Umhlahlandlela wokugcina we-Wire Bond Technology: Ukwenza kahle ukuxhumana kwesiMicroscopic

Sawubona, nginguKevin, futhi isikhathi esingaphezu kwamashumi amabili eTongxin Technology, ngiphile futhi ngaphefumula isayensi yokuxhumana okuncane. Ngibe nelungelo lokusebenza eceleni kwalabo onjiniyela abasebenza kahle njengoMarcus eJalimane, basize baxazulule ezinye zezinselelo ezinzima kakhulu ngaphakathi Ukupakishwa kwe-semiconductor kanye ne-elekthronikhi yezimoto. Izingxoxo zihlala zibuyisela emuva kubuchwepheshe obuyisisekelo, kodwa obumangalisa kakhulu, ubuchwepheshe: isibopho sentambo. A isibopho sentambo kungaphezu nje kokuncane uwaya; yindlela ebucayi yokuphila evumela a i-semiconductor xhoza ukuxhumana nomuntu wangaphandle. Leli umhlahlandlela wokugcina izalelwa kulezo zingxoxo. Sizomdumaza konke Inqubo Yokubopha Nge-Wire, kusuka ezinhlotsheni ezahlukahlukene zezibopho ezisetshenzisiwe, ngakho-ke ungaqonda ukuthi kudingani ukudala okuphelele, okuthembekile ukuxhuma Njalo ngesikhathi esisodwa.

Iyiphi ngempela inqubo yokubopha isibopho socingo?

Emgodini wayo, Inqubo Yokubopha Nge-Wire kuyindlela yokwenza Ukuxhumeka ngogesi phakathi kwe i-semiconductor xhoza nokupakishwa kwayo, noma phakathi kwezinto ezahlukene ebhodini lesekethe (I-PCB). Cabanga ngakho njenge-Wiring kagesi emikhulu. Le khasi inqubo yokwenza Lokhu kuxhumana kusebenzisa inhlanganisela yengcindezi, ukushisa, kanye uhlobo lwe-ultrasonic amandla okunamathisela kahle kakhulu uwaya (imvamisa incane kunezinwele zomuntu) kuya kumaphoyinti amabili, kwakha isimo esiqinile bulala phambili.

Umgomo ukudala i-metallurgical eqinile, ethembekile ubudlelwano Lokho kungaqhuba ugesi futhi kunciphise ukushisa kahle. A isibopho sentambo yakheka ngaphandle kokuncibilika uwaya ngomqondo wendabuko. Esikhundleni salokho, Kusetshenziswa amandla e-Ultrasonic Ukwakha ukunyakaza okuklanywa phakathi kwe uwaya Futhi ingaphezulu (I-Bond Pad). Lesi senzo sisula ukungcola kude futhi sivumela ama-athomu e uwaya kanye iphethini ukuza othintana ngokuseduze, kwakha okuhlala isikhathi eside ubudlelwano. Le ndlela elawulwa kakhulu yi-backbone yesimanje Umkhakha we-semiconductor, enika amandla ukufakwa okuyinkimbinkimbi kanye nokugcwala kwemibuthano yanamuhla ehlanganisiwe.

Yiziphi izinhlobo eziphambili zamasu wokubopha ngocingo?

Ngenkathi umgomo uhlala ufana - ukudala ugesi onokwethenjelwa ubudlelwano-Kukhona izindlela ezimbalwa ezihlukile zokufika lapho. Le khasi Izinhlobo ze-Wire Bonding ngokuvamile zihlukaniswa ngesimo sokuqala ubudlelwano kanye nohlobo lwethuluzi olusetshenzisiwe. Okugqamile okuvelele kakhulu amasu wokubopha intambo yile:

1. Ukubopha ibhola: Lokhu kuvame kakhulu Indlela yokubopha i-Wire. Kuqala ngokuncibilikisa ukuphela kwe uwaya ngogesi kagesi ukwakha ibhola elincane. Le bhola icindezelwa ku I-Bond Pad ye xhoza ukwakha isibopho sokuqala. Umshini bese ufaka i- uwaya endaweni yesibili (ku i-substrate noma I-PCB) futhi kwakha ukushuba okufana Isibopho sesibili Ngaphambi kokudwengula i uwaya off. Le ndlela ishesha kakhulu futhi isetshenziswa ngokuyinhloko nge ucingo lwegolide na- ucingo lwethusi.

