Zita rangu ndiKevin, uye pano kuDongxin Electronic Tekinoroji, mazuva angu akazadzwa nesainzi yeiyo isingaverengeki. Ini ndinoshanda neinjiniya seMarcus muGerman-Brilliant, pfungwa dzesimbi dzinonzwisisa kuti kubudirira kwekambani kunogona kushayikwa pane imwe chete, microscopic waya. Kukanganisa Wire Bond, zvoda kunge zvisingaonekwi neziso rakashama, rinogona kuvhara miriyoni-yemadhora ekugadzira mutsara. Ichi chinyorwa ndecheMarcus uye neyenjiniya ese, nyanzvi, uye pfungwa dzinoshamisa dzinoda kusvetukira kuseri kweketeni. Tiri kuzokura nyika ye Wire Bond, kuongorora kuti izvi zvidiki sei Bond Wires gadzira iyo system yetsinga yemhando yeyako yemagetsi iwe. Rwendo rwekuita nyika yekufungidzira, simba, uye fizikisi iyo inobatanidza zera redu redhijitari.
Ndeipi chisungo chemaya waya uye nei zvichikosha kwazvo kune dunhu rakabatanidzwa?
Pane zviri nyore, a Wire Bond idiki tambo ye waya yaishandiswa kugadzira Electrical Interconcections pakati a semicononductor chip uye kurongedza kwayo kana dunhu redunhu rakadhindwa (PCB). Funga nezve Yakabatanidzwa Circuit (IC) seguta, kuputika neruzivo uye masaini yemagetsi. Iri guta rinoda nzira dzekubatanidza nenyika dzekunze. Bond Wires ndidzo nzira dzepamusoro. Ivo vanopa nzira yemuviri yemagetsi uye data kuyerera mukati uye kunze kwechip, kugadzira iyo yose Circuit inoshanda. Pasina izvi zvinongedzo, zvakanyanyisa kufambira mberi Semiconductor mudziyo Munyika ingori chidimbu che silicon.
Kukosha kwe Wire Bond yakakura kwazvo nekuti ndiyo yakajairika uye inodhura-inoshanda Nhau dzeInternnect inoshandiswa mune indasitiri. Zvese chisungo inofanira kuve yakakwana. Imwe yakaipa chisungo mune mudziyo une mazana kana zviuru zve Bond Wires inogona kukonzera iyo yese chikamu chekutadza. Uku kubatana kunoda kuve nekunaka magetsi maitiro Kuendesa masaini pasina kurasikirwa uye kuve nekubatira zvine chekuita kuti idzore kupisa, kushushikana, uye kushushikana kwemakore kwemakore. Kuvimbika kwezvinhu zvese kubva kune yako smartphone kune yekuchengetedza mota system zvinoenderana nekuvimbika kweizvi microscopic waya kubatana.
Imwe neimwe Wire Bond ndeye miniature feat yeinjiniya. A chaizvo yakaonda waya, kazhinji ne a dhayamita diki pane bvudzi revanhu (rakayerwa mukati Micrometers), yakanyatsobatanidzwa kune imwe nzvimbo pane chippi chinonzi a Bond Pad. Mumwe chisungo inozoitwa kune iyo leftframe kana substrate, kupedzisa Circuit. Maitiro anogadzira chisingaperi, chakasimba-nyika weld, chengetedza kubatana kwakasimba uye kwakavimbika. Uku hakusi kwekunyorwa kwemakanika kubatana; Iyo chaiyo metallurgical chisungo pamunhu weatomu.
Maitiro ekurongedza aya anogadzira sei yakasarudzika yemagetsi yekubatana?
The the Wire Boging Process inzira inoomesesa inoshandisa musanganiswa wesimba, kupisa, uye Ultrasonic simba rekugadzira yakasimba chisungo. Chinangwa ndechokujoinha waya ku Bond Pad Pasina kushandisa chero zvinhu zvekunze zvakaita se mutengesi. Kune mashoma mashoma Bonding maitiro, asi zvakanyanya kuwanda Thermonic Bonding. Kuita uku kutamba kwakashata kwefizikisi uye mechanics.
