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Cavity bar, pot, plunger for semiconductor packaging MGP mold

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Home - K&S FNK OE360 wire bonding parts - MGP mold parts - Cavity bar, pot, plunger for semiconductor packaging MGP mold

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  • K&S FNK OE360 wire bonding part 
    • Bonding cutters
    • Bonding wedge
    • Die bonding equipment parts
    • MGP mold parts
    • Wire Guides
  • Metallized film capacitor automatic winding machine parts
  • Lithium battery winder equipment consumables
  • Thick aluminum wire products
  • Aluminum wire binding machinery
  • Metallized film capacitor winding machine
Wire bonding wedge tool and ultrasonic aluminum wire bonding machine introduce the parameters used

Wire bonding wedge tool and ultrasonic aluminum wire bonding machine introduce the parameters used

Wire bonding wedge, mandrel of metallized film winding machine, paper

Wire bonding wedge, mandrel of metallized film winding machine, paper

Leading the Future of Energy and Manufacturing Innovation: The Excellent Choice of Tesla-Related Machinery

Leading the Future of Energy and Manufacturing Innovation: The Excellent Choice of Tesla-Related Machinery


  • Standard tungsten carbide wedge for semiconductor thick aluminium wire bonding equipment FNK KNS

    Standard tungsten carbide wedge for semiconductor thick aluminium wire bonding equipment FNK KNS

  • 360 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (F Series)

    360 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (F Series)

  • High temperature rubber suction nozzle tips for die bonder ASM

    High temperature rubber suction nozzle tips for die bonder ASM

  • High voltage capacitor winding machine

    High voltage capacitor winding machine

  • Winding machine for automotive capacitors

    Winding machine for automotive capacitors

  • Custom mandrel holder for capacitor or battery winding machine

    Custom mandrel holder for capacitor or battery winding machine

  • Manual binding machine

    Manual binding machine

  • M2 tungsten carbide wedge for semiconductor aluminium wire bonding equipment

    M2 tungsten carbide wedge for semiconductor aluminium wire bonding equipment

  • Winding machine for metallized capacitors

    Winding machine for metallized capacitors

  • Big high-end stainless steel winding mandrel set end for big size capacitor pack

    Big high-end stainless steel winding mandrel set end for big size capacitor pack

  • Pure aluminum wire

    Pure aluminum wire

  • Mandrel rod,stick,staff,needle for power battery winding machine

    Mandrel rod,stick,staff,needle for power battery winding machine

  • Different size precision parts of semiconductor packing

    Different size precision parts of semiconductor packing

  • High quality membrane cutter for electronic semiconductor assembly packaging

    High quality membrane cutter for electronic semiconductor assembly packaging

  • Copper wire

    Copper wire

  • Original manufacturer long life bonding machine consumables thick copper wire V groove wedge bonding tool

    Original manufacturer long life bonding machine consumables thick copper wire V groove wedge bonding tool

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Cavity bar, pot, plunger for semiconductor packaging MGP mold

https://dgdx-elec.com/wp-content/uploads/2023/01/s-5.mp4 Specifications A(-0.001) B(¡À0. 001) MGP mold barrel injection head 14/15 25.4 MGP mold barrel injection head 17/19 25.4   Product No.:DXMJ-22001 Product Name: Cavity plunger Brand:?China DOXO Tolerance range:?+-0.00...

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Description

marker

https://dgdx-elec.com/wp-content/uploads/2023/01/s-5.mp4

Specifications A(-0.001) B(¡À0. 001)
MGP mold barrel injection head 14/15 25.4
MGP mold barrel injection head 17/19 25.4

 

Product No.:DXMJ-22001

Product Name: Cavity plunger
Brand:?China DOXO
Tolerance range:?+-0.002
Processing customization:?processing according to drawings
Function:?Semiconductor packaging mold
Material:?M2 Tungsten Carbide
Scope of application:?automotive electronics IGBT triode diode
Product advantages:?high hardness, high grinding, long life, improve product yield, 200,000 mold times

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