Isikhokelo sokugqibela seTekhnoloji ye-Wire ye-Wire ye-Wire ye-Wire ye-Wire ye-Wire ye-Wire yeCond: Ukusebenzisa i-microscopic uqhagamshelo lwe-microscopic

Molo, ndinguKevin, kwaye ngaphezulu kwamashumi amabini eminyaka kwi-Electxin yeTekhnoloji ye-elektroniki, bendihlala kwaye ndiphefumla isayensi yoqhagamshelo oluncinci. Ndibe nelungelo lokusebenza kunye neenjineli eziqaqambileyo njengeMarcus eMarcus eJamani, ndibanceda basombulule i-toce enye yeengxaki ezinamandla kwi Ukupakishwa kwe-semicondcuct kunye ne-elektroniki ze-afmotive. Incoko zihlala zijikeleza kwilinye icala elisisiseko, kodwa lintsonkothileyo, itekhnoloji: i i-wire ye-wire. A i-wire ye-wire ingaphezulu nje kwencinci ucingo; Ngumbandela obalulekileyo ovumela i I-Semiconductor itshiphu Ukunxibelelana nehlabathi elingaphandle. Le Isikhokelo sokugqibela uzelwe kwezi ngxoxo. Siyakudinisa yonke I-Wire Sire Sport Inkqubo, kwiindidi ezahlukeneyo zebhondi ezisetyenzisiweyo, ukuze uqonde ukuba kuthatha ntoni ukwenza impilo egqibeleleyo, inokuthenjwa uqhagamshelo lwe Ngalo lonke ixesha.

Ithini kanye kanye inkqubo yokusebenza?

Kwinkalo yayo, I-Wire Sire Sport Inkqubo yindlela yokwenza Unxibelelwano lombane phakathi kwe I-Semiconductor itshiphu kunye nokupakishwa kwayo, okanye phakathi kwamacandelo ahlukeneyo kwiBhodi yeSekethe (I-PCB). Yicinge njenge-microscopic wiring yombane. I Inkqubo yokwenza Olu nxibelelaniso lusebenzisa indibaniselwano yoxinzelelo, ubushushu, kunye i-ultrasonic amandla okuncamathisela i-chat ucingo (ihlala incinci kakhulu kuneenwele zomntu) ukuya kumanqaku amabini, ukudala ilizwe eliqinileyo weld.

Injongo kukwenza i-metring eyomeleleyo, ethembekileyo iqhina Oko kunokuqhuba umbane kwaye kuncitshise ubushushu ngokukuko. A i-wire ye-wire yenziwa ngaphandle kokunyibilika ucingo kwingqondo yesiko. Endaweni yoko, I-Ultrasonic Energy isetyenzisiwe ukwenza intshukumo ye-scrubb ephakathi kwe ucingo kunye nomphezulu (I-Bond pad). Esi senzo sicoca ungcoliseko kwaye ivumela iiatom ze ucingo kwaye i iphedi Ukuza kudibana ngokusondeleyo, ukwenza i-stirable iqhina. Le ndlela yokulawulwa ilawulwa kakhulu yi-backnene yale mihla Umzi mveliso we-semicondcuctor, yenza ukuba ukupakishwa okuntsonkothileyo kunye nokupakisha okuncinci kweziphatho ezihlanganisiweyo zanamhlanje.

Zeziphi iintlobo eziphambili zendlela yokubonisa?

Ngelixa injongo ihlala ifana-ukudala umbane othembekileyo iqhina-Izi ngeendlela ezimbalwa ezahlukeneyo zokufika apho. I Iindidi zentambo zihlulelwe ngokubanzi yimo yokuqala iqhina kunye nohlobo lwesixhobo esisetyenzisiweyo. Ababini babalaseleyo Iindlela zokubonisa zezi:

1. Ibhola iBhola: Le yeyona ixhaphakileyo indlela yokubonisa indlela. Iqala ngokunyibilika isiphelo se ucingo nge-spark yombane ukwenza ibhola encinci. Le bhola icinezelwe kwi I-Bond pad ye itshiphu ukwenza I-Bondy yokuqala. Umatshini emva koko ucingo kwindawo yesibini (kwi subsare okanye I-PCB) kwaye kudala i-stitch-njenge I-Bond yesibini Ngaphambi kokuba uqhume ucingo cima. Obu buchule bukhawuleze kakhulu kwaye ikakhulu zisetyenziswa I-wire yegolide kwaye ucingo lobhedu.