Ngatipwanyei Maitiro Matanho. Kutanga, semicononductor chip inoiswa pane imwe nzvimbo yekupisa, ichiunza iyo kune tembiricha yakakwidziridzwa (kazhinji 100-300 ° C). Kupisa uku kunobatsira kupfava simbi, kuvaita kuti vatore kugamuchira kuumba a chisungo. The the Wire Kubatira muchina wobva watora kupera kwe waya uye uchimanikidza kubva kune iyo aluminium Bond Pad pane silicon chip. Sekumanikidzwa kunoiswa, muchina unosuma yakakwira-frequency Ultrasonic Energy. Iyi vibration inoita kunge microscopic scrub burashi, ichibvisa midziyo uye inosvibisa kubva pamakona ezvose zviri zviviri waya uye pad.
Kusanganiswa kwe kupisa uye ultrasonic vibration inokonzera maatomu e waya uye Bond Pad kusanganisa uye kusanganisa, kugadzira yakasimba, yakabatanidzwa weld. Izvi zvinozivikanwa se Chekutanga Bond. Muchina wobva waisa waya kune iyo yekubatanidza pfungwa pane substrate uye inoita chiito chakafanana kugadzira iyo Chisungo chechipiri. Mhedzisiro yacho haina musungwa Kubatana izvo zviri zviviri zvemagetsi zvinoshanda uye zvine mhanya. Iyo yese yekuvhiya kweimwe waya zvinoitika muchikamu chechipiri, uchibvumira michina yemazuva ano kuisa zviuru zve Bond Wires paminiti.
Ndeapi misiyano huru pakati pebhora bond uye wedge bond maitiro?
Nepo chinangwa chiri chimwe chete, iyo mbiri huru Bonding maitiro—BALL BCHAS uye Wedge Bond-Zvino munzira dzakasiyana-siyana. Sarudzo pakati payo inoenderana neshoko, iyo Rudzi rweWire yakashandiswa, uye dhizaini ye Yakabatanidzwa Circuit.
A BALL BCHAS, sezita rinoratidza, rinotanga nekugadzira bhora diki ku kupera kwe waya. Izvi zvinoitwa nekunyungudutsa iyo tip ye waya ine spark yemagetsi. Iyi simbi yakanyungudutswa, kazhinji Goridhe Wire kana Copper waya, inoumba nzvimbo yakakwana nekuda kwekunetseka kwepasi. Izvi zvinonzi A "Mahara Air Bhora. "Muchina wobva wadzvanya izvi goridhe bhora pane Bond Pad nechisimba uye Ultrasonic Energy kugadzira iyo Chekutanga Bond. Mukana wakakosha we BALL BCHAS ndiko kumhanya kwayo uye chokwadi chekuti waya inogona kutakurwa mune chero nzira kubva ku chisungo.
A Wedge Bond, kune rumwe rutivi, haishandise bhora. Pachinzvimbo, inoshandisa wedhi-yakavezwa chishandiso chekudzvanya waya zvakananga ku Bond Pad. Ultrasonic Energy inobva yashandiswa kugadzira iyo stitch-senge chisungo. Maitiro aya anodzokororwa Chisungo chechipiri. Wedge Bonding inowanzoitwa Aluminium Wire Asi zvinogona zvakare kushandiswa kwegoridhe uye ndarira. Mukana wayo unonyanyabatsira ndewekuti unogadzira yakaderera-mbiri chisungo, iyo yakanaka kwazvo yekunyorera uko nzvimbo dzakatekwa inzvimbo ishoma. Izvo zvinodawo kufarirwa kune yakanaka-pitch application ipo chisungo Mapads ari padyo pamwe chete. Zvisinei, a Wedge Bond inowanzo kuita zvishoma zvishoma pane a BALL BCHAS.
Unogona kutsanangura mhando dzakasiyana dzewire unoshandiswa mukubatanidza?
The the waya yakashandiswa zvekubhira hachisi chero metal waya; Icho chinhu chakanyanya chemajiniya zvinhu zvine zvirevo. Zvinyorwa zvitatu zvakajairika zvizhinji ndarama, uye mhangura, uye aluminium. The the Kubatira Wire inoshandiswa Kuti ugadzire kubatana kwakasimba uye kwakavimbika, saka kuumbwa kwayo kwekunyora.