2. Hlanganisa isibopho: Kule ndlela, the uwaya icindezelwa ngokumelene ne I-Bond Pad engela iyithuluzi elimise okwenziwe nge-wedge. Uhlobo lwe-ultrasonic Amandla asetshenziswa ukuze akhe i-stitch ubudlelwano. Umshini bese uqhubekela kwesesibili iphethini futhi iphinda inqubo yokudala Isibopho sesibili. Hlanganisa isibopho kungenziwa nge I-Aluminium Wire, ucingo lwegolide, futhi ucingo lwethusi, futhi kuvame ukuthandwa izinhlelo zokusebenza ezivame ukwenzeka ngenxa yephansi I-Wire Loop Iphrofayili Ingafinyelela. Umehluko, owaziwa ngokuthi Ukubopha I-Ribbon, isebenzisa iribhoni elisicaba esikhundleni somjikelezo uwaya Ngezicelo ezikhethekile.

Uzikhetha kanjani izinto ezilungile zocingo zesibopho?

Le khasi Ukukhetha kungenye yezinqumo ezibucayi kakhulu ku- Inqubo Yokubopha Nge-Wire. Ukukhethwa kwe impahla ye-wire kuthinta konke kusuka kuzindleko futhi ukubangelanisa kuze kube yisikhathi eside ukuthembeka ye Idivaysi ye-semiconductor. Izinto ezintathu eziyinhloko isetshenziswe embonini yocingo yigolide, ithusi, ne-aluminium.

Njengochwepheshe, ngivame ukululeka amaklayenti ukuthi ukukhetha akunjalo nje mayelana nezakhiwo zezinto ezibonakalayo kodwa nokuxhumana kwayo ne I-Bond Pad metallurgy kanye nokusebenza okuhlosiwe Izimo zezemvelo. Isibonelo, ngenkathi isibopho socingo sethusi inikeza ukusebenza okuphezulu, ukuphatha i oxidation of wire idinga inqubo ethuthukile ngokwengeziwe. Ngezinhlelo eziningi ezijwayelekile, I-Aluminium Wire ihlinzeka ngesixazululo esinamandla nesibizayo.

Kungani ububanzi bentambo bubaluleke kangaka kwisibopho esithembekile?

Le khasi ububanzi bentambo akuyona ukukhetha kokuphikisana; Ipharamitha enobunjiniyela elibucayi ku ubudlelwanoukusebenza futhi ukuthembeka. Omkhulu uwaya Ungathwala amanga kagesi amaningi ngaphandle kokushisa ngokweqile, okwenza kudingekile amadivayisi wamandla nezinhlelo zokusebenza ezinezidingo eziphakeme zamanje. Ngakolunye uhlangothi, ukuze ubuningi obuphezulu Ama-semiconductor chips ngokugcwele ngokuqinile ubudlelwano ama-pads, a impela ucingo omncane kuyadingeka ukuvikela amasekethe amafushane.

Ngaphezu kwalokho, the ububanzi bentambo udlala indima ebalulekile emandleni okusebenza we isibopho sentambo. Omkhulu uwaya ngokwemvelo kwakha okunamandla ubudlelwano. Le khasi isibopho sentambo kumele kube nokuqina ngokwanele ukumelana nezingcindezi zenqubo yokufaka (njenge-mold emvelo) kanye Ukucindezela Kwemishini yendawo yayo yokusebenza. Sisebenzisana kakhulu nonjiniyela ukukhetha i- ucingo olufanele Ukulinganisa lokho Izidingo Zogesi, ukuqina kwemishini, kanye nezinkinga zomzimba zokwakhiwa kwazo. Lesi yisici esibalulekile ku- Lungiselela ukubopha inqubo.

Ngabe kwakhiwa kanjani isibopho socingo esinamandla empeleni?

Ukudala okuphumelelayo uwaya ubudlelwano ngumdanso obucayi phakathi kokhiye abathathu amapharamitha ahlanganisa: Force, uhlobo lwe-ultrasonic amandla, nesikhathi. I-bonder yanamuhla ilawula lezi eziguquguqukayo ngokunemba okumangalisayo ukuze wakhe i-metallurgical ephelele ubudlelwano.