2. I-Wedge Bond: Kweli ndlela, ucingo icinezelwe kwi I-Bond pad kwi-engile ngesixhobo esimiweyo se-Wedge. I-ultrasonic Amandla asetyenziswa ukwenza isitayile iqhina. Umatshini emva koko uqhubela phambili iphedi kwaye uphinda inkqubo yokwenza i I-Bond yesibini. I-Wedge Bond inokwenziwa i-aluminium wire, I-wire yegolide, kwaye ucingo lobhedu, kwaye ihlala ikhethwa kwizicelo eziphezulu-frequency ngenxa yesezantsi ucingo loop Iprofayile inokufezekisa. Umahluko, owaziwa njenge I-ribbon bond, isebenzisa iribhoni yeflethi endaweni yomjikelo ucingo kwizicelo ezizodwa.

Uzikhetha njani isibango esifanelekileyo sombhobho?

I Ukukhetha ucingo sesinye sezigqibo ezibaluleke kakhulu kwi I-Wire Sire Sport Inkqubo. Ukhetho lwe Izixhobo ze-cire ichaphazela yonke into kwiindleko kwaye ukuqhubela phambili kwixesha elide ukuthembeka ye Isixhobo se-semiconductor. Izinto ezintathu eziphambili isetyenziswe kwi-wire bond yigolide, ubhedu, kunye ne-aluminium.

Njengengcali, ndihlala ndicebisa abathengi ukuba ukhetho alukhethwanga iipropathi zezinto ezibonakalayo kodwa kunye nokunxibelelana kwayo ne I-Bond pad I-metallggy kunye nenjongo yokusebenza Iimeko zeNdalo. Umzekelo, ngelixa ucingo lobhedu Inika umsebenzi ophezulu, ukulawula i I-oxidation ye-wire ifuna inkqubo ephezulu kakhulu. Kwizicelo ezininzi ezisemgangathweni, i-aluminium wire Inika isisombululo esomeleleyo nesixabisekileyo.

Kutheni le nto i-wire ibaluleke kakhulu kwibhondi ethembekileyo?

I Ububanzi beWire ayisiyo ukukhetha ngokuchaseneyo; Yiparamitha egqwesileyo ibaluleke kakhulu kwi iqhinaUmsebenzi kunye ukuthembeka. Umthubi ucingo Unokuthwala umbane ongakumbi ngaphandle kokuhamba ngokugqithileyo, owenza ukuba ibalulekile kwizixhobo zamandla kunye nokusetyenziswa kwezicelo eziphezulu zangoku. Ngokuchaseneyo, ukuxinana okuphezulu I-semiconductor chips ngepakishwe ngokuqinileyo iqhina iipads, kakhulu ucingo olucekeceke iyafuneka ukuthintela imijikelezo emifutshane.

Ngapha koko, i Ububanzi beWire Idlala indima ebalulekileyo kumatshini woomatshini we i-wire ye-wire. Umthubi ucingo ngokwendalo kudala eyomeleleyo iqhina. I i-wire ye-wire kufuneka yenziwe ngokwaneleyo ukuze ikwazi ukumelana noxinzelelo lwenkqubo yokupakisha (ngokungathi yi-oncapsual encaives) kunye ne Uxinzelelo lomatshini yemeko yazo yokusebenza. Sisebenza ngokusondeleyo neenjineli ukuba bakhethe i ucingo olugqibeleleyo Oko kulinganisa i Iimfuno zombane, ukuqina koomatshini, kunye nokunqongophala komzimba woyilo lwawo. Le yinto ephambili kuyo yenza i-bond inkqubo.

Ngaba i-wire ye-wire yenziwa njani?

Ukwenza impumelelo ucingo iqhina ngumdaniso onobungozi phakathi kwesitshixo sesithathu I-rameter ye-rameters: Nyanzela, i-ultrasonic amandla kunye nexesha. Umfundi ngamnye ulawula ezi zinto ziguqukayo ngokuchaneka okufanelekileyo ukwenza i-metrical efanelekileyo iqhina.