- Goridhe (au) waya: Kwenguva yakareba, Goridhe Wire yaive yeindasitiri mwero. Zvinonyanya kuramba kuita Corrosion uye oxidation, ichiita kuti zvive nyore kugadzira zvisungo zvemhando yepamusoro. Kupfava kwayo uye ductility kwakanakira kune iyo inonetesa Wire Boging Process. Goridhe Wire inonyanya kujairika Inoshandiswa kubhora bhora. Kukanganisa kwayo kukuru ndiko kukwirira Mari yegoridhe.
- Copper (cu) waya: Copper waya rave paine imwe nzira yakakurumbira kune goridhe nekuti idiki zvakanyanya kudhura uye ine yakakwirira magetsi maitiro. Nekudaro, mhangura yakaomesesa kupfuura goridhe uye oxid dial nyore. Izvi zvinoita kurumwa kunoda maitiro akanyanya kudzorwa, kazhinji mune inert nitrogen mamiriro ezvinhu, kudzivirira oxidation inogona kupera simba chisungo. Isu tinopa yakakwirira-yekuchena Copper waya yakagadzirirwa kukurira matambudziko aya. Kuvandudza zvivakwa zvayo, Copper waya inowanzoitwa neyakaenzana chidiki che Alloy kunge Palladium (palladium coated they bopper)
- Aluminium (al) waya: Aluminium Wire, kazhinji a Alloy nehuwandu hushoma hwe silicon, inonyanya kushandiswa Wedge Bonding. Iyo yakapfava uye isingadhuri. Ndiyo zvinyorwa zvekusarudza kune yakakwirira-simba zvishandiso, uko kwakakura waya diamita inodiwa kutakura zvimwe zvazvino. Sezvo zvakanyanya chisungo Pads pane a semicononductor zvakare yakagadzirwa nealuminium, uchishandisa an Aluminium Wire inogadzira iyo mono-simbi system, iyo inodzivirira kuumbwa kweBrittle Intermitallic compounds izvo zvinogona kuitika pakati goridhe uye aluminium, zvichitungamira Bond Kukundikana.
Ibasa ripi iro risiri simba resimba rinotamba mumitambo yemazuva ano yekubatanidza?
Ultrasonic Energy ndicho chakavanzika chinongedzo chinoita zvemazuva ano Wire Kubatira zvinoshanda uye zvakavimbika. Inotendera yakasimba weld kuumbwa pakudziya kwakadzika kupfuura zvaizodiwa, maitiro anozivikanwa se Ultrasonic Bonding. Izvi zvakakosha nekuti tembiricha yakanyanya inogona kukuvadza iyo inotarisisa semicononductor mudziyo.
Heano maitiro azvinoita: Munguva ye Kuumbwa Kuumbwa, chishandiso chinovhunika waya zvinopesana naIshe Bond Pad pane iyo Ultrasonic Frequency (kazhinji 60-120 KHz). Uku kukurumidza, kupaza kwekufamba kunoita zvinhu zvinoverengeka zvakakosha. Kutanga, inoita seane simba rekuchenesa, kurambana uye kubvisa chero zvinhu zvakatetepa zvemhando yemhando kana zvinosvibisa zvesimbi. Iwe haugone kugadzira zvakanaka chisungo Kuburikidza nedanho rezvakasviba, uye pane microscopic lever, oxidation ndiyo chaiyoiyo.
Chechipiri, simba rekupokana rinogadzira rakarongedzwa kupisa uye kupurasitiramu kushatirisa pane iyo interface. Izvi zvinoremedza nzvimbo dzesimbi, zvichivabvumira kuumbwa pamwechete. The the Dzvinyiriro uye Ultrasonic vibration inounza maatomu e waya uye Bond Pad Kubata kwakadaro kwepamoyo kwavanotora maelekitori uye kuumba echokwadi metallurgical chisungo. Pasina Ultrasonic Energy, iwe waizoda yakawanda yekupisa uye masimba (Thermocompression Bonding), izvo zvaizoisa pangozi kupaza iyo inonetesa silicon kufa pasi pe Bond Pad. Kushandiswa uku kwe Ultrasonic Simba riri pakati Thermonic Bonding maitiro.
