Ukungena okujulile ku-Wire Bonding: Ukuqonda izinhlobo zocingo namasu ku-elekthronikhi yanamuhla

Sawubona, nginguKevin, naku-Dongxin Technology, izinsuku zami zisetshenziselwa ukuxoxa ngomhlaba omncane we-microscopic nonjiniyela afana noMarcus abavela embonini yezimoto zaseJalimane noma abacwaningi abaholayo abavela eJapan i-semiconductor Umkhakha. Sikhuluma ngokubekezelelana kukalwa ngama-micron kanye nesayensi yezinto ezibonakalayo egcizelela wonke umhlaba wedijithali. Enye yezinto ezibucayi kakhulu, kepha ezivame ukunganakwa, izingxenye ezikuleli zwe zithobekile isibopho sentambo. Lezi zintambo ezincane ze uwaya Ingabe izimpilo zabantu bonke ngaphakathi kwayo yonke i-microchip, yonke i-LED, nayo yonke imodyuli yamandla. Ukuqonda okuhlukile Izinhlobo ze-Wire Bonding futhi ukhethe okulungile Uhlobo lwe-wire akuyona nje umsebenzi wokufunda; kubalulekile ekwakheni okuthembekile, okuphezulu Ama-Electronics. Le ndatshana ingeyenjiniyela onelukuluku kanye nochwepheshe abakhiqizayo abafuna ukubukeka bajule kulobu buchwepheshe obudingekayo. Sizohlola i- Umhlaba we-Wire Bonding, kusuka ezinqubweni ezibalulekile ezintweni zokwakha ezenza konke kungenzeka.

Iyiphi inqubo yokubopha isigqila e-semiconductor?

Ukubopha ngentambo kubalulekile inqubo esetshenziselwa ukwenza Ukuxhumeka ngogesi phakathi kwe i-semiconductor die (i-microchip) kanye nokupakishwa kwayo, noma phakathi kwama-chip amaningi. Cabanga ngakho njengesinyathelo sokugcina ekwenzeni i-chip functional. Le khasi Inqubo Yokubopha Nge-Wire isebenzisa okuncane, okumsulwa kakhulu uwaya Ukwakha lezi zixhumanisi, ukuxhuma ama-microscopic I-Bond Pad Ku-chip kuya ezihosheni ezinkulu zohlaka lwephakeji ozogcina ukuxhuma ebhodini lesekethe. Lokhu kuxhumana kubalulekile ekudluliseni amandla nedatha ku-A kuphume ku Idivaysi ye-semiconductor.

Le khasi inqubo ifaka phakathi usebenzisa umshini okhethekile-a uwaya Bonda - esebenzisa inhlanganisela yokushisa, ingcindezi, kanye namandla e-ultrasonic ukwakha ama-welve-wombuso wombuso kuwo womabili ama-Exs a uwaya. Lokhu kudala ukuxhumana okuqinile, okuthembekile ngaphandle kokuncibilikisa izakhi ezibucayi. Umgomo we Inqubo Yokubopha Nge-Wire Ukwakha izinkulungwane zalokhu kuxhuma kudivayisi eyodwa, yileso naleso sinye siphelele, ukuqinisekisa ukuthi umkhiqizo wokugcina usebenza ngokunganaphutha. Isibopho sentambo kuyinqubo ebalulekile inqwaba enkulu ye Ukupakishwa kwe-semiconductor kwenziwe namhlanje.

Yiziphi izinhlobo eziphambili zamasu wokubopha ngocingo?

Ngenkathi umgomo uhlala unjalo - ukudala ukuxhumana okuqinile kagesi - kukhona okuqala okuyisisekelo Izinhlobo ze-Wire Bonding Amasu asetshenziswe embonini: ukubopha ibhola na- hlanganisa isibopho. Ukukhetha phakathi kwabo kuncike ku- isicelo, izinto ezihilelekile, kanye nefomu lefomu elidingekayo.

1. Ukubopha ibhola: Lokhu kungcono kakhulu Kusetshenziswe Kakhulu I-Bonding Technique, accounting for 90% wabo bonke isibopho sentambo ukuxhumana. Kuyashesha futhi kuvumelana nezimo ngokwesiko lokuqondisa ngesibopho. Inqubo iqala ngokuncibilika ukuphela kocingo ukwakha ibhola elincane, elinamathiselwe ku-chip I-Bond Pad.
2. Hlanganisa isibopho: Le ndlela isebenzisa umdwebo we-wedge Ithuluzi Lokubopha ukucindezela i- uwaya ngokumelene ne I-Bond Pad futhi wakha okufana nokufana ubudlelwano. Akukhe ibhola. Hlanganisa isibopho kuvame ukusetshenziselwa izinhlelo zokusebenza ezidinga iphrofayili ephansi (ngaphansi I-Wire Loop Ukuphakama) noma ukubopha nge I-Aluminium Wire, okungakha ibhola kalula njengegolide.

