Igama lami nginguKevin, futhi lapha ku-Dongxin technology, izinsuku zami zigcwele isayensi encane kakhulu. Ngisebenza nonjiniyela njengoMarcus ezingqondweni ezigqamile zaseJalimane, izingqondo ezingezinhle eziqonda ukuthi impumelelo yenkampani ingangena ekuthembekeni kwesithombe esisodwa, microscopic uwaya. Unephutha isibopho sentambo, cishe akubonakali ngamehlo anqunu, kungahle kuncishiswe umugqa wokukhiqiza amadola ayisigidi. Le ndatshana ingeyamaMarcus nakuwo wonke unjiniyela, uchwepheshe, nongqongqo onokwazisa ofuna ukubheka ngemuva kwekhethini. Sizomdumaza umhlaba we isibopho sentambo, ukuhlola ukuthi lezi zinto ezincane kanjani Izintambo zebhondi yakha uhlelo lwezinzwa lwayo yonke insiza ye-elektroniki onayo. Kuluhambo oluya ezweni lokunemba, amandla, kanye ne-physics exhuma iminyaka yethu yedijithali.
Yiliphi ibhondi yocingo futhi kungani libaluleke kakhulu kumjikelezo ohlanganisiwe?
Kwayo okulula kakhulu, a isibopho sentambo umucu omncane we uwaya isetshenziselwe ukwenza Ukuxhumeka kukagesi phakathi kwe i-semiconductor I-Chip kanye nokupakishwa kwayo noma ibhodi yesekethe ephrintiwe (I-PCB). Cabanga nge umjikelezo ohlanganisiwe (Ig) Njengedolobha, eligcwele imininingwane kanye namasiginali kagesi. Leli dolobha lidinga imigwaqo ukuxhuma nomhlaba wangaphandle. Izintambo zebhondi yilezo zinqwaba. Banikeza indlela ebonakalayo yokuthi ugesi kanye nemininingwane yokugeleza ngaphakathi nangaphandle kwe-chip, yenza konke umjikelezo ukusebenza. Ngaphandle kwalokhu kuxhuma, okuthuthuke kakhulu Idivaysi ye-semiconductor Emhlabeni kungucezu olulodwa anzini.
Ukubaluleka kwe isibopho sentambo kukhulu ngoba kuvame kakhulu futhi kungabizi kakhulu ubuchwepheshe bokuxhumana isetshenziswe embonini. -Nke ubudlelwano kumele kube okuphelele. Okubi okukodwa ubudlelwano Kudivayisi equkethe amakhulu noma izinkulungwane ze Izintambo zebhondi kungadala ukuthi yonke ingxenye yehluleke. Lokhu kuxhumana kudinga ukuba nokuhle kakhulu ukuqina kukagesi Ukudlulisa amasiginali ngaphandle kokulahlekelwa futhi uqine ngokwanele ukubekezelela ukushisa, ukudlidliza nokucindezela ngokomzimba iminyaka. Ukwethenjwa kwakho konke kusuka ku-smartphone yakho kuya ohlelweni lokuphepha lwemoto kuncike ekuthembekeni kwale microscopic uwaya ukuxhumana.
Sisinye isibopho sentambo yi-miniature feat of Engineering. A impela ucingo omncane, imvamisa nge ibanga elinquma phakathi ububanzi besingelezi incane kunezinwele zomuntu (zilinganiswe ngaphakathi imizimbas), unamathiselwe ngokunembile endaweni ethile ku-chip ebizwa nge I-Bond Pad. -Nye ubudlelwano sekwenziwa ku-leadframe noma i-substrate, ukuqeda umjikelezo. Inqubo idala isimo saphakade, esiqinile bulala phambili, Ukuqinisekisa ukuxhumana okuqinile nokwethembekile. Lokhu akuyona ukuxhumana okulula kwemishini; Kuyinto ye-metallurgical yangempela ubudlelwano ezingeni le-athomu.