1. Ukunyanzelwa: I Isixhobo sokuBonelela isebenza inani elithile lamandla ocofayo ucingo ngokuchasene ne I-Bond pad. La mandla kubaluleke kakhulu ekuqinisekiseni ukunxibelelana ngokusondeleyo phakathi kwendawo ezimbini kunye nokuqalisa i iqhina inkqubo.
2. Amandla e-ultrasonic: Esi sisithako semfihlo. Ngelixa ucingo uphantsi koxinzelelo, isixhobo siyabhatala ii-frequents eziphezulu (okwesiqhelo ezingama-60-10 khz). Le i-ultrasonic Intshukumo ye-Scrubble iqhekeza izingqengqelo ze-oxide kunye nongcoliseko, ukudala iindawo ezicocekileyo zensimbi ezinokuthi ngokulula iqhina. Ikwabangela ukwahluka kweplastiki yasekhaya, eyenza ukuba i-athom yeatom.
3. Ixesha lelixeshaEli lixesha lokuba i-ultrasonic Kuyasetyenziswa amandla. Yisiqhelo nje i-milliseconds embalwa kodwa kufuneka ibe ixesha elide ngokwaneleyo ukuba ivumele i-fest kwaye yomelele iqhina ukwenza.

Ukufumana le ndlela i-realpe ibalulekile I-Bround Veed kunye nexesha elide ukuthembeka. Nakuphi na ukuphambuka kunokubangela buthathaka iqhina okanye ukonakaliswa kukuthambeka I-Semiconductor itshiphu Ngaphantsi kwe I-Bond pad.

Luthini umahluko ophambili phakathi kwe-Wedge Bonds kunye neBhola yeBhola?

Ukukhetha phakathi kweyona nto iphambili I-wire bond the theire teknologies-Ukuba njalo kwaye I-Wedge Bond-Ukuxhomekeka kwi Iimfuneko zesicelo. Ngelixa zombini yenza i-wire ye-wire, iinkqubo zazo kunye neziphumo zahlukile.

I I-Bloll Bondiquique ihlala ikhawuleza kuba isixhobo asidingi ukuba sijikeleze phakathi kwe I-Bondy yokuqala kwaye I-Bond yesibini. Isixhobo se-capillary sihamba ngqo kwaye siye kwi subsare. Oku kuyenza ukuba ihambe iye kukhetha ukukhetha ukuveliswa komqulu-mali ophezulu wezinto eziqhelekileyo. Okokuqala Ibhondi yebhola ikwanamandla kwaye ixolelwe ngokwamahluko ngaphakathi iphedi umgangatho womphezulu.

I-Wedge BondKwelinye icala, inika ukutshintsha ngakumbi. Kuba idala isitayile iqhina Kuzo zombini iziphelo, ayifuni umsila njenge Ibhondi yebhola, ivumela i-pitch ye-filari Isiphumo ucingo loop Ingagcinwa iphantsi kakhulu kwaye ifihla, nto leyo ebaluleke kakhulu kwizixhobo eziphezulu zokugcina umqondiso apho ingqibelelo ibaluleke kakhulu. Obu buchule lelona nyathelo linokwenzeka I-Aluminium Wire Bond. EDongxin, sibenza izixhobo ezichanekileyo kuzo zombini iinkqubo, kubandakanya neyethu Isixhobo se-Wedge esiSebenzayo se-Aluminium Wire Wel, eyenzelwe iimfuno ezifunwayo I-Wedge Bond kwizicelo zemoto.

Zeziphi izinto ezimisela amandla e-bondi lonke kunye nokuthembeka?

I Ukuthembeka kweebhondi zengcingo yeyona ndlela iphambili yokuphumelela. I-AT iqhina Inokunikezela ngesixhobo esingento yanto. I amandla eBondo kwaye intsebenzo yexesha elide ichukunyiswe sisininzi sezinto, ezinamava injineli kufuneka ilawule ngononophelo.

