Iyo yakadzika marara mu waya kusungwa: kunzwisisa mhando dze waya uye maitiro mune zvemagetsi zvemagetsi

Mhoro, ini ndiri Kevin, uye kuDongxin Electronic Tekinoroji, mazuva angu anopedzerwa achikurukura nezve mainjiniya seMarcus kubva kuGerman emotokari semicononductor chikamu. Isu tinotaura nezve mishiyuta yakayerwa muzvinyorwa uye sainzi yezvinhu inokanganisa nyika yese yedhijitari. Imwe yeanonyanya kutsoropodza, asi kazhinji kazhinji kufuratirwa, zvikamu munyika ino ndivo vanozvininipisa Wire Bond. Aya madiki madiki e waya Ndehupi mararamiro mukati mechero microchip, ese anotungamirwa, uye mwero wega wega magetsi. Kunzwisisa zvakasiyana Mhando dzeWire Kubatira uye kusarudza kodzero Rudzi rweWire Haisi kungoita muviri chete; Iyo yakakosha kugadzira yakavimbika, yakakwirira-kuita Electronics. Chinyorwa ichi ndecheinjiniya yekuda kuziva uye nyanzvi yekugadzira iyo inoda kutarisa zvakadzama muiyi tekinoroji inokosha. Tichaongorora Nyika yeWire Kubatira, kubva kumaitiro epakati kune zvigadzirwa zvinoita kuti zvese zvivepo.

Ndeipi iyo waya yekubatanidza maitiro mu semiconductor kurongedza?

Wire Bonding ndeye yakakosha maitiro anoshandiswa kugadzira Kubatana kwemagetsi pakati a semicononductor kufa (microchip) uye kurongedza kwayo, kana pakati pezvipenga akawanda. Funga nezvazvo sedanho rekupedzisira mukugadzira chip inoshanda. The the Wire Boging Process inoshandisa diki, yakachena kwazvo waya Kugadzira aya ma link, kubatanidza microscopic Bond Pad pane chop kune yakakura inotungamira yekapu yemapepa iyo inozopedzisira yabatana nedunhu redunhu. Izvi zvinongedzo zvakakosha pakuendesa simba uye data mukati nekubuda mu Semiconductor mudziyo.

The the maitiro anosanganisira Kushandisa muchina unokosha-a waya Bonder-iyo inoshandisa musanganiswa wekupisa, kumanikidzwa, uye ultrasonic simba kuumba yakasimba-state weld pamicheto waya. Izvi zvinoumba kubatana kwakasimba, kwakavimbika pasina kunyungudika zvinhu zvisina kufanira. Chinangwa che Wire Boging Process ndeyekugadzira zviuru zvezvibatanidzwa izvi pane imwechete chishandiso, imwe neimwe yakakwana, kuve nechokwadi chekuti chigadzirwa chekupedzisira chinoshanda chisina mhosva. Wire Bonding chiitiko chakakosha muhuwandu hwakawanda hwe Semiconductor Packing zvaitwa nhasi.

Ndeapi marudzi makuru eaya waya marongero ekubatanidza maitiro?

Nepo chinangwa chiri nguva dzose zvakafanana-kugadzira yakasimba yemagetsi yekubatanidza-pane maviri ekutanga Mhando dzeWire Kubatira Maitiro anoshandiswa muindasitiri: Bhora Bland uye Wedge Bhuku. Sarudzo pakati payo inoenderana ne application, zvigadzirwa zvinosanganisirwa, uye chimiro chinodiwa.

1. Bhora Bland: Izvi ndizvo zvakanyanya zvinoshandiswa zvakanyanya Kubatira maitiro, accounting kweanopfuura 90% yezvose Wire Bond kubatana. Iyo inokurumidza uye inoshanduka-shanduka maererano nekubatanidza nhungamiro. Maitiro acho anotanga nekunyungudutsa kupera kwe waya kuumba bhora diki, iro rinobva rabatanidzwa kune chip's chip Bond Pad.
2. Wedge Bhuku: Iyi nzira inoshandisa wedge-yakaumbwa Bonding Tool kudzvanya waya zvinopesana naIshe Bond Pad uye gadzira stech-senge chisungo. Izvo hazviite bhora. Wedge Bhuku inowanzoshandiswa kuti zvikumbiro zvinoda chimiro chakaderera (zvishoma Wire loop kureba) kana kuti kusungwa ne Aluminium Wire, iyo isinga gadzira bhora nyore segoridhe.