Ngabe inqubo yokubopha i-wire isibopho idala kanjani ukuxhumana okuthembekile kukagesi?
Le khasi Inqubo Yokubopha Nge-Wire inqubo ezenzakalelayo esebenzisa inhlanganisela yamandla, ukushisa, kanye uhlobo lwe-ultrasonic amandla ukudala okuqinile ubudlelwano. Umgomo ukujoyina uwaya ku I-Bond Pad ngaphandle kokusebenzisa noma iyiphi impahla yangaphandle efana umthengisi. Kunokhiye ombalwa Izinqubo Zokubopha, kepha okuvame kakhulu isibopho se-thermosonic. Le nqubo ngumdanso obucayi we-physics kanye nama-mechanics.
Asihlehlise Inqubo Yezinyathelo. Okokuqala, i-semiconductor I-chip ibekwe esigabeni esifudumele, ukuletha ku Izinga lokushisa eliphakeme (imvamisa ngo-100-300 ° C). Lokhu kushisa kusiza ukuthambisa izinsimbi, kubenze bamukele ngokwengeziwe ukwakha a ubudlelwano. Le khasi isibopho socingo umshini ube esethatha ukuphela kocingo futhi uyicindezele ngokumelene ne-aluminium I-Bond Pad use anzini chip. Njengoba ingcindezi iyasetshenziswa, umshini wethula imvamisa ephezulu amandla e-ultrasonic. Lokhu okudlidliza kusebenza ngebhulashi le-microscopic scrup, ukusula oxides kanye nokungcola kusuka ezindaweni ezikhona zombili uwaya kanye nephedi.
Le nhlanganisela ye ukushisa ne-ultrasonic ukudlidliza kubangela ama-athomu a uwaya kanye I-Bond Pad ukuxuba nokusebenzisa, ukwakha okuqinile, okuhlanganisiwe bulala phambili. Lokhu kwaziwa ngokuthi isibopho sokuqala. Umshini bese ufaka i- uwaya kwiphuzu lokuxhuma ku i-substrate futhi wenza isenzo esifanayo sokwenza Isibopho sesibili. Umphumela ungenamthungo ukuxhuma Lokho kusebenza kahle ngogesi futhi ngomshini. Ukusebenza konke okukodwa uwaya kwenzeka engxenyeni yesibili, evumela imishini yesimanje ukubeka izinkulungwane ze Izintambo zebhondi ngomzuzu.
Yimuphi umehluko omkhulu phakathi kwezinqubo ze-Ball Bond and Wedge Bond?
Ngenkathi umgomo ufana, ama-main main Izinqubo Zokubopha—ibhondi yebhola na- bond bond-Ukuwazi ngezindlela ezihlukile kancane. Ukukhetha phakathi kwabo kuncike kuhlelo lokusebenza, The Uhlobo lwe-wire isetshenzisiwe, kanye nomklamo we umjikelezo ohlanganisiwe.
A ibhondi yebhola, njengoba igama libonisa, liqala ngokwakha ibhola elincane ku ukuphela kocingo. Lokhu kwenziwa ngokuncibilikisa isicupho se uwaya ngenhlamvu kagesi. Le Metal Molten, ngokujwayelekile ucingo lwegolide noma ucingo lwethusi, Yenza umkhakha ophelele ngenxa yokungezwani komhlaba. Lokhu kubizwa ngokuthi "Mahhala. "Umshini bese ucindezela lokhu ibhanoyi ungene ku I-Bond Pad ngamandla futhi amandla e-ultrasonic ukudala isibopho sokuqala. Inzuzo esemqoka ye-a ibhondi yebhola ijubane layo futhi iqiniso lokuthi uwaya ingahanjiswa kunoma iyiphi indlela kusuka ku ubudlelwano.