• Umgangatho we-Bod Pad: I I-Bond pad kwi itshiphu kwaye subsare kufuneka icoceke, ingabi naziide, kwaye ineementergy ezichanekileyo. Nawuphi na ungcoliseko unokukhokelela kubuthathaka okanye ophumelele iqhina.
• Umgangatho wocingo: Ukusebenzisa i I-wire yomgangatho ophezulu Ngobubanzi obungaguqukiyo, ubunyulu, kunye namandla ngokungathandabuzekiyo iqhina.
• I-rameter ye-rameters: Njengoko kuxoxiwe, amandla, i-ultrasonic Amandla, kunye nexesha kufuneka ibonwe ngokugqibeleleyo okhethekileyo Izixhobo ze-cire, ububanzi, kwaye I-Bond pad izixhobo.
• Iimeko zeNdalo: Izinto ezifana nobushushu kwaye umswakama inokuchaphazela i iqhina ixesha elidlulele. Umzekelo, indibaniselwano ye i-aluminium wire kwaye igolide Iipads zinokukhokelela ekusekweni kwee-Brittle Metric (zihlala zibizwa ngokuba "sisifo se-purple") kubushushu obuphezulu, onokubangela i iqhina ukusilela.
• Uxinzelelo lomatshini: I ucingo loop Ubume kunye nokuphakama kufuneka kulawulwe ukuqinisekisa i i-wire ye-wire inokumelana noxinzelelo lwe-engection kunye nebhayisikile ye-thermal ngaphandle kokudinwa.

Kutheni ucingo lusengqiqweni luseyindlela ephambili namhlanje?

Kumzi mveliso ochazwe ngotshintsho olukhawulezileyo, I-wire bond ihlale ingumchwetheza we-Interconter obalaseleyo kangangesithuba seminyaka engama-50. Kukho izizathu ezininzi zokuphumelela kwayo. Ekuqaleni, I-wire inikezela ukuguquguquka okukhulu. Inokuqhagamshela iipads kwiindawo eziphakamileyo ezahlukeneyo kunye nee-angles, i-feat enzima kwezinye itekhnoloji efana-itshiphu.

Okwesibini, isebenza kakubi. Iziseko zophuhliso kunye nolwazi I-wire bond zivuthiwe kwaye zibanzi, zenza ukuba lolona sisombululo sezoqoqosho kwisicelo esikhulu sezicelo. Ekugqibeleni, yayo ukuthembeka iqinisekisiwe. Xa sele senziwe ngokuchanekileyo, unxibelelwano lwe-Wire bangomelele kakhulu kwaye banezigidi zeengoma zokubeka amawaka ezigidi zezixhobo, ukusuka kumthengi olula i-elektroniki Iinkqubo ezibaluleke kakhulu kwi-aerospace kunye namayeza. Ngelixa itekhnoloji entsha ivela, I-wire bond ibalulekile kunye nenxalenye engenakuphikiswa ye Ukupakishwa kwe-semicondcuct imbonakalo yomhlaba.

Yeyiphi imiceli mngeni eqhelekileyo kwi-wire wire wire?

Ngaphandle kokukhula kwayo, I-Wire Sire Sport Inkqubo ayikho ngaphandle kwemiceli mngeni. Ukufezekisa okugqibeleleyo iqhina Ngalo lonke ixesha, ngakumbi kwisantya esiphezulu, kufuna ukuqhubeka nokuhlala nokulawula. Enye yeentshaba ezinkulu zendlela elungileyo iqhina ungcoliseko kwi I-Bond pad. Nditsho nomaleko we-microscopic yeoyile okanye i-oxide inokuthintela i-metsernuld efanelekileyo iqhina ukuyeka. Yiyo loo nto iimeko ezicocekileyo kunye nokuphatha ngokufanelekileyo kwezinto ezibaluleke kakhulu Ukuvelisa i-PCB.

Omnye umngeni kukunxiba isixhobo. I Isixhobo sokuBonelela, nokuba ngumtshato okanye i-capillary, inxibe ngexesha. Oku kunxiba kunokuchaphazela ubume be iqhina kwaye ukhokele kwiziphumo ezingahambelaniyo. Ukuhlolwa rhoqo kunye nokutshintshwa kwezixhobo kubalulekile. Okokugqibela, qhubela phambili, apho I-rameter ye-rameters ngokuthe ngcembe ukutshintsha ngokuhamba kwexesha ngenxa yokunxiba koomatshini okanye utshintsho lwendalo, lunokuba nefuthe Umgangatho webhondi. Kungenxa yeso sizathu le nto ukungena kwedatha kunye nenkqubo yeenkcukacha-manani kugxininiswa ngokugcina umsebenzi we-seivel.