Nei waya yegoridhe ichinyatsoita seyakagadzirwa nemhando yepamusoro yebusha waya?
Goridhe Wire Yakareba ichave iyo goridhe chiyero (pun yakagadzirirwa) yekuvimbika-kuvimbika Bond Wires. Mukurumbira wayo anobva kune imwe musanganiswa wakasarudzika wemakemikari uye emuviri zvivakwa zvinoita kuti ive yakasarudzika yakakodzera nzvimbo yekuda iyo Yakabatanidzwa Circuit.
Mukana wakanyanya kukosha we Goridhe Wire ndiyo kemikari yemakemikari. Iyo inodzivirira zvakanyanya kune oxidation uye Corrosion. Izvi zvinokosha kwazvo nekuti akachena, oxide-emahara-emahara nzvimbo yakakosha yekugadzira yakasimba, yakaderera-kuramba chisungo. Nepo mamwe metals anoumba kusimbisa oxide liders anenge achimiririra mumhepo, goridhe inoramba iri pristine, achigadzira goridhe waya kusungwa maitiro anokanganwira zvakanyanya uye anodzokororwa. Uku kusakwana kusimba kunotungamira kune yakakwira goho uye zvakanyanya kutendeka kwenguva refu kuita.
Uyezve, Goridhe Wire yakanyanya kugadzikana uye inovhunika. Izvi zvinoreva kuti zvinogona kukweverwa mune zvakanyanyisa yakaonda waya nekuenderana dhayamita uye inogona kuve nyore kuumbwa panguva BALL BCHAS uye kuedza kwekutya pasina kushanda-kuomesa kana kutyora. Uku kupfava kunobatsirawo kutora mamwe emuchina kushushikana kunogadzirwa Nekurongedza maitiro, achidzivirira asina kusimba Bond Pad uye pasi silicon kubva kukuvara. Nepo yakakwira Mari yegoridhe chinhu chikuru, chezvekushamisika zvakakomba muEerospace, zvekurapa, uye zvechiuto zvemagetsi zvinokatyamadza haisi sarudzo, kuvimbika kwakapihwa na Goridhe Wire inowanzo kururamisa mutengo.
Wireya yemhengasi inoenzaniswa sei waya yechinyakare yakaita segoridhe?
Copper waya ndiye anotungamira anoshora kusvika kune goridhe kutonga mukati Wire Kubatira nyika. Mutyairi wekutanga wekutora okutora mari ndeyekuti mutengo-mhangura zvakachipa kupfuura goridhe. Nekudaro, shanduko kubva Goridhe Wire kuti Copper waya Haisi kungori kushandurwa kwakareruka. Zvinoda gadziriso dzakakosha kune iyo Bonding maitiro Nekuda kwezvivakwa zvakasiyana zvezvinhu zvekushandisa.
Kubva pamaonero emabasa ekuita, Copper waya anokunda. Ine kumusoro magetsi maitiro Uye inobata mufambiro kupfuura goridhe, ichiita kuti zviitike zvishandiso zvinobata simba rakawanda kana kumhanya kupisa. Izvo zvakare zvine zvivakwa zviri nani, zvichitungamira kune simba Bond Simba uye kuramba waya kutsvaira panguva yepurasitiki yekuumba maitiro. Nekudaro, mhangura inouya neyakaenzana nematambudziko. Yayo rukuru kudhirowa ndeyo kuomesa uye kusanyengerera kuCorrosion.
Nekuti mhangura yakaomesesa kupfuura goridhe, iyo Kuronga paramita, zvakaita se Kumanikidza uye Ultrasonic Simba, anofanira kunyatso kudzorwa kuti arege kukuvadza Bond Pad. Nyaya yakakura ndeye oxidation. Copper oxitiday nekukurumidza, uye iyi nzombe yedare inogona kudzivirira yakanaka chisungo kubva pakugadzira. Kurwisa izvi, ndarira Wire Kubatira inowanzoitwa mune okisijeni-yemahara nitrogen nharaunda. Kuenderera mberi nekuvandudza mashandiro ayo ekubatanidza uye kuramba kune oxidation, mhangura waya inowanzo kufungidzirwa nezvinhu zvakaita Palladium. Izvi Palladium-coated Copper waya yave sarudzo yakakurumbira, ichipa chiyero chakanaka chemutengo, kuita, uye kugadzirisa.