A bond bondNgakolunye uhlangothi, akusebenzisi ibhola. Esikhundleni salokho, isebenzisa ithuluzi elimise okwenziwe nge-wedge ukucindezela i- uwaya ngqo ku I-Bond Pad. Amandla e-ultrasonic bese isetshenziswa ukudala i-stitch-like ubudlelwano. Le nqubo iphindwa i- Isibopho sesibili. Bond bonding ngokujwayelekile yenziwa nge I-Aluminium Wire Kepha futhi ingasetshenziselwa igolide nethusi. Inzuzo yayo eyinhloko ukuthi idala iphrofayili ephansi ubudlelwano, okulungele izinhlelo zokusebenza lapho indawo ebheke phezulu ilinganiselwe. Kukhethwa futhi ngezicelo ezinhle zokuphambana lapho ubudlelwano Amaphakethe asondelene kakhulu. Noma kunjalo, a bond bond imvamisa inqubo ephansi kune- ibhondi yebhola.
Ungakwazi yini ukuchaza izinhlobo ezahlukahlukene ze-wire ezisetshenziswe eBonding?
Le khasi ucingo olusetshenzisiwe Ngoba ukubopha izibopho akuyona nje intambo yensimbi; Kuyinto esetshenziswayo kakhulu enezindawo ezithile. Izinto ezintathu ezivame kakhulu ziyigolide, ithusi ne-aluminium. Le khasi Kusetshenziswa i-Bonding Wire Ukwakha ukuxhumana okuzinzile nokuthembekile, ngakho-ke ukwakheka kwalo okubonakalayo kubalulekile.
- I-FOLD (AU) Wire: Isikhathi eside, ucingo lwegolide kwakuyindinganiso yezimboni. Kumelana kakhulu ne ukugqwala kanye ne-oxidation, okwenza kube lula ukudala Izibopho ezisezingeni eliphakeme. Ukuthamba kwalo kanye ne-fouctility kulungele ubuthakathaka Inqubo Yokubopha Nge-Wire. Ucingo lwegolide kuvame kakhulu isetshenziselwe ukubopha ibhola. Ububi balo bokuqala buphakeme izindleko zegolide.
- Ucingo lweCopper (CU): Ucingo lwethusi usephenduke enye indlela ethandwa kakhulu yegolide ngoba ibiza kakhulu futhi iphakeme ukuqina kukagesi. Kodwa-ke, ithusi linzima kunegolide kanye nama-oxidize kalula. Lokhu kwenza ukubopha kudinga inqubo elawulwa kakhudlwana, imvamisa esimweni se-inert nitrogen, ukuvikela i-oxidation engenza buthaka ubudlelwano. Sinikeza ubumsulwa obukhulu ucingo lwethusi yakhelwe ukunqoba lezi zinselelo. Ukuthuthukisa izakhiwo zayo, ucingo lwethusi kuvame ukudonswa ngenani elincane le ingxubevange thanda indawo emisiwe yasePalladium (I-Palladium ehlanganisiwe yethusi).
- I-Aluminium (Al) Wire: I-Aluminium Wire, imvamisa a ingxubevange ngenani elincane le anzini, kusetshenziselwa ikakhulukazi bond bonding. Ithambile kakhulu futhi ayibizi. Kuyinto yokuzikhethela yamadivayisi anamandla aphezulu, lapho kukhulu khona ububanzi bentambo kuyadingeka ukuthwala okwengeziwe kwamanje. Kusukela iningi ubudlelwano amaphedi a i-semiconductor futhi zenziwe nge-aluminium, isebenzisa i- I-Aluminium Wire kwakha uhlelo lwe-mono-metallic, oluvimbela ukwakheka kwe-brittle I-Intermetallic Compactkungenzeka phakathi igolide ne-aluminium, okuholela ukwehluleka kwebhondi.
Iyiphi indima edlala amandla e-ultrasonic ezinqubweni zesimanje zokubopha?