Womabili amasu anendawo yawo enamuhla Ama-Electronics ekwenziweni. Ukubopha ibhola yi-Workorse yokukhiqiza ivolumu ephezulu, ngenkathi hlanganisa isibopho Ingabe isisombululo esikhethekile sezinselelo ezithile, ikakhulukazi kumadivayisi wamandla kanye nezicelo ezinhle kakhulu. Lezi izinhlobo ezimbili zocingo Izindlela zokubopha zibusa imboni.

Yiziphi izinto ezibalulekile ezisetshenziswayo ezivuneni ngocingo futhi ngani?

Ukukhethwa kwe impahla ye-wire kuyinto ebucayi Isici se-wire bonding inqubo. Le khasi Izinto ezisetshenziswa eBonding Wire kumele ube nokuhle kakhulu Ukusebenza kukagesi nokwe-Thermal, yiba nokumelana nokugqwala, futhi usebenze ngokwanele ukwakha okuthembekile ubudlelwano. Izinto ezintathu zilawula isimo sezwe.

I-Gold Wire kabanzi wamukelwa njengokukhethwa kweprimiyamu futhi kwaba yinto yokuqala isetshenziswa ekubopheni ngocingo okufanele ekuthembekeni kwayo. Kodwa-ke, izindleko eziphakeme zegolide ziye zaqhubekela phambili imboni ucingo lwethusi, enikeza ukusebenza okuphakeme ngandlela thile kodwa kuyinselele enkulu ubudlelwano Ngoba i-oxidizes kalula. I-Aluminium Wire ukuhambela okusindayo uwaya Izicelo emandleni Ama-Electronics. Le khasi Ukuzikhethela kocingo ekugcineni kuncike ekuthengiseni phakathi kwezindleko, ukusebenza, kanye nezidingo ezithile ze Idivaysi ye-semiconductor.

Ngabe inqubo yokuhlanganisa ibhola empeleni isebenza kanjani?

Le khasi I-Ball Bonding Techtique kuwumbukiso othokozisayo wokunemba okusheshayo. Le khasi Inqubo Yokubopha Nge-Wire ifaka phakathi ithuluzi le-capillary lapho ucingo omncane (kaningi ucingo lwegolide noma ucingo lwethusi) Udliwa.

1. Uhlobo lwebhola: Inqubo iqala nge- "elektroniki flame-off" (efo) wand ethumela inhlansi kuya esicokeni se uwaya, ukuncibilika futhi okuvumela ukungezwani komhlaba ukwakha indawo ephelele, noma ibhola. Leli bhola livame ukufika ku-1.5 izikhathi ububanzi bentambo.
2. Isibopho sokuqala: Ithuluzi le-capillary liletha ibhola phansi lapho lifudumele I-Bond Pad ye i-semiconductor afe. Umshini usebenza inhlanganisela yamandla namandla e-ultrasonic, okwenza ibhola lisebenze futhi lakha elinamandla, lokuhlangana ubudlelwano nge pad. Lokhu kuvame ukubizwa nge-thermosonic ubudlelwano.
3. Ukwakheka kwe-loop: Umshini ube esehamba uye kwesesibili ubudlelwano indawo kufreyimu yephakheji yephakheji, yakha i uwaya kuthile I-Wire Loop iJiyomethri lapho iyahamba.
4. Isibopho sesibili (isibopho se-stitch): Endaweni yesibili, umshini wenza isiteki ubudlelwano. Icindezela i- uwaya Ngokuphikisana nohlaka oluholayo olunonqenqemeni lwethuluzi le-capillary futhi lisebenzisa amandla e-ultrasonic, ukudala enye i-weld.
5. Umsila wentambo: Ekugcineni, umshini ubopha uwaya futhi uphakamisa i-capillary, ephula uwaya Esithendeni se-stitch ubudlelwano Futhi ukuyishiya ilungele ukwakha ibhola elilandelayo.

Lo mjikelezo wonke wenzeka kuma-milliseconds, okuvumela Imishini yokubopha i-wire ukudala amakhulukhulu okuxhumeka ngomzuzwana. Inqubo esebenza kahle kakhulu esetshenziswa kakhulu ku-elekthronikhi yabathengi.

Yini eyenza i-wedge Bonding inqubo eyingqayizivele ye-bonding?

