Igama lam nguKevin, nalapha kwiTekhnoloji ye-Edoxin, imihla yam izaliswe yinzululwazi encinci. Ndisebenza neenjineli njengeMarcus eJamani-risling, iingqondo ezinobuchule eziqonda ukuba impumelelo yenkampani inokuthi iphumelele kwithemba lokuthembeka kwe-microscopic enye, microscopic ucingo. Isiphoso i-wire ye-wire, phantse ingabonakali kwiliso lakho, lingaphantsi komgca wemveliso yedola. Eli nqaku leli nqaku le-Marcus kunye nenjineli nganye, uchwepheshe, kunye nengqondo enomdla ofuna ukuphakama ngasemva kwekhuselo. Siza kuyihlonela umhlaba we i-wire ye-wire, hlola indlela ezincinci iingcingo zebhondi Yenza inkqubo ye-nevous yazo zonke izinto ze-elektroniki zakhona. Luhambo kwihlabathi lokuchaneka, amandla, kunye neFiziksi eziqhagamshela iminyaka yethu yedijithali.
Yintoni i-wire ye-wire ye-wire kwaye kutheni ibaluleke kangaka kwisekethe ehlanganisiweyo?
Kwindlela yayo elula, a i-wire ye-wire yintsomi encinci ye ucingo isetyenziselwa ukwenza Iindlela zombane zombane phakathi kwe I-Semiconductor I-Chip kunye nokupakishwa kwayo okanye iBhodi yeSekethe eprintiweyo (I-PCB). Cinga nge isekethe elihlanganisiweyo (NDIYABONA) Njengesixeko, ukubhoboza ngolwazi kunye nemiqondiso yombane. Esi sixeko sifuna iindlela zokunxibelelana nehlabathi elingaphandle. Iingcingo zebhondi zezona moya. Banikezela ngendlela yomzimba yombane kunye nedatha ukuba iphume ngaphakathi nangaphandle kweChip, iyenza yonke isekethe Umsebenzi. Ngaphandle kolu nxibelelaniso, eyona iphambili Isixhobo se-semiconductor Ehlabathini sisiqwenga nje se-inter isilicon.
Ukubaluleka kwe i-wire ye-wire Inkulu kuba yeyona ixhaphakileyo kwaye ineendleko qhagamshelana netekhnoloji isetyenziswe kwishishini. Yonke iqhina kufuneka igqibelele. Ingabi iqhina kwisixhobo esinekhulu okanye amawaka iingcingo zebhondi inokubangela ukuba yonke into isilele. Olu nxibelelwano lufuna ukuba lugqwesile Ukuqhutywa kombane Ukudlulisela imiqondiso ngaphandle kokulahleka kwaye unamandla ngokwamachwephesha ngokwaneleyo ukuze unyamezele ubushushu, ukuntywila, kunye noxinzelelo lomzimba kangangeminyaka. Ukuthembeka kwayo yonke into kwi-smartphone yakho kwinkqubo yokhuseleko yemoto ixhomekeke ekunyanisekeni kwezi Microscopic ucingo Unxibelelwano.
Nganye i-wire ye-wire yindawo encinci yobunjineli. I ucingo olucekeceke, rhoqo nge ububanzi incinci kuneenwele zomntu (ezilinganiswe ngaphakathi i-micrometers), ngokuchanekileyo, ziqhotyoshelwe kwindawo ethile kwi-chip ebizwa ngokuba yi I-Bond pad. Enye iqhina yenziwa ke kwi-verfframe okanye subsare, ukugqiba i isekethe. Inkqubo idala ilizwe elisisigxina, liqinile weld, qinisekisa uqhagamshelo oluhlala luhleli noluthembekileyo. Olu ayisiyonto ilula yohlobo; Yinto yokwenyani iqhina kwinqanaba leatomic.
Ngaba i-wire ibonisa njani inkqubo yokunxibelelana kombane okholwayo?