1. Amandla Okubopha: I Ithuluzi Lokubopha kusebenza inani elithile lamandla ukucindezela i- uwaya ngokumelene ne I-Bond Pad. Lo mkhosi ubalulekile ekuqinisekiseni ukuthintana okusondele phakathi kwezindawo ezimbili nokuqalisa ubudlelwano inqubo.
2. Amandla e-ultrasonic: Lesi isithako esiyimfihlo. Ngenkathi uwaya Ingaphansi kwengcindezi, ithuluzi liyadlidliza ngamafrikhthi aphezulu (ngokujwayelekile 60-120 KHZ). Leli uhlobo lwe-ultrasonic Isenzo sokusola sehlisa izingqimba ze-oxide kanye nokungcola, ukudala izindawo ezihlanzekile zensimbi ezingakwazi kalula ubudlelwano. Kubangela futhi deformation yepulasitiki yasendaweni, esiza ukuhlangana kwama-athomu.
3. Isikhathi seBond: Lesi isikhathi sokuthi amandla futhi uhlobo lwe-ultrasonic Amandla asetshenziswa. Ngokuvamile kungama-milliseconds ambalwa nje kodwa kufanele kube yinde ngokwanele ukuvumela okuphelele futhi okuqinile ubudlelwano ukwakha.

Ukuthola le ndlela yeresiphi kubalulekile ku-High isivuno esibophayo nesikhathi eside ukuthembeka. Noma yikuphi ukuphambuka kungaholela ekubuthakathaka ubudlelwano noma ukulimala kubuthakathaka i-semiconductor xhoza ngaphansi kwe I-Bond Pad.

Yini umehluko osemqoka phakathi kokubhidlizwa kwe-wedge kanye nokubopha kwebhola?

Ukukhetha phakathi kwalezi zinto ezimbili Ubuchwepheshe be-Wire Bonding-Ball futhi hlanganisa isibopho-Ofsun incike ku- Izidingo zesicelo. Ngenkathi bobabili benza a isibopho sentambo, izinqubo zabo kanye nemiphumela kuhlukile.

Le khasi I-Ball Bonding Techtique ngokuvamile kushesha ngoba ithuluzi alidingi ukujikeleza phakathi kwe isibopho sokuqala na- Isibopho sesibili. Ithuluzi le-capillary lihamba liqonde phezulu naphezu kwe i-substrate. Lokhu kwenza kube yi-GO-TO CHECT yokukhiqizwa kwevolumu ephezulu yezakhi ezijwayelekile. Okuqala ibhondi yebhola futhi uqinile futhi uthethelela ukuhlukahluka phakathi iphethini ikhwalithi ephezulu.

Hlanganisa isibophoNgakolunye uhlangothi, kunikeza ukuguquguquka okuthe xaxa. Ngoba kwakha isiteki ubudlelwano emaphethelweni womabili, akudingi umsila onjenge ibhondi yebhola, ukuvumela ukuthambeka okuhle (izikhala eziseduze) phakathi kwama-bond pads. Umphumela I-Wire Loop Ingagcinwa iphansi kakhulu futhi iyisicaba, ebalulekile kumadivayisi avama kakhulu lapho ubuqotho besiginali lubanda kakhulu. Le ndlela futhi yiyona kuphela inketho esebenzayo ye I-Aluminium Wire Bonding. EDongxin, senza amathuluzi okunemba kuzo zombili izinqubo, kufaka nezethu Ithuluzi elenziwe ngezifiso le-Welge Bonding ye-Aluminium Wire Welding auto, eyenzelwe izidingo ezifunwayo ze hlanganisa isibopho kwizicelo zezimoto.

Iziphi izinto ezinquma amandla ebhondi aphelele kanye nokwethenjwa?

Le khasi Ukwethembeka kwezibopho ze-wire isilinganiso esikhulu sempumelelo. Oyedwa wehlulekile ubudlelwano inganikeza yonke insiza engenamsebenzi. Le khasi Amandla eBond kanye nokusebenza kwesikhathi eside kuthonywa yizinto eziningi, okunolwazi unjiniyela kumele uphatheke ngokucophelela.