Hlanganisa isibopho kuhlukile Indlela Yokubopha lokho kusebenza ngokuhlukile kusuka ukubopha ibhola. Njengoba igama libonisa, lisebenzisa i-wedge enziwe Ithuluzi Lokubopha esikhundleni se-capillary. Le khasi uwaya kudliswa ngaphansi komphambili we-wedge. Le khasi Ukubopha kufaka phakathi Ukucindezela i- uwaya flat ngokumelene ne I-Bond Pad kanye nokusebenzisa amandla e-ultrasonic ukudala i-weld.

-Ngafani na- ukubopha ibhola, okokuqala ubudlelwano kuyinto stitch ubudlelwano, hhayi ibhola ubudlelwano. Ngemuva kokuqala ubudlelwano kwenziwa, umshini uqhubekela kwesesibili ubudlelwano indawo futhi yenza enye stetch ubudlelwano. Umehluko osemqoka lokho hlanganisa isibopho inqubo yokungalingani; Umshini kufanele uhambise ngokuhambisana ne uwaya Okuphakelayo, ukukwenza kungaguquguquki kancane kunoku ukubopha ibhola.

Noma kunjalo, hlanganisa isibopho inikeza izinzuzo ezibalulekile. Ikhiqiza iphrofayili ephansi kakhulu uwaya Ukuxhumana, okubaluleke kakhulu ngama-chip agxiliwe noma amadivaysi anezidingo eziqinile zokuthola imvume. Futhi kuyindlela ekhethwayo ye I-Aluminium Wire Bonding, ikakhulukazi nge-enkulu-ububanzi uwaya isetshenziswa kumadivayisi wamandla. Le nqubo ingenziwa nasemakamelweni okushisa (isibopho se-ultrasonic ngaphandle kokushisa okungeziwe), okubalulekile kumadivayisi abucayi bokushisa.

Kungani kukhethwa kwe-Bonding Wire kubalulekile ngekhwalithi?

Le khasi wire bonding akuyona nje umqhubi olula; Ingxenye yezobunjiniyela kakhulu ethinta ngokuqondile ukusebenza kanye nokwethenjwa kwensiza yokugcina ye-elekthronikhi. Le khasi Ukukhetha impahla ye-wire Futhi ikhwalithi yayo ibaluleke kakhulu. A ucingo olusezingeni eliphakeme kumele ube nezimpawu ezimbalwa ezibalulekile ukuze uqinisekise Izibopho ze-wire ezithembekile neziphezulu.

Okokuqala, uwaya kumele ube nobumsulwa obuhlukile. Ukungcola kungaholela ekungabonakali ubudlelwano Ukwakheka futhi kungaba ngumthombo wezinkinga ezethembekile zesikhathi eside. Okwesibili, uwaya Kufanele ube nezakhiwo zemishini ezingaguquki, kufaka phakathi amandla ashubile kanye nokugcwala. Lokhu kuqinisekisa ukuthi uwaya ayiphuli ngesikhathi esiphakeme Inqubo Yokubopha nokuthi ukwakheka kwe-loop kuyaphindwa ngaso sonke isikhathi. Le khasi ububanzi bentambo Kufanele futhi ilawulwe ekubekezelelekeni okuqinile ngokuqinile.

EDongxin, lapho sinikeza I-Aluminium Wire Emsulwa Kumakhasimende ethu, sinikezela ngezitifiketi ezinemininingwane ezibonakalayo. Onjiniyela abanjengoMarcus bathembela kule datha ngoba bayazi ukuthi ngisho nokuphambuka okuncane ku uwaya ingavala umugqa wokukhiqizwa kwezigidi eziningi amadola. Le khasi uwaya ngempela isisekelo esihle isibopho sentambo.

Yiziphi izinto eziphambili ezithonya ikhwalithi yokubopha i-wire?

Ukuthola okuphelele isibopho sentambo Njalo ngesikhathi esisodwa, izigidi zezikhathi ngaphezulu, umgomo wokugcina. Le khasi ikhwalithi yokubopha intambo kuya ngesiphazamiso esihle kakhulu sezici eziningana. Unjiniyela wenqubo kumele alawule kahle le "iresiphi" ukuthola imiphumela engaguquki.