I I-Wire Sire Sport Inkqubo yinkqubo ezenzekelayo esebenzisa indibaniselwano yamandla, ubushushu, kwaye i-ultrasonic amandla okwenza amandla iqhina. Injongo kukujoyina ucingo kwi I-Bond pad Ngaphandle kokusebenzisa nayiphi na impahla yangaphandle enjani umthengisi. Kukho iqhosha elincinci Iinkqubo ze-BOID, kodwa eyona ixhaphakileyo yile I-thermosonic bond. Le nkqubo ngumdaniso obuthathaka we-physics kunye noomatshini.
Masihlukane Inkqubo yeNkqubo. Okokuqala, I-Semiconductor I-chip ibekwe kwinqanaba elishushu, lizisa kwi Iqondo lokushisa eliphakamileyo (Ngokwesiqhelo i-100-300 ° C). Ubushushu bunceda ekuthatheni izinyithi, zenze ukuba bamkele ngakumbi ukwenza i iqhina. I I-wire bond umatshini emva koko uthatha ukuphela kocingo kwaye icinezela ngokuchasene ne-aluminium I-Bond pad kwi isilicon chip. Njengoko uxinzelelo lusetyenziswa, umatshini wazisa i-frequency ephezulu amandla e-ultrasonic. Le ntshukumo isebenza njengebrashi ye-microscopic scrush, isuse i-oxide kunye nongcoliseko oluvela kumphezulu we ucingo kunye nepali.
Indibaniselwano ye ubushushu kunye ne-ultrasonic vibration ubangela iiatom ze ucingo kwaye i I-Bond pad Ukuxuba kwaye uhlukane, wenze i-gost, idityaniswe weld. Oku kwaziwa njenge I-Bondy yokuqala. Umatshini emva koko ucingo kwindawo yoqhagamshelo kwi subsare kwaye yenza isenzo esifanayo sokudala I-Bond yesibini. Isiphumo singenamthungo uqhagamshelo lwe Zombini zisebenza ngombane kwaye zenziwe ngobugcisa. Yonke imisebenzi iphela ucingo yenzeka kwiqhezu lomzuzwana, ukuvumela oomatshini bale mihla ukubeka amawaka iingcingo zebhondi ngomzuzu.
Ngowuphi umahluko ophambili phakathi kwebhondi yebhola kunye neenkqubo ze-Wedge?
Ngelixa injongo iyafana, eyona iphambili Iinkqubo ze-BOID—Ibhondi yebhola kwaye Wedge Bond-Yiphala ngeendlela ezahlukeneyo. Ukukhetha phakathi kwabo kuxhomekeke kwisicelo, Uhlobo lwe-wire isetyenzisiwe, kunye noyilo lwe isekethe elihlanganisiweyo.
A Ibhondi yebhola, njengoko igama libonisa, liqala ngokudala ibhola encinci kwi ukuphela kocingo. Oku kwenziwa ngokunyibilika inqaku le ucingo nge-spark yombane. Le ntsimbi etyhidiweyo, ngokuqhelekileyo I-wire yegolide okanye ucingo lobhedu, zenzelwa indawo egqibeleleyo ngenxa yoxinzelelo lomphezulu. Oku kubizwa ngokuba yi "Ibhola yomoya yasimahla. "Umatshini ke ucinezela oku Ibhola yegolide kwi I-Bond pad ngamandla kwaye amandla e-ultrasonic ukwenza i I-Bondy yokuqala. Inzuzo ephambili ye Ibhondi yebhola isantya sayo kunye nenyani yokuba ucingo inokuqhutywa nakweyiphi na indlela evela kuyo iqhina.