Ungayilungisa njani indlela yakho yokubonisa isivuno esikhulu?

Njengomntu onceda abathengi lungiselela Iinkqubo zabo, ndiyakholelwa ukuba impumelelo yehla kwindlela ebanzi. Okokuqala, qala ngezinto ezilungileyo. Oku kuthetha ukusebenzisa ubunyulu obuphezulu ucingo Ukusuka kumthengisi odumileyo onjengethu Umgangatho ophezulu wexabiso le-Germamy I-Aluminum ye-Aluminum Bound Wire / Ribbon / Rist kunye nokuqinisekisa ukuba I-semiconductor chips kwaye amantshontsho acocekile, ayaguquguquki iqhina iipads.

Okwesibini, tyala imali ekumgangatho ophezulu kwaye uyigcine ngokudibeneyo. Isixhobo esichanekileyo njengawethu Umenzi woMvelisi wobomi obude bobudala boomatshini abanokuthengiseka kwi-Wire ye-Wire ye-Wire ye-Viove Wedge Wedge Bondge Unokwenza umahluko obalulekileyo iqhina Ukungaguquguquki kunye nesixhobo sobomi. Okwesithathu, yenza inkqubo engqongqo yenkqubo. Sukusebenzisa nje useto olungapheliyo lovelisi. Kufuneka uvavanye I-rameter efanelekileyo Kwisicelo sakho esithile sokudala iwindow enokubakho enokwenzeka. Okokugqibela, ukumiliselwa kwenkqubo ye -obhost. Sebenzisa izinzwa ezenziwe ngomatshini kunye neemvavanyo zexesha elizayo (njengexesha lovavanyo lodonga) ukuqinisekisa ukuba inkqubo yakho ihlala ilawula kwaye wakho iqhina Umgangatho awusoze ubonakale.

Iqhosha lezitshixo

I i-wire ye-wire licandelo elincinci ngoxanduva olubalulekileyo. Ukusebenzisana le teknoloji yeyona nto iphambili ekuveliseni izixhobo ezinokuthenjwa kunye nokusebenza kakuhle kwe-elektroniki. Nazi ezona zinto zibalulekileyo ekufuneka uzikhumbule:

• Isiseko: I-wire bond yinkqubo yoqinileyo-yombuso esebenzayo i-ultrasonic Amandla, amandla, kunye nexesha lokudala unxibelelwano lombane.
• Iindidi eziphambili: Ezimbini eziphambili Iindlela zokubonisa zikhona Ibhola iBhola (ngokukhawuleza, ixhaphakile kwigolide / yobhedu) kwaye I-Wedge Bond (bhetyebhetye, iyimfuneko kwi-aluminium).
• Imicimbi yezinto ezibonakalayo: Ukhetho lwe Izixhobo ze-cire-Emilebe, ubhedu, okanye i-aluminium-sisigqibo esibalulekileyo soyilo esixabisa iindleko, ukusebenza, kunye ukuthembeka.
• I-parameters sisitshixo: Impumelelo iqhina kuxhomekeke kulawulo oluchanekileyo lwe I-rameter ye-rameters (Amandla, amandla, ixesha) alungelelaniswe nezinto ezithile ezisetyenziswayo.
• Ukuthembeka yiyo yonke into: Ukusebenza kwexesha elide kwe i-wire ye-wire Iphenjelelwa zizinto ezininzi, kubandakanya umgangatho wezinto eziphathekayo, ulawulo lwenkqubo kunye neemeko zokusingqongileyo.
• Itekhnoloji eqinisekisiweyo: Nangona bekwiminyaka yobudala bayo, I-wire bond ihlala iyinto ephambili kwaye ingenakuphikiswa uqhagamshelo lwe Itekhnoloji kwi I-Semiconductor Ilizwe ngenxa yokuguquguquka kwayo, ukusebenza kweendleko, kunye nengxelo eqinisekisiweyo.