Amandla e-ultrasonic isithako esiyimfihlo esenza sanamuhla isibopho socingo isebenza ngempumelelo futhi ethembekile. Ivumela ukuqina bulala phambili ukuze yakhelwe emazingeni okushisa aphansi kakhulu kunalokho obekudingeka, inqubo eyaziwa ngokuthi isibopho se-ultrasonic. Lokhu kubalulekile ngoba amazinga okushisa aphezulu angalimaza ababucayi i-semiconductor idivaysi.
Nakhu ukuthi kusebenza kanjani: Ngesikhathi ukwakheka kwebhondi, ithuluzi liyadlidliza uwaya ngokumelene ne I-Bond Pad Esikhathini esivamisile se-ultrasonic (ngokuvamile 60-120 KHZ). Lokhu kunyakaza okusheshayo, okusolayo kwenza izinto eziningana ezibalulekile. Okokuqala, isebenza njenge-ejenti yokuhlanza enamandla, ihlukana futhi isula noma yiziphi izingqimba ezicijile ze-oxides noma ezingcolisayo ezitolo zensimbi. Awukwazi ukudala okuhle ubudlelwano Ngokusebenzisa ungqimba lokungcola, nasezingeni le-microscopic, i-oxidation yilokho kanye.
Okwesibili, amandla okushayisana adala ukushisa okwenziwe kwasendaweni kanye noshintsho lwepulasitiki endaweni ebonakalayo. Lokhu kuthambisa izindawo zensimbi, zibavumele ukuba zibumbe kahle kahle. Le khasi ingcindezi ne-ultrasonic ukudlidliza kuletha ama-athomu we uwaya kanye I-Bond Pad koxhumana nalokho okusondelene kanjena ababelana ngama-elektroni futhi bakhe i-metallurgical yangempela ubudlelwano. Phandle kwa- amandla e-ultrasonic, uzodinga amazinga okushisa aphezulu namabutho (ukubopha kwe-thermocomepression), okungabeka engcupheni yokuqhekeza ubucayi anzini afe ngaphansi I-Bond Pad. Lokhu kusetshenziswa kwe uhlobo lwe-ultrasonic Amandla asemqoka ku isibopho se-thermosonic inqubo.
Kungani i-wire yegolide ithandwa ngokwesiko ngezintambo zebhondi ezisezingeni eliphakeme?
Ucingo lwegolide Kudala i-Gold Standard (Pun ihlose) ngokuthembeka okukhulu Izintambo zebhondi. Ukuthandwa kwaso kuvela ngokuhlanganiswa okuyingqayizivele kwezindawo zamakhemikhali nezomzimba ezenza zilungele kahle indawo efunwayo ye umjikelezo ohlanganisiwe.
Inzuzo ebaluleke kakhulu ucingo lwegolide yi-chemenicness yayo. Imelana kakhulu ne-oxidation futhi ukugqwala. Lokhu kubaluleke kakhulu ngoba ingaphezulu elihlanzekile, elingenazifiso elingenangqondo libalulekile ekwakheni okuqinile, okuphansi okuphansi ubudlelwano. Ngenkathi ezinye izinsimbi zifaka izingqimba ze-oxide cishe ngokushesha emoyeni, igolide lihlala likhona, lenza Igolide Wire Bonding inqubo yokuthethelela nokuphindaphindwa. Lokhu kuqina okungokwemvelo kuholela ekuvutheni okuphezulu nokusebenza okuthe xaxa okuthembekile.
Ngaphezu kwalokho, ucingo lwegolide kuyinto evulekile kakhulu futhi ayinambukela. Lokhu kusho ukuthi kungadonswa ngaphakathi ucingo omncane ngokuvumelana ibanga elinquma phakathi ububanzi besingelezi futhi ingabulwa kalula ngesikhathi ibhondi yebhola kanye nenqubo yokuvula ngaphandle kokuqina noma ukuqhekeka. Lokhu kuthamba kuyasiza nokuthola eminye yemishini ukucindezela kukhiqizwa ngenqubo yokubopha, ukuvikela ubuthaka I-Bond Pad kanye nokungaphansi anzini kusuka kumonakalo. Ngenkathi ephezulu izindleko zegolide yinto enkulu, izicelo ezibucayi e-aerospace, ezezokwelapha, kanye nezempi ze-elekthronikhi lapho ukwehluleka kungeyona inketho, ukuthembeka okunikezwa yi ucingo lwegolide kuvame ukucacisa izindleko.