A Wedge Bond, kwelinye icala, ayisebenzisi ibhola. Endaweni yoko, isebenzisa isixhobo esongezelelekileyo se-Wedge ukuze sicinezele ucingo ngqo kwi I-Bond pad. Amandla e-ultrasonic emva koko isetyenzisiwe ukwenza i-stitch-njenge iqhina. Le nkqubo iphindaphindwa I-Bond yesibini. Wedge BondNgokwenziwa ngokwenziwa nge i-aluminium wire Kodwa inokusetyenziselwa igolide nobhedu. Inqaku layo eliphambili kukuba libangela iprofayili esezantsi iqhina, eyona ilungileyo kwizicelo apho indawo ethe nkqo inomda. Ikwakhethwayo kwizicelo ezihlawulelwayo apho iqhina Iipads zisondelelene kakhulu. Nangona kunjalo, a Wedge Bond ngokubanzi yinkqubo ecothayo kune Ibhondi yebhola.
Ngaba ungachaza iintlobo ezahlukeneyo zecingo elisetyenziswayo?
I ucingo olusetyenzisiweyo Ukuboleka ayisiyonto I-wire yentsimbi; Sisixhobo esinikiweyo kakhulu esinepropathi ethile. Ezona zinto zininzi ziqhelekileyo zegolide, ubhedu, kunye ne-aluminium. I I-wire ye-wire isetyenzisiwe Ukudala uqhagamshelo oluzinzileyo noluthembekileyo, ke ukwakhiwa kwezinto ezibonakalayo kubalulekile.
- Igolide (AU) wire: Ixesha elide, I-wire yegolide yayingumgangatho wecandelo. Ingaxhathisi kakhulu i-corrosion kunye ne-oxidation, esenza kube lula ukuyila I-Bonds ekumgangatho ophezulu. Ukuthamba kwayo kunye ne-fuccity zilungele ukuthambisa I-Wire Sire Sport Inkqubo. I-wire yegolide ixhaphake kakhulu isetyenziselwa ibhola. Eyona nto iphambili kuyo iphakamileyo Ixabiso legolide.
- I-Copper (CU) wire: Ucingo lobhedu iye yaba yeyona nto ithandwayo yegolide kuba ingabizi kakhulu kwaye iphezulu Ukuqhutywa kombane. Nangona kunjalo, ubhedu lunzima kunegolide kunye ne-oxidid ngokulula. Oku kwenza i I-Bound ifuna Inkqubo elawulwayo engaphezulu, ihlala kwi-InErt Nitrogen Andmoges, ukuthintela i-oxidation edla ngokuba buthathaka iqhina. Sinikezela ngococeko oluphezulu ucingo lobhedu yenzelwe ukoyisa le miceli mngeni. Ukuphucula iipropathi zayo, ucingo lobhedu ihlala igcinwe ngexabiso elincinci le ingxubevange njenge I-Palladium (I-Palladium idityaniswe kobhedu).
- I-Aluminium (Al) wire: I-aluminium wire, ihlala i ingxubevange ngenani elincinci le isilicon, ngokuyintloko isetyenziselwa Wedge BondIng. Ithambile kakhulu kwaye ayibizi kakhulu. Yinto ekhethileyo yokhetho lwezixhobo zamandla amakhulu, apho bukhulu khona Ububanzi beWire iyafuneka ukuthwala okwangoku. Oko uninzi iqhina iipads kwi I-Semiconductor zenziwe nge-aluminium, usebenzisa i i-aluminium wire Yenza inkqubo ye-monollic ye-monollic, ethintela ukwenziwa kweBrittle I-Intermetallic Compows enokwenzeka phakathi igolide kunye ne-aluminium, ikhokhelela kwi Ukusilela kwebhondi.
Yeyiphi indima edlalwa ngamandla e-Ultrasonic kwiinkqubo zokubiyela zanamhlanje?