• Ikhwalithi ye-Bond Pad: I I-Bond Pad use xhoza na- i-substrate kumele ihlanzeke, mahhala i-oxides, futhi ibe ne-metallurgy efanele. Noma yikuphi ukungcoliswa kungaholela kokubuthakathaka noma kwehlulekile ubudlelwano.
• Ikhwalithi yocingo: Usebenzisa a ucingo olusezingeni eliphakeme ngobubanzi obungaguquki, ubumsulwa, namandla angaxoxi okuthembekile ubudlelwano.
• Amapharamitha ahlanganisa: Njengoba kuxoxwe, amandla, uhlobo lwe-ultrasonic amandla, futhi isikhathi kufanele sihlele ngokuphelele ngokuqondile impahla ye-wire, ububanzi, kanye I-Bond Pad izinto zokwakha.
• Izimo zezemvelo: Izici ezinjengokushisa futhi ukuswakama kungathinta ubudlelwano ngokuhamba kwesikhathi. Isibonelo, inhlanganisela ye I-Aluminium Wire na- imali ebomvu Ama-Pads angaholela ekwakhekeni kwama-brittle commetallics (avame ukubizwa ngokuthi "inhlupheko onsomi") emazingeni okushisa aphezulu, angadala ubudlelwano ukwehluleka.
• Ukucindezela Kwemishini: I I-Wire Loop ukwakheka nokuphakama kumele kulawulwe ukuze kuqinisekiswe isibopho sentambo ingamelana nezingcindezi ze-enchlabation kanye nokuhamba ngebhayisikile ngaphandle kokukhathala.

Kungani isibopho sentambo siseyindlela evelele namuhla?

Embonini echazwa ngoshintsho olusheshayo, isibopho socingo Uhlale ubuchwepheshe obunamandla bokuxhumana iminyaka engaphezu kwengu-50. Kunezizathu eziningana zempumelelo yayo ehlala njalo. Okokuqala, Isibopho se-Wire sinikezela ukuguquguquka okumangalisayo. Ingaxhuma ama-pads ezindaweni eziphakeme nama-engeli, i-feat enzima kobunye ubuchwepheshe obufana neflip-xhoza.

Okwesibili, kuyabiza kakhulu. Ingqalasizinda kanye nesisekelo solwazi isibopho socingo bavuthiwe futhi basakazeke, benza ikhambi lezomnotho elinobubanzi bezicelo eziningi. Ekugcineni, yiyo ukuthembeka kufakazelwe. Lapho kwenziwa kahle, Ukuxhumeka kwe-Wire Bonding ziqinile kakhulu futhi zinerekhodi lokuhamba ngethrekhi yamadivayisi, kusuka kumthengi olula Ama-Electronics ezinhlelweni ezibucayi e-aerospace nezokwelapha. Ngenkathi ubuchwepheshe obusha buvela, ukubopha ngentambo kubalulekile nengxenye ebaluleke kakhulu ye Ukupakishwa kwe-semiconductor ukubukeka komhlaba.

Yiziphi izinselelo ezijwayelekile kwinqubo yokuvunyelwa ngocingo?

Naphezu kokuvuthwa kwalo, Inqubo Yokubopha Nge-Wire ayikho ngaphandle kwezinselelo zayo. Ukuthola okuphelele ubudlelwano Ngaso sonke isikhathi, ikakhulukazi ngesivinini esikhulu, kudinga ukuqina nokulawula inqubo. Enye yezitha ezinkulu kakhulu zokuhle ubudlelwano kungcoliswa ku I-Bond Pad. Ngisho nohlobo lwe-microscopic lwamafutha noma i-oxide kungavimbela i-metallurgical efanele ubudlelwano kusuka ekubumbeni. Yingakho izimo zokuhlanza nokuphathwa kahle kwezinto ezibonakalayo kubaluleke kakhulu ngaphakathi Ukukhiqiza i-PCB.

Enye inselelo ukugqokwa kwethuluzi. Le khasi Ithuluzi Lokubopha, kungaba nge-wedge noma i-capillary, egqoke isikhathi ngokuhamba kwesikhathi. Lokhu kugqokwa kungathinta ukwakheka kwe ubudlelwano futhi kuholele emiphumeleni engahambisani. Ukuhlolwa njalo nokubuyiselwa kwamathuluzi kubalulekile. Ekugcineni, inqubo ikhuphuka, lapho amapharamitha ahlanganisa shintsha kancane ngokuhamba kwesikhathi ngenxa yokugqoka komshini noma ushintsho lwezemvelo, lungathinta ikhwalithi ye-bond. Kungaleso sizathu sokugawulwa kwedatha nokulawulwa kwenqubo yezibalo kubalulekile ekugcineni ukusebenza okuphezulu.

