofanira kuenderana ne waya diamita uye iyo bond musangano unzira zvakakwana. Chishandiso chine zviyero zvisina kunaka zvinogona kutungamira kusungwa kusungwa kwekuumbwa, waya kukuvara, kana zvisingawirirani. Semuenzaniso, a Wedge Bond Mune imwe nzvimbo yakasimba ingangoda chishandiso chine mbiri yakatetepa. Izvo zvinyorwa zvezvishandiso izvo-kunge tungsten carbide kana titanium-zvakakoshawo nekuda kwehupenyu hwayo uye kuita kwayo. Kudyara mumidziyo yakakwirira-yemhando yepamusoro kubva kune yakasarudzika mugadziri anobatsira zvekushandisa-to-to-to-to-kushamwaridzana neinjiniya vasingakwanise kutsungirira maitiro. Musanganiswa chaiwo we Wire Wire Mhando uye zvishandiso zvakanyatsojeka ndewe formula kuti ubudirire uye unodzokororwa Wire Kubatira kuvhiya.

Key Deaaroways

• Wire Bonding ndiyo yakakosha: Iyo ndiyo nzira yekutanga yekugadzira iyo yemagetsi inobatanidza iyo inoita semiconductor michina basa.
• Mhando mbiri huru iripo: Bhora Bland kutsanya nekutsanya, nepo Wedge Bhuku yakajeka uye yakakodzera kune yakanaka-gomba kana yakaderera-profiles application.
• Iyo sainzi yekunyatso: Maitiro acho anovimba nekushandisa kwakadzorwa kwesimba, tembiricha, uye Ultrasonic simba kugadzira yakasimba, yakasimba-nyika weld.
• Chisarudzo Chekunyora Kwakakosha: Kusarudzwa kwegoridhe, mhangura, kana aluminium waya Zvinoenderana nekutengeserana-kubva pakati pemutengo, kuita, uye kuvimba zvinodiwa kuvimbika.
• Hunhu hunoenderana nezvakawanda zvinhu: Kuzadzisa yakakwana Wire Bond inoda zvinhu zvakanyanyisa-zvakanyanyisa, muchina wechibereko, uye wakakwira-mhando, unogara Kubatanidza Zvishandiso.
• Iyo tekinoroji ichiramba ichibva: Miniaturization, zvinhu zvitsva, uye zvinoshandiswa nesimba-simba zvinoramba zvichisundira miganhu yei Wire Boging Process inogona kuzadzisa.