Amandla e-ultrasonic Ngaba isithako semfihlo esikwenzayo I-wire bond isebenza ngokuphumelelayo kwaye ithembekile. Ivumela umntu onamandla weld ukuba kwenziwe kubushushu obukhulu kakhulu kunokuba bekuya kufuneka, inkqubo eyaziwa ngokuba I-Ultrasonic Bonding. Oku kubalulekile kuba amaqondo obushushu aphezulu ayonakalisa ibuthathaka I-Semiconductor isixhobo.
Nantsi indlela esebenza ngayo: ngexesha le UKWENZIWA KWESICWANGCISO, isixhobo siyayivuyisa ucingo ngokuchasene ne I-Bond pad kwi-ultrasonic frequency (eqhelekileyo i-60-120 khz). Oku kuyakhawuleza, ukushukuma kwentshukumo kwenza izinto ezininzi ezibalulekileyo. Okokuqala, isebenza njenge-arhente enamandla yokucoca, iqhekeza kwaye icime nayiphi na imingxunya ye-oxide okanye ingcoliseko kwimigangatho yentsimbi. Awunakho ukwenza okuhle iqhina Ngomaleko wobumdaka, kwaye kwinqanaba le-microscopic, i-oxidation yile.
Okwesibini, amandla athambileyo akha ubushushu basekhaya kunye nengcaciso yeplastiki kwi-Intert. Oku kuthambisa umphezulu wensimbi, ebavumela ukuba babumbe kunye ngokugqibeleleyo. I uxinzelelo kunye ne-ultrasonic vibration uzisa iathom ye ucingo kwaye i I-Bond pad Kumfowunelwa osondeleyo kangangokuba babelane ngee-elektroni kwaye bakha i-metallical eyinyani iqhina. Ngaphandle amandla e-ultrasonic, ungadinga ubushushu obuphezulu kunye nemikhosi (i-thermoctoction ibotshwe), obuya kubeka umngcipheko ukuqhekeza isilicon ufe phantsi I-Bond pad. Oku kusetyenziswa i-ultrasonic Amandla asembindini kwi I-thermosonic bond inkqubo.
Kutheni le nto i-wire yegolide ngokwesiko ikhethelwe iingcingo ezisemgangathweni eziphezulu?
I-wire yegolide Kudala inguMgangatho weGold (i-pun icetywe) ukuxhomekeka okuphezulu iingcingo zebhondi. Idunyiso layo lisuka kwindibaniselwano eyodwa yepropathi yekhemikhali kunye nezomzimba eyenza ilungele kakuhle imeko efunekayo ye isekethe elihlanganisiweyo.
Olona ncedo lubalulekileyo I-wire yegolide yindawo yayo yekhemikhali. Inganyangeki kakhulu kwi-oxidation kwaye i-corrosion. Oku kubaluleke kakhulu kuba umphezulu ococekileyo, onesidima ubalulekile ekuphumezeni ukungavisisani okuqinileyo, okuphantsi iqhina. Ngelixa ezinye izinyibiliki zenza i-surivers ezinqamlezileyo ziphantse zibe semthethweni emoyeni, igolide lihlala i-ristine, yenza i UWire Wire Wire Inkqubo yokuxolela kakhulu kwaye iphinde iphinde iphinde. Olu nzongo luyindalo lukhokelela kwizivuno eziphezulu kunye nexesha elide elinokuthenjwa elithembekileyo.
Ngapha koko, I-wire yegolide I-ductile kakhulu kwaye ingenangqondo. Oku kuthetha ukuba inokutsalwa ibe kakhulu ucingo olucekeceke ngokuhambelana ububanzi kwaye inokwenziwa ngokulula ngexesha Ibhondi yebhola Inkqubo yokuthoba iphononongo ngaphandle kokusebenza nzima okanye ukophula. Ukuthamba kwakhona kuyanceda ekufumaneni abanye oomatshini Uxinzelelo luvelisiwe Ngenkqubo ye-bondile, ukukhusela ibuthathaka I-Bond pad kwaye ngaphezulu isilicon kumonakalo. Ngelixa phezulu Ixabiso legolide yeyona nto iphambili, kwizicelo ezibalulekileyo kwi-aerospace, ezonyango, kunye ne-elektroniki emkhosini apho ukusilela kungabikho khetho, ukuthembeka okufundwayo I-wire yegolide ihlala ithethelela inkcitho.