Ungawengeza kanjani indlela yakho yokuhlanganisa isibopho sakho ukuze uthole isivuno esikhulu?

Njengomuntu osiza amakhasimende khetha Izinqubo zabo, ngikholwa ukuthi impumelelo yehlela endleleni ephelele. Okokuqala, qala ngezinto ezinhle kakhulu. Lokhu kusho ukusebenzisa ubumsulwa obukhulu uwaya kusuka kumphakeli odumile onjengethu Inani eliphakeme eliphakeme lamanani entengo ephakeme nge-aluminium Bonding Wire / Ribbon / Strip nokuqinisekisa okwakho Ama-semiconductor chips futhi ama-substrates ahlanzekile, aguquguqukayo ubudlelwano amaphakethe.

Okwesibili, tshala imali ekutholeni ikhwalithi ephezulu futhi uyilondoloze ngokucophelela. Ithuluzi elinembile elinjengethu Umshini woqobo wokugcina impilo ende ebonda edla ithuluzi eliwugqinsi lwe-wire v groove wedge kungenza umehluko obalulekile ngaphakathi ubudlelwano ukuvumelana kanye nokuphila kwamathuluzi. Okwesithathu, yenza inqubo eqinile. Musa nje ukusebenzisa izilungiselelo ezizenzakalelayo zomkhiqizi. Udinga ukunquma Amapharamitha ahlanganisa kahle Ngesicelo sakho esithile ukudala iwindi lenqubo elingaba khona kakhulu. Ekugcineni, qaphela ukuqapha kwenqubo eqinile. Sebenzisa izinzwa ezakhelwe ngaphakathi zomshini kanye nezivivinyo ezibhubhisayo ngezikhathi ezithile (njengohlolo lokudonsela ucingo) ukuze uqinisekise ukuthi inqubo yakho ihlala ilawula futhi yakho ubudlelwano Ikhwalithi ayikaze ifinyelele.

Ukuthathwa Key

Le khasi isibopho sentambo yingxenye encane enomthwalo wemfanelo omkhulu. Ukukwazisa lobu buchwepheshe kuyisihluthulelo sokukhiqiza amadivayisi we-elekthronikhi athembekile futhi aphezulu. Nazi izinto ezibaluleke kakhulu okufanele uzikhumbule:

• Isisekelo: Isibopho socingo yinqubo yokufaka i-welding eqinile esetshenziswayo uhlobo lwe-ultrasonic Amandla, amandla nesikhathi nesikhathi sokudala ukuxhumana kukagesi.
• Izinhlobo eziphambili: Okuqala kokuqala amasu wokubopha intambo bakhona ukubopha ibhola (okusheshayo, okuvamile ngegolide / yethusi) futhi hlanganisa isibopho (evumelana nezimo, kuyadingeka nge-aluminium).
• Izindaba ezibonakalayo: Ukukhethwa kwe impahla ye-wire-Gold, ithusi, noma i-aluminium - yisinqumo esibucayi sokuklama okulinganisa izindleko, ukusebenza, futhi ukuthembeka.
• Amapharamitha angukhiye: Kuphumelele ubudlelwano kuya ngokulawulwa okuqondile kwe amapharamitha ahlanganisa (Force, amandla, isikhathi) enzelwe izinto ezithile ezisetshenziswayo.
• Ukwethembeka kuyikho konke: Ukusebenza kwesikhathi eside kwe isibopho sentambo Ithonya izici eziningi, kufaka phakathi ikhwalithi ebonakalayo, ukulawulwa kwenqubo, kanye nezimo zemvelo.
• Ubuchwepheshe obufakazelwe: Naphezu kweminyaka yawo, isibopho socingo ihlala iyinhlangano evelele futhi ebaluleke kakhulu ukuxhuma ubuchwepheshe ku i-semiconductor Umhlaba ngenxa yokuguquguquka kwawo, ukusebenza kwezindleko, kanye nerekhodi elifakazelwe.