Izici eziphambili ezithonya ikhwalithi ebonke Faka:

• Amapharamitha ahlanganisa: Lokhu kusethi yemiyalo yomshini, kufaka phakathi amandla asetshenzisiwe, inani lamandla e-ultrasonic, izinga lokushisa lokufa, nesikhathi se ubudlelwano. Lezi amapharamitha ahlanganisa kumele kwenziwe kahle ngokuqondile uwaya nezinto zokwakha ezingaphansi.
• Ikhwalithi ebonakalayo: Lokhu kufaka phakathi bobabili wire bonding kanye I-Bond Pad indawo. Le khasi uwaya kumele kube nobumsulwa obukhulu kanye nobukhulu obungaguquki, futhi amaphakethe kumele ahlanzeke futhi anawo oxides noma ukungcoliswa.
• Isimo se-Bonding Tool: I Ithuluzi Lokubopha (I-Capillary noma i-Wedge) iyingxenye esetshenziswayo eguga ngokuhamba kwesikhathi. Ithuluzi eligqokile noma elingcolile lingaholela empahleni ubudlelwano ikhwalithi noma ukulimala kokufa. Sikhiqiza amathuluzi anembile afana neyethu Ithuluzi elenziwe ngezifiso le-Welge Bonding ye-Aluminium Wire Welding auto ukuqinisekisa ukusindisa isikhathi eside nokuvumelana.
• Ukulawulwa komshini: I Imishini yokubopha ngocingo Kufanele ulinganise ngokunembile ukuqinisekisa ukuthi iletha amabutho afanele nokunyakaza.

Ukwenza kahle lezi zinto kubalulekile ku- Lungiselela Inqubo Yokubopha Nge-Wire futhi uzuze isivuno esiphakeme kakhulu nokwethembeka.

Yiziphi izinhlelo zokusebenza ezivame kakhulu zokubopha ngocingo namuhla?

Ngenkathi izimpande zalo ziku i-semiconductor imboni, the Izicelo ze-Wire Bonding bandise kakhulu. Ukubopha ngentambo kukhulu isetshenziswe kulo lonke i-spectrum ye Ama-Electronics ekwenziweni. Ungathola a isibopho sentambo Cishe noma iyiphi insiza ye-elektroniki onayo.

Ukhiye othile Izicelo zokubopha i-wire zibandakanya:

• Imijikelezo ehlanganisiwe (ics): Lokhu kuyinto yakudala isicelo, Ukuxhuma i-silicon kufa kwiphakheji kuholela ku-CPUS, Memory Chips, futhi cishe wonke amanye ama-microchips.
• Amadivayisi Amandla: Ama-Igbts, ama-Mostets, namanye ama-semiconductors anamandla ancike esindayo I-Aluminium Wire Bonding ukuphatha amasondo aphezulu.
• I-LEDS: Incane ucingo lwegolide Isetshenziselwa ukuxhuma i-chip ye-LED koxhumana nabo, inika amandla konke kusuka esikrinini sakho sefoni kuya ekukhanyiseni kwe-Stadium.
• Izithuthi Zokwe-Electronive: Amayunithi wokulawula injini, izinzwa, kanye nezinhlelo ze-infotainment zonke zincike ekuqineni isibopho sentambo Ukuxhumana ukubekezelela imvelo enolaka yezimoto.
• Amadivayisi wezokwelapha: Ama-pacemaker, defibrillators, kanye nokusetshenziswa kwemishini yokuxilonga ucingo olusezingeni eliphakeme izibopho zokwethenjwa ekugcineni.

Empeleni, noma kuphi lapho i-microchip idinga ukuxhuma emhlabeni wangaphandle, cishe uzothola ukuthi onjiniyela banayo Kusetshenziswe isibopho se-wire.

Ngabe isibopho sensimbi siqhathaniswa kanjani ne-flip-chip bonding?

Isibopho socingo Ingabe ubuchwepheshe obunamandla bokuxhumana, kepha akuyona ukuphela kwento. Enye indlela yayo eyinhloko I-Flip-chip bonding. Ngendlela ye-flip-chip, i-chip ichithwe phansi phansi, futhi ama-bumps amancane we-solder ebusweni bawo asetshenziselwa ukubopha ngqo kuya engxenyeni engezansi. Le ndlela ehluke kakhulu kusuka usebenzisa ucingo ukudala ukuxhumana.

I-Flip-chip bonding Inikeza ezinye izinzuzo ezibalulekile, ngokuyinhloko i-I / O density eningi kakhulu ye-I / O (Ukuxhumeka okuningi endaweni encane) kanye nezindlela ezimfishane zikagesi, ezithuthukisa ukusebenza kwezicelo ezisezingeni eliphakeme kakhulu. Kodwa-ke, inqubo iyinkimbinkimbi kakhulu futhi iyabiza kakhulu. Iphinde inikeze izinselelo ngokuphathwa okushisayo kanye nokuhlolwa.

