Iyo yekupedzisira gwara kune waya bond tekinoroji: Mastering iyo microscopic interconnection

Mhoro, ndiri Kevin, uye kwemakumi maviri emakore kuDongxin Electronic tekinoroji, ndakararama uye ndakafema sainzi yemifananidzo. Ndakave neropafadzo yekushanda pamwe neinjiniya yakajeka saMarcus kuGermany, ichivabatsira kugadzirisa zvimwe zvezvipingamupinyi zvakanyanya mukati Semiconductor Packing uye emagetsi emagetsi. Hurukuro dzinogara dzichienda kune imwe yakakosha, asi yakaoma kwazvo, tekinoroji: The Wire Bond. A Wire Bond zvinopfuura kungova zvidiki waya; Iyo inonyanya kukosha hupenyu hunobvumira a semicononductor chip kutaura nenyika yekunze. Izvi Yekupedzisira Gwara anozvarwa kubva kune izvo hurukuro. Tichakurumidza kudzora zvese Wire Boging Process, kubva kumhando dzakasiyana dzezvisungo kumidziyo inoshandiswa, saka iwe unogona kunzwisisa zvazvinotora kuti ugadzire zvakakwana, wakavimbika Kubatana imwe neimwe nguva.

Chii chaizvo chinonzi waya yekubatira maitiro?

Padziri, Wire Boging Process inzira yekugadzira Kubatana kwemagetsi pakati a semicononductor chip uye kurongedza kwayo, kana pakati pezvikamu zvakasiyana pabhodhi redunhu (PCB). Funga nezvazvo seMicroscopic yemagetsi Wiring. The the maitiro ekugadzira Izvi zvinongedzo zvinoshandisa musanganiswa wekumanikidzwa, kupisa, uye Ultrasonic simba rekubatanidza zvakanaka kwazvo waya (kazhinji yakaonda kupfuura bvudzi revanhu) kune maviri mapoinzi, kugadzira yakasimba-nyika weld.

Chinangwa ndechekugadzira yakasimba, yakavimbika metallurgical chisungo izvo zvinogona kuitisa magetsi uye kusanganisa kupisa zvinobudirira. A Wire Bond inoumbwa isina kunyungudika waya mune zvetsika pfungwa. Pachinzvimbo, Ultrasonic simba inoshandiswa kugadzira kufamba kwekupaza pakati pe waya uye pamusoro (Bond Pad). Ichi chiitiko chinobvisa zvisikwa zvinobva zvinobvumira maatomu e waya uye pad kusvika pakubata kwepamoyo, kuumba musimboti chisungo. Iyi nzira inodzorwa kwazvo ndiyo musana weiyo yemazuva ano Semiconductor Indasitiri, Kugonesa iyo yakaoma uye yakaomeswa kurongedza kwenyika dzanhasi dzakabatanidzwa.

Ndeapi marudzi makuru eaya waya marongero ekubatanidza maitiro?

Nepo chinangwa chiri nguva dzose zvakafanana-kugadzira emagetsi akavimbika chisungo-Iri ndedzimwe nzira dzakasiyana siyana kusvika ikoko. The the Mhando dzeWire Kubatira zvinowanzo kusiyaniswa nechimiro chekutanga chisungo uye mhando yechishandiso inoshandiswa. Iyo mbiri inonyanya kutevedzera Wire Boging Techniquees nde:

1. Bhora Bland: Izvi zvinonyanya kuitika Wire Boging nzira. Inotanga nekunyungudika kuguma kwe waya neyemagetsi spark yekuumba bhora diki. Bhora iri rinobva rakatsikirirwa pane Bond Pad ye chip kugadzira iyo Chekutanga Bond. Muchina wobva waisa waya kunzvimbo yechipiri (pane substrate kana PCBuye uye inogadzira stech-senge Chisungo chechipiri usati wabvarura waya off. Iyi nzira iri kukurumidza kwazvo uye inonyanya kushandiswa ne Goridhe Wire uye Copper waya.