I-wire yebhedi ithelekiswa njani nocingo lwendabuko njengegolide?
Ucingo lobhedu Ngaba umceli ophambili kwi-golide kwi-golide kwi I-wire bond Umhlaba. Umqhubi ophambili wokwamkelwa komntwana abengowomnye umntu okanye umvuzo. Nangona kunjalo, inguqu evela I-wire yegolide ukuya ucingo lobhedu ayisiyonto ilula yokutshintsha; Ifuna uhlengahlengiso olubalulekileyo kwi Iinkqubo ze-BOID ngenxa yepropathi eyahlukileyo yezixhobo.
Ngokwembono yentsebenzo, ucingo lobhedu Uphumelele. Iphezulu Ukuqhutywa kombane Ukuqhutywa kwe-thermac kunegolide, kwenza ukuba kube kulungele izixhobo eziphatha amandla amaninzi okanye zibaleka ishushu. Ikwaneempawu ezingcono zoomatshini, ezikhokelela enamandla amandla ebhondi kwaye ukuxhathisa ucingo ukutshayela ngexesha lenkqubo yeplastiki. Nangona kunjalo, ubhedu luza neseti yalo yemiceli mngeni. Eyona nto iphambili kuyo Ubunzima kunye nokuchaphazeleka kukungabikho.
Kuba ubhedu lunzima kunegolide, I-rameter ye-rameters, njenge amandla kunye namandla e-ultrasonic, kufuneka ilawulwe ngononophelo ukuthintela ukonakalisa i I-Bond pad. Imbambano enkulu yi-oxidation. I-Copper ye-Copper ngokukhawuleza, kwaye le ngxolo ye-oxide inokuthintela elungileyo iqhina ukuyeka. Ukulwa le, ubhedu I-wire bond ihlala yenziwa kwindawo ye-witrogen engenasimahla. Ukuqhubela phambili ukuphucula intsebenzo yayo kunye nokuxhathisa kwi-oxidation, ubhedu ucingo ihlala inikezelwa ngezinto ezinje I-Palladium. Le I-Palladium-kwasemzimbeni ucingo lobhedu Uye waba lukhetho oludumileyo, unika ibhalansi elungileyo yeendleko, ukusebenza kunye nokuziqhelanisa.
Yeyiphi imiceli mngeni ephakamayo xa usenza ulwalamano nge-wire ye-aluminium?
I-aluminium wire Ngaba iOrhorse yamandla I-Semiconductor ishishini. Ilungele Wedge Bondkwizicelo ezifuna ezinkulu Ububanzi beWire ukubamba Ngaphezulu. Nangona kunjalo, ukusebenza kunye i-aluminium wire Ibonisa iseti eyahlukileyo yemiceli mngeni ilawula iinjineli.
Umngeni ophambili kunye i-aluminium wire kukuthamba kwayo. Ngelixa oku kwenza kube lula iqhina Ngaphandle kokonakalisa i-chip, ikwathetha i ucingo ichaphazeleka kwimicimbi yoomatshini. Njengokuba, i-aluminium wire Ngaba amandla amanye amanxuwa kunegolide okanye ubhedu, ke ukukhathaleleka kufuneka kuthathwe ngexesha lokunyanga ukuthintela ukomelela. Ngapha koko, i-tenne ngakumbi Ukudinwa komjikelo ophantsi. Xa isixhobo esixhoma kwaye sipholile, izixhobo zanda kunye nemvumelwano. Kuba i-aluminium wire inamandla eyahlukileyo Ukusebenza kolwando lwe-shirmal kunezinye izinto ezikwiphakheji, le khayethi yebhayisikile inokubangela uxinzelelo kwisithende se iqhina, ekugqibeleni ukhokelela kwi-rack okanye ukusilela.