Isibopho socingo, ngakolunye uhlangothi, kungubuchwepheshe obuvuthiwe obuvumelana nezimo futhi obungabizi kakhulu. Kulula ukusebenzisana futhi kufanelekile uhla olubanzi lwezicelo. Kumadivayisi amaningi, ikakhulukazi ngaphakathi Ama-elekthronikhi abathengi, izimoto, namandla Ama-Electronics, isibopho socingo Inikeza ukulingana okuphelele kokusebenza, ukuthembeka, nezindleko. Ubuchwepheshe bobabili abakhethekile; Bangamathuluzi ahlukene ezinselelo ezahlukahlukene zobunjiniyela.

Uyikhetha kanjani imishini yokubopha ye-wire wire?

Ukukhetha i- Ukubopha kwesokudla kwentambo Izinsiza kuyisinqumo esikhulu esithinta ukusebenza kahle kokukhiqiza kanye nekhwalithi yomkhiqizo. Ukukhetha kuncike ngokuphelele kwizidingo ezithile zohlelo lokusebenza. Ilebhu ye-R & D ingadinga i-bonder yencwajana eguquguqukayo, ngenkathi umugqa womhlangano omkhulu we-high-value udinga umshini ozenzakalelayo ozenzakalelayo okwazi ukusebenzisa i-24/7.

Lapho uhlola Imishini yokubopha ngocingo, cabanga ngala maphuzu:

• Ubuchwepheshe bokubopha: Ngabe udinga a ukubopha ibhola noma hlanganisa isibopho umshini? Eminye imishini ethuthukile, efana neyethu I-WS9820 I-automal automal aluminium wire wedge bonder, zikhethekile ngenxa esindayo I-Aluminium Wire, isidingo esivamile ku-EV namandla i-semiconductor Izimboni.
• Phendukela: Mangaki ama-bond ngehora? Lesi yisici esibucayi sokubala ukubuya kwakho ekutshalweni kwemali.
• Ukunemba nokuphindaphinda: Umshini kumele ukwazi ukubeka amabhondi ngokunemba okulinganiselwe kwe-micron, isikhathi nesikhathi.
• Ukuvumelana nezimo: Ngabe umshini ungaphatha osayizi abahlukile bokufa nokufa? Kulula kangakanani ukushintshela kumkhiqizo omusha?
• Ukuxhaswa kwabahlinzeki: Ngabe umphakeli uhlinzeka ngokuqeqeshwa kochwepheshe, ukusekelwa kohlelo lokusebenza, nezindawo ezitholakala kalula njenge Ummese osikiwe we-semisinum aluminium wire welding machine fnk? Umshini muhle nje njengokwesekwa ngemuva kwawo.

Ukukhetha umlingani ofanele kubaluleke kakhulu njengokukhetha umshini ofanele ukuze qinisekisa ukubopha okuguqukayo Imiphumela.

Ukuthathwa Key

The virate isibopho sentambo yiqhawe elingapheliyo elinika amandla ezimpilo zethu zedijithali. Ukufingqa ukuhlola kwethu kwalobu buchwepheshe obucayi:

• Umsebenzi we-Core: Isibopho sentambo inqubo lokho kwakha okubalulekile Ukuxhumeka ngogesi Phakathi kwe-microchip nephakeji yayo, ukunika amandla okusebenza.
• Amasu amabili amakhulu: Imboni ithembele ezindleleni ezimbili eziyinhloko: ukubopha ibhola, okusheshayo futhi okuguquguqukayo, futhi hlanganisa isibopho, okulungele iphrofayili ephansi futhi esindayo uwaya Izicelo.
• Izinto ezibalulekile: Abaningi esetshenziswa kakhulu Izinto zokwakha ze wire bonding Ingabe igolide (ukuthembeka okuphezulu), ithusi (ukuthwala okuhle kakhulu kanye nezindleko eziphansi), ne-aluminium (ekahle amadivayisi wamandla).
• Ikhwalithi ibaluleke kakhulu: Kuphumelele isibopho sentambo kuya ngenhlanganisela eqondile yenziwe kahle amapharamitha ahlanganisa, izinto zokuhlanza okuphezulu, kanye nemishini egcinwe kahle.
• Isicelo esijabulisayo: Kusuka ku-CPU kwi-laptop yakho kumamojula wamandla ngemoto kagesi, isibopho sentambo Ubuchwepheshe buyibhulokhi yokwakha eyisisekelo yesimanje Ama-Electronics.
• Ukukhetha ngokuhlakanipha: Ukukhetha kwesokudla I-Bonding Technique, impahla ye-wire, nemishini iyisinqumo sobunjiniyela esibucayi esithinta ngokuqondile ukusebenza komkhiqizo, izindleko, kanye nokwethenjwa.