2. Wedge Bhuku: Mune iyi nzira, iyo waya inokanganiswa ne Bond Pad pane angle neyakagadzirirwa chivakwa. Ultrasonic simba rinoshandiswa kugadzira stitch chisungo. Muchina wobva waenda kune wechipiri pad uye inodzokorora maitiro ekugadzira iyo Chisungo chechipiri. Wedge Bhuku inogona kuitwa ne Aluminium Wire, Goridhe Wire, uye Copper waya, uye inowanzo sarudza yakakwira-frequency application nekuda kweiyo yepazasi Wire loop mbiri inogona kuita. Kusiyana, kuzivikanwa se ribhoni kubatana, inoshandisa ribbon flat panzvimbo yekutenderera waya Zvekushandisa nyanzvi.

Unosarudza sei iyo chaiyo yaya waya yechisungo?

The the kusarudzwa kwe waya ndechimwe chezvakanyanya kutsoropodza sarudzo mu Wire Boging Process. Sarudzo ye Wire zvinhu zvinokanganisa zvese kubva pamubhadharo uye Kuita kusvika pakureba-kwenguva kuvimbika ye Semiconductor mudziyo. Zvishandiso zvitatu zvekutanga Inoshandiswa mu waya yekubatanidza ndiro ndarama, mhangura, uye aluminium.

Semunyanzvi, ini ndinowanzo kuraira vatengi kuti sarudzo haisi yezvinhu zvemuzvinyorwa asiwo kudyidzana kwaro ne Bond Pad Metallurgy uye iyo yakarongedzwa kushanda mamiriro ekunze. Semuenzaniso, nepo Copper Wire Kubatira inopa mashura ekuita, kutonga iyo oxidation ye waya inoda maitiro akanyanya kufambira mberi. Kune akawanda manyorerwo ekushandisa, Aluminium Wire inopa simba rekubwinya uye rinobudirira.

Nei iyo waya yewaya yakanyanya kukosha kuti chisungo chakavimbika?

The the waya diamita haisi sarudzo yekupokana; Iyo injimendi yeinjiniya yakaoma kune iyo chisungokuita uye kuvimbika. Dhiji waya Inogona kutakura mamwe magetsi emagetsi pasina kufararira, zvichiita kuti zvive zvakakosha pamidziyo yemagetsi uye zvikumbiro zvine zvazvino zvinodikanwa zvazvino. Zvekare, kune yakakwirira-density semicononductor machipisi ine yakarongedzwa yakasimba chisungo mapads, a chaizvo yakaonda waya inodiwa kudzivirira nzvimbo pfupi.

Uyezve, iyo waya diamita anotamba basa rakakosha musimboti weiyo Wire Bond. Dhiji waya zvakasikwa zvinogadzira yakasimba chisungo. The the Wire Bond inofanira kusimba zvakakwana kuti ishandise kushushikana kweiyo nzira yekuisa (kunge mold encapsiulation) uye iyo Simba rekushushikana yenzvimbo dzaro dzekuvhiya. Isu tinoshanda padhuze neinjiniya kusarudza iyo WOREITAL WIRE izvo zviyero izvo zvemagetsi zvinodiwa, mashandiro emuchina, uye zvipinganidzo zvepanyama zvegadziriro yavo. Ichi chinhu chakakosha simbisa kusungwa maitiro.

Wire yakasimba ye waya yakasimba yakaumbwa sei?

Kugadzira kubudirira waya chisungo Dhanzi inonetesa pakati pekiyi nhatu Kuronga paramita: Simba, Ultrasonic simba, uye nguva. A rwiyo rwemazuva ano runodzora izvi zvinoshanduka zvine mukurumbira nekunyatsojeka kuumba metalluriki yakakwana chisungo.