I-Popper Wire iqhathanisa kanjani nocingo lwendabuko njengegolide?
Ucingo lwethusi Ingabe ukuhanjiswa okuholayo kwabaphathi begolide ku isibopho socingo Umhlaba. Umshayeli oyinhloko wokutholwa kwawo, i-Cost-Copper eshibhile kakhulu kunegolide. Kodwa-ke, ukuguqulwa kusuka ucingo lwegolide kwa- ucingo lwethusi akuyona nje ukushintshana kwezinto okulula; kudinga ukulungiswa okubalulekile ku Izinqubo Zokubopha ngenxa yezindawo ezahlukahlukene zezinto zokwakha.
Kusuka ekubukeni kokusebenza, ucingo lwethusi ungumnqobi. Iphakeme ukuqina kukagesi kanye nokuvuselelwa okushisayo kunegolide, okwenza kube kuhle kakhulu kumadivayisi aphatha amandla amaningi noma ashise. Iphinde ibe nezakhiwo ezingcono zemishini, okuholela ekuqineni Amandla e-Bond kanye nokumelana no uwaya shanela ngesikhathi senqubo yokubumba epulasitiki. Kodwa-ke, i-Copper iza nezinselelo zayo. Ukubuyiselwa kwayo okukhulu Ubulukhuni kanye nokuthambekela kokugqwala.
Ngoba ithusi linzima kunegolide, the amapharamitha ahlanganisa, njenge amandla namandla e-ultrasonic, kumele alawulwe ngokucophelela ukuze agweme ukulimaza I-Bond Pad. Udaba olukhulu yi-oxidation. I-Copper oxidizes ngokushesha, futhi le nhlangano ye-oxide ingavimba okuhle ubudlelwano kusuka ekubumbeni. Ukulwa nalokhu, ithusi isibopho socingo kuvame ukwenziwa emvelweni engenayo ye-nitrogen engenampilo. Ukuqhubeka nokwenza ngcono ukusebenza kwayo kokuqina kanye nokumelana ne-oxidation, yethusi uwaya kuvame ukwenziwa ngezinto ezifana indawo emisiwe yasePalladium. Leli indawo emisiwe yasePalladium-Ama- ucingo lwethusi Sekuphenduke ukukhetha okuthandwayo, okunikeza ukulinganisela okuhle kwezindleko, ukusebenza, kanye nokusebenza.
Yiziphi izinselelo ezivela lapho kudala isibopho ngocingo lwe-aluminium?
I-Aluminium Wire yi-worworse yamandla i-semiconductor imboni. Ilungele bond bondukufaka izinhlelo zokusebenza ezidinga ezinkulu ububanzi bentambo ukuphatha I-High-Okwamanje. Kodwa-ke, ukusebenza nge I-Aluminium Wire Kuveza isethi eyingqayizivele yezinselelo onjiniyela okufanele baphathe ngayo.
Inselelo enkulu nge I-Aluminium Wire ukuthamba kwayo. Ngenkathi lokhu kwenza kube lula uku ubudlelwano ngaphandle kokulimaza i-chip, kusho nokuthi uwaya itholakala ezindabeni ezisebenza ngemishini. Ngokwesibonelo, I-Aluminium Wire Inamandla aphansi aphansi kunegolide noma yethusi, ngakho-ke ukunakekelwa kumele kuthathwe ngesikhathi sokugwedla ukuvikela ukuqhekeka. Ngaphezu kwalokho, kuthambekele kakhulu ukukhathala okuphansi komjikelezo. Lapho idivaysi ifudumala futhi ipholisa phansi, izinto zokwakha zandise kanye nenkontileka. Ngokuba I-Aluminium Wire ihlukile I-coefficient of thermal expression ukwedlula ezinye izinto ezisephaketheni, lokhu kuhamba ngebhayisikile kungadala ingcindezi esithendeni sika ubudlelwano, ekugcineni kuholela ekuqhekekeni noma ukwehluleka.