Matambudziko api anomuka kana achigadzira chisungo neAluminium waya?
Aluminium Wire ndiko kushanda kwesimba semicononductor indasitiri. Zvakanakira Wedge Bonding in application inoda yakakura waya diamita kubata yakakwirira-ikozvino. Zvisinei, kushanda na Aluminium Wire inopa yakasarudzika yematambudziko ayo mainjiniya anofanirwa kubata.
Dambudziko guru ne Aluminium Wire kupfava kwayo. Nepo izvi zvinoita kuti zvive nyore chisungo pasina kukuvadza chip, zvinoreva zvakare waya inokanganiswa nenyaya dzemakanika. Semuyenzaniso, Aluminium Wire ine simba rakadzika kwazvo kupfuura goridhe kana mhangura, saka hanya inofanira kutorwa panguva yekuvhara kudzivirira kuputsa. Uyezve, zvinonyanya kuitika kuna Cycle yakaderera inononoka. Kana chishandiso chikakwira uye chinotonhorera pasi, zvigadzirwa zvinowedzera uye chibvumirano. Nekuti Aluminium Wire ine zvakasiyana coefficient yekuwedzera kwekuwedzera pane zvimwe zvigadzirwa mupakeji, ichi chebhasikoro iyi chinogona kukonzera kushushikana kuchitsitsinho kwe chisungo, pakupedzisira inotungamira mukupaza kana kutadza.
Kumwe kufunga ndiko Aluminium Wire ingangoita chete inoshandiswa Wedge Bonding. Haigone kuumbwa nyore nyore kuita a Mahara Air Bhora kunge goridhe kana mhangura, iyo inogumira kushandiswa kwayo mukukurumidza BALL BCHASmaitiro. Pasinei nematambudziko aya, iyo yakaderera mutengo uye kuita kwakanaka kwazvo muMono-metallic system (aluminium waya pane aluminium mapads) ita kuti ive chinhu chakakosha. KuDongxin, tinopa yakakwira-mhando yakachena aluminium waya uye robust inorema aluminium waya yekubatanidza zvishandiso zvakananga injinjwe kuti igadzire zvisungo zvakavimbika mukudaidzira zvakakwirira-simba zvikumbiro.
Unodzivirira sei kukundikana kwakajairika mune waya ye waya?
A yakundikana Wire Bond inogona kuve njodzi yechishandiso chemagetsi, saka kudzivirira kukundikana ndeyekutanga kwekutanga. Kukundikana kunogona kuitika nekuda kwezvikonzero zvakawanda, kazhinji zvine chekuita nekutonga kwakashata pamusoro pe Kuronga paramita, kusvibiswa, kana nyaya dzekunyama. Maitiro anoita anokosha kiyi.
Imwe yeiyo inowanzoitika kutadza maitiro haana kusimba chisungo kana "isina-tsvimbo," uko waya haina kunyatsoomerera kune iyo Bond Pad. Izvi zvinowanzo kukonzerwa nekusvibiswa pane iyo pad pamusoro kana zvisina kufanira tuned Kuronga paramita. Kuona kuchena kwezvinhu zvese uye zvinyoro-nyoro optimizing musungo wehondo, Ultrasonic Simba, uye tembiricha yeiyo chaiyo Zvishandiso zvakare mutsara wekutanga wekudzivirira. Kugara kuchikara kwe Wire Kubatira muchina unokoshawo.
Imwe nyaya yakajairika ndeye "cratering," uko kudzvinyirira uye simba rekurongedza kupaza kusasimba silicon kana oxide ligeres pasi pe Bond Pad. Izvi zvinowanzo nekuda kwesimba rakawandisa kana Ultrasonic Energy. Uchishandisa iyo chaiyo kusungwa Chishandiso uye maitiro chaiwo anodzora anogona kudzivirira kukuvara uku. Pakupedzisira, Bond Kukundikana inogona kuitika nekufamba kwenguva nekuda kwekuumbwa kweBrittle Intermitallic compounds, kunyanya pakati goridhe uye aluminium panguva tembiricha yakakwidziridzwa. Kusarudza zvakaringana zvekunyora musanganiswa, senge Aluminium Wire pane aluminium mapads kana kushandisa chisungo chesimbi pane Bond Pad, inogona kuderedza idzi refu-refu dzimba dzekuvimbika njodzi.