1. Bonding Simba:The Bonding Tool Inoshandisa huwandu hwakasarudzika hwesimba kudzvanya iyo waya zvinopesana naIshe Bond Pad. Iri simba rakakosha kuti uve nechokwadi chepedyo kubata pakati pezvikamu zviviri uye kutanga chisungo maitiro.
2. Ultrasonic Energy: Izvi ndizvo zvakavanzika zvinangwa. Nepo waya iri pasi pekumanikidzwa, chishandiso chinobveza pamigwagwa mikuru (kazhinji 60-120 KHz). Izvi Ultrasonic Kukanda chiito kunopwanya marara exide chisungo. Izvo zvakare zvinokonzeresa kupurasitiki kwepurasitiki kuraswa, izvo zvinofambisa kutapurirana kwemaatomu.
3. Bond nguva: Iyi ndiyo nguva iyo iyo simba uye Ultrasonic simba rinoshandiswa. Izvo zvinowanzo kungova mamirioni mashoma asi unofanirwa kunge uri kure zvakakwana kuti ubvume zvakakwana uye kuropa chisungo kuumba.

Kuwana iyi yekubheka kurudyi kwakakosha kune yakakwira kurongedza goho uye kwenguva yakareba kuvimbika. Chero kutsauka kunogona kuguma neisina kusimba chisungo kana kukuvara kune iyo inonetesa semicononductor chip pasi pe Bond Pad.

Ndeapi misiyano yakakosha pakati peWedge Blands uye bhora bland?

Sarudzo pakati pezviviri zvikuru Wire Kubatira Technologies-Ball uye Wedge Bhuku-Noften zvinoenderana ne zvinodiwa zvekushandisa. Nepo vese vanogadzira a Wire Bond, maitiro avo nemhedzisiro yavo zvakasiyana.

The the Bhora Bland Technique inowanzokurumidza nekuti chishandiso chacho hachichadi kutenderera pakati pe Chekutanga Bond uye Chisungo chechipiri. Chishandiso che capillary chinofamba chakananga kumusoro uye pamusoro pe substrate. Izvi zvinoiita kuti vaende - kusarudza kune yakakwirira-vhoriyamu kugadzira kwezvinhu zvakajairika. Yekutanga BALL BCHAS zvakare yakasimba uye inokanganwira kusiyana-siyana mukati pad mamiriro emusoro.

Wedge Bhuku, kune rumwe rutivi, inopa kuwedzera kuchinjika. Nekuti inogadzira stitch chisungo Pamapeji ese maviri, hazvidi muswe kunge a BALL BCHAS. Zvinokonzerwa Wire loop inogona kuchengetwa yakaderera kwazvo uye yakatsetseka, iyo yakakosha kune yakakwirira-frequency michina iyo yekuvimbika chiratidzo iri kutendeka. Iyi nzira zvakare ndiyo chete sarudzo inoshanda ye Aluminium Wire Kubatira. KuDongxin, isu tinogadzira zvishandiso zvekushandisa pane ese maitiro, kusanganisira yedu Yakagadzirirwa Wedge Bonding chishandiso chealuminium wire welding auto michina, iyo yakagadzirirwa kuti zvive zvinodikanwa zve Wedge Bhuku mune zvemotokari zvinoshandiswa.

Ndezvipi zvinhu zvinoziva kushandira kusungwa kwakazara uye kuvimbika?

The the Kuvimbika kweiyo Wire Zvisungo ndiyo yekupedzisira chiyero chekubudirira. Imwe chete yakundikana chisungo inogona kupa chishandiso chose chisingabatsiri. The the Bond Simba uye kuita kwenguva refu kwakakurudzirwa nehuwandu hwezvinhu, izvo zvine ruzivo Injiniya inofanira kunyatsogona kubata.