Olunye ukuqwalaselwa kukuba i-aluminium wire iphantse isetyenziselwa kuphela Wedge BondIng. Ayinakubekwa ngokulula kwi Ibhola yomoya yasimahla Njengegolide okanye ubhedu, onciphisa ukusetyenziswa kwayo ngokukhawuleza Ibhondi yebholaIinkqubo ze-Eng. Ngaphandle kwale miceli mngeni, iindleko zayo eziphantsi kunye nentsebenzo ebalaseleyo kwiinkqubo ze-Monollic ze-Monollic (Alumnum ucingo Kwi-Alweminium pads) yenza izinto ezibonakalayo. EDongxin, sibonelela ngomgangatho ophezulu I-wire ecocekileyo ye-aluminium kwaye yomelele I-Aluminium ye-aluminium ye-aluminium boire Ngokuchanekileyo injineli ukudala ibhondi ethembekileyo ekufumaneni izicelo eziphezulu zombane.
Ukuphepha njani ukusilela okuqhelekileyo kwi-wire ye-wire?
Ihlulekile i-wire ye-wire Inokuba yintlekele kwisixhobo se-elektroniki, ngenxa yoko ukuthintela ukusilela yeyona nto iphambili. Ukusilela kunokwenzeka ngenxa yezizathu ezininzi, zihlala zihambelana nolawulo olugwenxa kwi I-rameter ye-rameters, ungcoliseko, okanye izinto ezibonakalayo. Indlela yokufezekisa iphambili.
Enye yezona ndlela ziqhelekileyo zokusilela zibuthathaka iqhina okanye i-non-singalon, "apho ucingo ayilandeli ngokupheleleyo kwi I-Bond pad. Oku kuhlala kubangelwa ngungcoliseko kwindawo ye-pad okanye i-tunced engalunganga I-rameter ye-rameters. Ukuqinisekisa ukucoceka kwazo zonke iindawo kwaye ngokudibeneyo ngokudibeneyo. i-ultrasonic Amandla, kunye neqondo lokushisa le Izixhobo ngokunjalo ngumgca wokuqala wokuzikhusela. Ukulinganisa rhoqo kwe I-wire bond umatshini ukwabalulekile.
Omnye umba oqhelekileyo "uphosa," apho uxinzelelo kunye namandla enkqubo ye-Bround uqhekeze isilicon OKANYE IZIXHOBO ZE-OXDAKE PA I-Bond pad. Oku kuhlala kubangelwa kukunyanzeliswa kakhulu okanye amandla e-ultrasonic. Sebenzisa ichanekile boleza Isixhobo kunye nenkqubo elawulwa ngokuchanekileyo inokuthintela lo monakalo. Okokugqibela, Ukusilela kwebhondi Inokwenzeka ngexesha elifanelekileyo ngenxa yokwenziwa kweBrittle I-Intermetallic Compows, ngakumbi phakathi igolide kunye ne-aluminium kwi Iqondo lokushisa eliphakamileyo. Ukukhetha ukudityaniswa kwezixhobo ezifanelekileyo, njenga i-aluminium wire Kwi-Alweminium pads okanye ukusebenzisa i-tertor nyibila kwi I-Bond pad, unokunciphisa ezi zixhobo zexesha elide ukuthembeka.
Yintoni umahluko phakathi kocingo oluxhotyisiweyo kunye nokusebenzisa igosa kwi-themer kwi-Uniconter?
Ngelixa zombini I-wire bond kwaye umthengisi zisetyenziselwa ukwenza Unxibelelwano lombaneIinkqubo ezahlukeneyo ezisetyenziselwa isikali esahlukileyo kunye neenjongo ezahlukeneyo ngaphakathi kwe isekethe. Ukuqonda iindima zabo kubaluleke kakhulu ekuboneleni ngeNdibano ye-Elet-elektroniki.