Ndeupi musiyano uripo pakati pe waya kusungwa uye kushandisa murindiri wechiitiko?
Nepo zvese zviri zviviri Wire Kubatira uye mutengesi anoshandiswa kugadzira Kubatana kwemagetsi, iwo maitiro akasarudzika anoshandiswa pane zvakasiyana zviyero uye nezvinangwa zvakasiyana mukati me Circuit. Kunzwisisa mabasa avo kiyi yekukoshesa gungano remagetsi.
Mutengesi isimbi Alloy neyakaderera inonyungudika iyo inoshandiswa kujoina zvikamu zvakakura pamwechete, sekusanganisa Yakabatanidzwa Circuit Package kune a PCB kana kubatanidza kurwisa kune Electrode. Maitiro acho anosanganisira kupisa iyo mutengesi Kusvikira yanyungudika, inoyerera pakati pezvikamu, uyezve inotonhorera kuti iite kubatana kwakasimba. Mutengesi yakanaka yekugadzira yakasimba michina uye yemagetsi zvisungo paMacro chiyero asi hachisi chaicho chakakwana kuti microscopic kubatana kunodiwa mukati me semicononductor package. Iwe haugone kushandisa mutengesi kubatanidza kune zvidiki chisungo Pads pane chip.
Wire Kubatira, kune rumwe rutivi, isimba rakasimba-nyika Welding maitiro Yakagadzirirwa micro-chiyero Kushamwaridzanaion. Inogadzira yakananga metallurgical chisungo pakati pe yakaonda waya uye chip's chip Bond Pad pasina chinhu chakaparadzaniswa mutengesi. Wire Kubatira inopa zvakanyanya zvakanyanyisa kugona uye density, kubvumira mazana kana zviuru zvezvibatanidzwa kuti zviitwe munzvimbo diki kwazvo. Muchidimbu, Wire Bonding inoshandiswa kuwana chiratidzo kunze yeiyo silicon inofa, nepo mutengesi inowanzoshandiswa kubatanidza yakarongedzwa kufa kune vamwe vese Circuit. Iwo maviri matekinoroji ematongero anoshanda pamwechete kuvaka zvishandiso zvemagetsi zvatinoshandisa zuva rega rega.
Key Deaaroways
- Iyo Wire WALL ISTOCKI: Bond Wires Ndidzo dzakakosha magetsi mashura anobatanidza Semiconductor chip kune iyo kunze kwenyika, achiita basa redunhu.
- Maitiro akakosha: Zvazvino Bonding maitiro kunge Thermonic Bonding shandisa kusanganisa chaiko kwekupisa, simba, uye Ultrasonic simba kugadzira yakasimba, yakavimbika metallurgical weld.
- Bhora vs. wedge: BALL BCHASin inkurumidza uye inoshanduka, kazhinji uchishandisa goridhe kana mhangura, nepo Wedge Bonding inopa yakakwirira yekunyatsogadzirirwa waya.
- NYAYA DZESVONDO: Sarudzo pakati Goridhe Wire, Copper waya, uye Aluminium Wire isarudzo yekunyanyisa yeinjiniya inoenderana nemutengo, kuita, uye kuvimbika zvinodiwa.
- Dzivisa Kutadza Kunzvera: Kudzivirira Bond Kukundikana inoda kudzora maitiro ekudzora, zvigadzirwa zvakachena, uye zvakaringana zvakarongeka Kuronga paramita kudzivirira zvisungo zvisina kusimba kana kukuvara kune chip.
- Kwete zvakafanana sewe mutengesi: Wire Kubatira iri micro-chiyero chakasimba-nyika tolating process ye chip-chikamu Kubatana, nepo mutengesi ndeye macro-chiyero maitiro anoshandiswa kujoina zvakakura zvikamu kune a PCB.