• Bond Pad mhando:The Bond Pad pane chip uye substrate Inofanirwa kuve yakachena, isina yemhando yemhando, uye ine chaiyo simbi yekuremerwa. Chero kusvibiswa kunogona kutungamira kune isina kusimba kana yakundikana chisungo.
• Wire mhando: Uchishandisa a Wire-mhando waya neyakawirirana dhayamita, kuchena, uye simba ndere isingataurike kune yakavimbika chisungo.
• Kuronga paramita: Sezvakakurukurwa, simba, Ultrasonic simba, uye nguva inofanirwa kuve yakakwana kuitiswa kune yakatarwa Wire zvinhu, dhayamu, uye Bond Pad zvishandiso.
• Mamiriro ekunze: Zvinhu sekupisa uye mwando inogona kukanganisa iyo chisungo kupfuuridza nguva. Semuenzaniso, kusanganiswa kwe Aluminium Wire uye goridhe mapads anogona kutungamira kune kuumbwa kweBrittle Intermetallics (anowanzonzi "denderedzwa repepuru") pakupisa kwakanyanya, izvo zvinogona kukonzera iyo chisungo kukundikana.
• Simba rekushushikana:The Wire loop chimiro uye kukwirira kunofanirwa kudzorwa kuti uve nechokwadi Wire Bond inogona kutsungirira kushushikana kwekushayikwa uye kuputika kwemasumbu pasina kupera simba.

Nei waya kusungwa kuchine hunyanzvi hwekumanikidza nhasi?

Mune indasitiri yakatsanangurwa nekukurumidza shanduko, Wire Kubatira yakaramba iri yakakosha kasimusi tekinoroji yemakore anopfuura makumi mashanu. Pane zvikonzero zvinoverengeka zvekubudirira kwayo kwekutsungirira. Chekutanga, Wire Boging inopa zvinoshamisa zvinoshanduka. Inogona kubatanidza mapads pamakona akasiyana uye angles, a feat iyo yakaoma kune mamwe matekinoroji kunge flip-chip.

Chechipiri, iyo inonakidza-inoshanda-inoshanda. Iyo infrarture uye ruzivo rwe Wire Kubatira Vakura uye vanokuparidza, vachiita iyo inonyanya kugadzirisa mhinduro yehuwandu hwakakura hwekushandisa. Pakupedzisira, kuvimbika zvinoratidzwa. Kana wapedza nemazvo, Wire Kubatanidza kubatana vari kusimba zvakanyanya uye vane track rekodhi yekudziya mabhiriyoni emidziyo, kubva kumutengi ari nyore Electronics kune masisitimu ekutsoropodza muEerospace uye mushonga. Nepo nyowani nyowani ichinge yabuda, Wire Bonding ndeye yakakosha uye chinongedzo chikamu che Semiconductor Packing Landscape.

Ndezvipi zvinetso zvakajairika mune waya yekubatanidza maitiro?

Kunyangwe kukura kwayo, Wire Boging Process hapana matambudziko. Kuzadzisa yakakwana chisungo Pese pese, kunyanya pakumhanya kwakanyanya, kunoda kusvinura nguva dzose uye kudzora maitiro. Mumwe wevavengi vakuru vezvakanaka chisungo kusvibiswa pane Bond Pad. Kunyangwe iyo microscopic lafuta kana oxide inogona kudzivirira yakafanira metallurgical chisungo kubva pakugadzira. Ichi chikonzero nei mamiriro ekunatsa uye nekubata kwakakodzera kwekubata kwakakosha mukati PCB Kugadzira.

Rimwe dambudziko ndeye chishandiso kupfeka. The the Bonding Tool, nyangwe wedgere kana capillary, anopfeka nekufamba kwenguva. Kupfeka uku kunogona kukanganisa chimiro che chisungo uye tungamira kumhedzisiro isingaenderane. Kugara uchiongorora uye kutsiva kwezvishandiso zvakakosha. Pakupedzisira, process Drift, kupi Kuronga paramita zvishoma nezvishoma shanduko pamusoro pekutevera kwemuchina kupfeka kana shanduko yezvakatipoteredza, inogona kukanganisa Bond mhando. Ichi chikonzero nei data danho uye maitiro ekugadzirisa maitiro akakosha kuti arambe ari mukuru wekubhadhara.