Umthengisi yintsimbi ingxubevange Ngendawo ephantsi yokunyibilika esetyenziselwa ukujoyina izinto ezinkulu kunye, njengokuncamathisela i isekethe elihlanganisiweyo iphakheji kwi I-PCB okanye uqhagamshele ukurhoxisa kwi i-electrode. Inkqubo ibandakanya ukufudumeza umthengisi Ide inyibilike, ihamba phakathi kwamacandelo, kwaye ipholile ukwenza uqhagamshelo oluqinileyo. Umthengisi ilungele ukwenza oomatshini oqinileyo kunye neebhondi zombane kwindawo ye-macro kodwa ayichanekanga ngokwaneleyo kunxibelelwano lwe-microscopic olufunekayo ngaphakathi kwi I-Semiconductor iphakheji. Awunakho ukusebenzisa umthengisi Ukunxibelelana ne-tiny iqhina iipads kwi-chip.
I-wire bond, kwelinye icala, lilizwe eliqinileyo Inkqubo ye-welding yenzelwe isikali esincinci phawulaI-ion. Yenza i-metricial ngqo iqhina phakathi kwe ucingo olucekeceke kwaye i-chip's I-Bond pad ngaphandle kwempahla eyahlukileyo yokucoca umthengisi. I-wire bond inikezela ngokuchanekileyo kwaye ixinezeleko, ivumela amakhulu okanye amawaka onxibelelwano ekufuneka lwenziwe kwindawo encinci. Kufuphi, i-wire ye-wireisetyenziselwa ukufumana umqondiso ngaphandle yesilicon kufa, ngelixa umthengisi ihlala isetyenziselwa ukudibanisa ukufana kwe isekethe. Zizo iitekhnoloji ezimbini ezisebenzayo ezisebenzisana ukwakha izixhobo ze-elektroniki esizisebenzisayo yonke imihla.
Iqhosha lezitshixo
- I-cire yeqhina ibalulekile: Iingcingo zebhondi ziimpawu ezibalulekileyo zombane ezibonisa i-semiconductor chip kwihlabathi elingaphandle, esenza wonke umsebenzi wesekethe.
- Inkqubo sisitshixo: Yanamhlanje Iinkqubo ze-BOID njenge I-thermosonic bond Sebenzisa indibaniselwano yohlobo lobushushu, amandla, kwaye i-ultrasonic amandla okudala i-metring eyomeleleyo, ethembekileyo weld.
- Ibhola vs. Wedge: Ibhondi yebholaI-Ing ikhawuleza kwaye iguquguquka, iqhele ukusebenzisa igolide okanye i-copeper, ngelixa Wedge BondI-Ing ibonelela ngokuchanekileyo kwizicelo ezihlawulelwayo, zihlala zi-aluminium ucingo.
- Imicimbi yezinto ezibonakalayo: Ukhetho phakathi I-wire yegolide, ucingo lobhedu, kwaye i-aluminium wire Isigqibo sobunjineli obubalulekileyo esekwe kwiindleko, ukusebenza, kunye neemfuno zokuthembeka.
- Kulumkele ukusilela: Ukuthintela Ukusilela kwebhondi Ifuna ulawulo lwenkqubo engqongqo, izixhobo ezicocekileyo, kwaye zilungiselelwe ngokuchanekileyo I-rameter ye-rameters Ukuthintela iibhondi ezibuthathaka okanye ukonakala kwi-chip.
- Ayifani nomthengisi: I-wire bond yinkqubo yokuqina eqinileyo-yombuso ye-wilding ye-chip ye-chip uqhagamshelo lwe, ngelixa umthengisi yinkqubo ye-macro-ye-macro esetyenziselwa ukujoyina izinto ezinkulu kwi I-PCB.