Okunye ukucatshangelwa lokho I-Aluminium Wire isetshenziselwa kuphela kuphela bond bonding. Ayikwazi ukwakheka kalula ku Mahhala njengegolide noma ithusi, elikhawulela ukusetshenziswa kwalo ngokushesha ibhondi yebholaizinqubo ze-ing. Ngaphandle kwalezi zinselelo, izindleko zalo eziphansi nokusebenza okuhle ezinhlelweni zensimbi (i-aluminium uwaya kuma-aluminium pads) kwenze kube yinto ebaluleke kakhulu. EDongxin, sinikeza ikhwalithi ephezulu I-Aluminium Wire Emsulwa futhi Amathuluzi anesindayo e-aluminium wire bonding ngokuqondile njiniyela ukudala amabhondi athembekile ekufuneni izinhlelo zokusebenza ezinamandla amakhulu.
Ukugwema kanjani ukwehluleka okuvamile ngesibopho se-wire?
Ihlulekile isibopho sentambo ingaba yinhlekelele yedivayisi ye-elekthronikhi, ngakho-ke ukuvimbela ukwehluleka kuyinto ebaluleke kakhulu. Ukwehluleka kungenzeka ngezizathu eziningi, kuvame ukuhlobene nokulawulwa okungekuhle phezu kwe amapharamitha ahlanganisa, ukungcoliswa, noma izindaba ezibonakalayo. Indlela esebenzayo ibalulekile.
Enye yezindlela zokuhluleka ezivame kakhulu ubudlelwano noma "okungewona induku," kuphi uwaya ayilandeli kahle I-Bond Pad. Lokhu kuvame ukubangelwa ukungcoliswa kwePad ebusweni noma kubukelwe ngokungafanele amapharamitha ahlanganisa. Ukuqinisekisa ukuhlanzeka kwazo zonke izindawo nokubeka kahle amandla e-bond, uhlobo lwe-ultrasonic Amandla, kanye lokushisa ngokuqondile Izinto zokwakha futhi umugqa wokuqala wokuzivikela. Ukulinganisa okujwayelekile kwe isibopho socingo Umshini futhi ubalulekile.
Olunye udaba oluvamile "ukugeleza," lapho ingcindezi namandla enqubo yokubopha khona eqhekeka ngayo kubuthakathaka anzini noma izendlalelo ze-oxide ngaphansi kwe I-Bond Pad. Lokhu kuvame ngenxa yamandla ngokweqile noma amandla e-ultrasonic. Kusetshenziswa okulungile okokubopha Ithuluzi nenqubo elawulwa ngokunembile kungavimba lo monakalo. Ekugcineni, ukwehluleka kwebhondi kungenzeka ngokuhamba kwesikhathi ngenxa yokwakheka kwe-brittle I-Intermetallic Compacts, ikakhulukazi phakathi igolide ne-aluminium kwe Izinga lokushisa eliphakeme. Ukukhetha inhlanganisela yezinto ezifanele, njengokuthi I-Aluminium Wire kumaphilisi we-aluminium noma usebenzisa insimbi yesithiyo ku I-Bond Pad, inganciphisa lezi zingozi zokuthembela isikhathi eside.
Uyini umehluko phakathi kokubopha i-wire futhi usebenzise umthengisi ngokuxhumeka?