Ungaita sei kuti uwedzere hunyanzvi hwekubatanidza kwehunyanzvi hwekubereka?

Semunhu anobatsira vatengi Optimize Maitiro avo, ini ndinotenda kubudirira kunouya pasi nzira yeHolistic. Kutanga, tanga nezvakanakisa zvinhu. Izvi zvinoreva kushandisa yakanyanya-yekuchena waya kubva kumutengesi ane mukurumbira kunge wedu High Quality Yakaderera Mutengo Germany Inopinza Aluminium Bonding Wire / Ribbon / Strip uye simbisa yako semicononductor machipisi uye substrates ine yakachena, inowirirana chisungo Pads.

Chechipiri, inoisa mari mune yakakwirira-mhando yekushandisa uye kuichengeta zvine hunyanzvi. Chishandiso chaicho chakafanana nedu Original Mugadziri akareba hupenyu hwekubatanidza Machine Machina Anodzvanya Bopper Wire V Groove Wedge Bond inogona kuita mutsauko wakakosha mu chisungo Kuenderana uye hupenyu hwezvishandiso. Chetatu, itai righrous maitiro maitiro. Usangoishandisa iyo yekugadzira iyo yekugadzira zvinhu. Iwe unofanirwa kuedza kuedza Yakakwana kurongedza parameter Kune yako chaiyo application yekugadzira yakanyanya kuwedzeredzwa gwaro rwindo. Pakupedzisira, kuita basa rekudzosana rekumanikidza. Shandisa iyo yemuchina yakavakirwa-muyedzo uye nguva nenguva yekuparadzira (seye waya yekudhura bvunzo) kuti ive nechokwadi chekuti maitiro ako anoramba ari mukutonga uye yako chisungo Hunhu hachizombosimbirira.

Key Deaaroways

The the Wire Bond chikamu chidiki chine mutoro wemukati wekutakura. Kusimbisa iyi tekinoroji ndiyo kiyi yekugadzira yakavimbika uye yakakwirira-kuita zvigadzirwa zvemagetsi zvigadzirwa. Hechino zvinhu zvinonyanya kukosha kuti urangarira:

• Nheyo: Wire Kubatira is a solid-state testing maitiro anoshandisa Ultrasonic simba, simba, uye nguva yekugadzira magetsi ekubatana.
• Mhando huru: Iyo mbiri yekutanga Wire Boging Techniquees vari Bhora Bland (Fast, yakajairika yegoridhe / mhangura) uye Wedge Bhuku (inoshanduka, inodikanwa kune aluminium).
• NYAYA DZESVONDO: Sarudzo ye Wire zvinhu-Gold, mhangura, kana aluminium-isarudzo yakaoma dhizaini inodhura mari, kuita, uye kuvimbika.
• Parameter ndiyo kiyi: Kubudirira chisungo zvinoenderana nekudzidziswa chaiko kwe Kuronga paramita (simba, simba, nguva) yakagadziriswa kune izvo zvinhu zvakananga zvinoshandiswa.
• Kuvimbika ndiko zvese: Kureba kwekuita kweiyo a Wire Bond inokurudzirwa nezvinhu zvakawanda, kusanganisira zvemhando yepamusoro, kugadzirisa kudzora, uye mamiriro ezvinhu emunharaunda.
• Technology Inotsanangurwa: Pasinei nezera rayo, Wire Kubatira anoramba ari mukuru uye akakosha Kubatana tekinoroji mu semicononductor Nyika nekuda kwekuchinjika kwayo, zvinodhura-kushanda, uye zvinoratidzwa track rekodhi.