Ngenkathi bobabili isibopho socingo na- umthengisi zisetshenziselwa ukudala Ukuxhumeka ngogesi, ziyizinqubo ezahlukahlukene ezisetshenziswa ezikalini ezahlukahlukene nangezinhloso ezihlukile ngaphakathi kwe umjikelezo. Ukuqonda izindima zabo kubalulekile ukwazisa umhlangano we-elekthronikhi.
Umthengisi yinsimbi ingxubevange ngephuzu eliphansi eliphansi elisetshenziselwa ukujoyina izakhi ezinkulu ndawonye, njengokunamathisela i umjikelezo ohlanganisiwe iphakheji ku I-PCB noma ukuxhuma umphikisi we- I-electrode. Inqubo ifaka ukushisa umthengisi Kuze kuncibilike, kugele phakathi kwezakhi, bese kupholisa ukwakha ukuxhumana okuqinile. Umthengisi ilungele ukudala amabhondi aqinile emishini kanye nogesi esikalini se-macro kodwa akunangqondo ngokwanele ukuxhumana kwezinto ezinkulu ngaphakathi a i-semiconductor iphakheji. Awukwazi nje ukusebenzisa umthengisi Ukuxhuma kubuncane ubudlelwano amaphaphu ku-chip.
Isibopho socingoNgakolunye uhlangothi, yisimo esiqinile Inqubo ye-Welding Yakhelwe iMicro-Scale xaxaion. Kwakha i-metallurgical eqondile ubudlelwano phakathi kokuningi ucingo omncane kanye ne-chip I-Bond Pad Ngaphandle kwento ehlukile ye-filler efana umthengisi. Isibopho socingo Inikeza ukucaciswa okuphezulu kakhulu nokuqina, okuvumela amakhulu noma izinkulungwane zokuxhumeka ukuze zenziwe endaweni encane kakhulu. Kafushane, isibopho sentamboIng isetshenziselwa ukuthola isinali ngaphandle we-silicon die, ngenkathi umthengisi kuvame ukusetshenziselwa ukuxhuma okuhlanganisiwe kufa kubo bonke abanye umjikelezo. Bangama-technologies amabili ahambisana nawo asebenza ndawonye ukwakha amadivaysi kagesi esiwasebenzisa nsuku zonke.
Ukuthathwa Key
- I-wire bond ibalulekile: Izintambo zebhondi yimigwaqo ebalulekile kagesi exhuma chip ye-semiconductor ezweni langaphandle, okwenza wonke umsebenzi wesifunda.
- Inqubo ibalulekile: -Isimanje Izinqubo Zokubopha thanda isibopho se-thermosonic Sebenzisa inhlanganisela eqondile yokushisa, amandla, futhi uhlobo lwe-ultrasonic amandla ukudala i-metallurgical eqinile, ethembekile bulala phambili.
- Ibhola vs wedge: Ibhondi yebholaing ngokushesha futhi iguquguqukayo, imvamisa isebenzisa igolide noma ithusi, ngenkathi bond bondI-ING inikeza ukunemba okuphezulu kwezicelo ezinhle ze-pitch, imvamisa nge-aluminium uwaya.
- Izindaba ezibonakalayo: Ukukhetha phakathi ucingo lwegolide, ucingo lwethusi, futhi I-Aluminium Wire yisinqumo sobunjiniyela esibucayi esekwe kwizindleko, ukusebenza, kanye nezidingo zokwethenjwa.
- Gwema ukwehluleka ngokwehluleka: Ukuvimbela ukwehluleka kwebhondi idinga ukulawulwa kwenqubo eqinile, izinto ezihlanzekile, bese kulungiselelwe kahle amapharamitha ahlanganisa ukugwema izibopho ezibuthakathaka noma ukulimala ku-chip.
- Akufani nomuntu oyedwa: Isibopho socingo iyinqubo yokufaka i-welding ye-micro-scale ye-micro-scale ye-chip-level ukuxhuma, ngenkathi umthengisi inqubo ye-macro-scale esetshenziselwa ukujoyina izakhi ezinkulu ku I-PCB.