Matipi ese ari maviri ane nzvimbo yavo mune zvazvino Electronics kugadzira. Bhora Bland ndeyekushongedza kwekugadzirwa kwepamusoro-vhoriyamu kugadzirwa, nepo Wedge Bhuku Icho mhinduro yakakosha kune zvinonetsa zvakanangana, kunyanya mune zvigadzirwa zvemagetsi uye zvinoshandiswa-zvakanaka. Izvi Mhando mbiri dzeWire nzira dzekurongedza dzinotonga indasitiri.

Ndezvipi zvinhu zvakakosha zvinoshandiswa mu waya kusungwa uye nei?

Kusarudzwa kwe Wire zvinhu ndeyekutsoropodza chikamu cheiyo waya yekubatanidza maitiro. The the Zvigadzirwa zvinoshandiswa mu waya kusungwa anofanira kunge aine zvakanakisa Magetsi uye anofambisa, iva anoramba kuora, uye ivai zvakaringana kuti ugadzire yakavimbika chisungo. Zvishandiso zvitatu zvinobata mamiriro.

Wire Wire Wire inozivikanwa seyekutanga sarudzo uye yaive yekutanga zvinhu inoshandiswa mune waya kusungwa kwakakodzera kuhama dzayo. Nekudaro, mutengo wakanyanya wegoridhe watyaira indasitiri kuenda Copper waya, iyo inopa mashura mashandiro mune dzimwe nzira asi zvinonetsa zvakanyanya chisungo nekuti iyo oxid ze nyore. Aluminium Wire ndiko kuenda kunorema waya Zvikumbiro musimba Electronics. The the Sarudzo ye waya pakupedzisira zvinoenderana nekutengeserana-kubva pakati pemutengo, kuita, uye izvo zvakananga zvinodiwa zve Semiconductor mudziyo.

Maitiro ekurongedza bhora anoshanda sei chaizvo?

The the Bhora Bland Technique kuratidzwa kunonakidza kweiyo yakakwirira-kumhanya chaiyo. The the Wire Boging maitiro anosanganisira chishandiso che capillary kuburikidza neipi chaizvo yakaonda waya (kazhinji Goridhe Wire kana Copper waya) inodyiswa.

1. Bhora Kuumbwa: Iyo process inotanga ne "Electronic Flame-off" (EFO) Wand inotumira iyo Spark kune iyo tip yeiyo waya, ichivhenekera uye kubvumira kushushikana kwepasi kugadzira nzvimbo yakakwana, kana bhora. Bhora iri rakajairika 1.5 kusvika ku2,5 times the waya diamita.
2. Chekutanga Bond: Chishandiso Capillary chinounza bhora pasi pane iyo inopisa Bond Pad ye semicononductor kufa. Mushini unosanganisira kusanganiswa kwesimba uye ultrasonic simba, zvichikonzera bhora kugadzirisa uye kugadzira yakasimba, intermitallic chisungo nepad. Izvi zvinowanzodaidzwa kunzi armonic chisungo.
3. Loop kugadzirwa: Muchina wobva waenda kune wechipiri chisungo Nzvimbo papakeji inotungamira chimiro, kuumba iyo waya mune yakatarwa Wire loop geometry sezvo inofamba.
4. Chechipiri Bond (STitch Bond): Pane yechipiri nzvimbo, muchina unoita stitch chisungo. Inomanikidza iyo waya Kupesana nechimiro cheturu nemucheto kweiyo capillary chishandiso uye inoshandisa simba rekutanga, zvichigadzira imwe weld.
5. Wire muswe: Pakupedzisira, muchina unobvarura waya uye inosimudza capillary, kutyora waya pachitsitsinho chehunde chisungo uye ichisiya yakagadzirira kuumba bhora rinotevera.

Kutenderera uku kwese kunoitika mumamirimo, kubvumira Wire Boging Machina Kuti ugadzire mazana ezvekubatana pane yechipiri. Iyo inoshanda zvakanyanya maitiro inowanzoshandiswa mumutengi magetsi.

Chii chinoita kuti Wedge kuunganidza nzira yakasarudzika yekubatanidza?

Wedge Bhuku musiyano Bonding nzira iyo inoshanda zvakasiyana kubva Bhora Bland. Sezvo zita rinoratidza, rinoshandisa wedge-rakaumbwa Bonding Tool pachinzvimbo che capillary. The the waya inodyiswa pasi pemberi ye wedge. The the Kubhomba kunosanganisira kudzvanya waya flat kupokana ne Bond Pad uye kushandisa ultrasonic simba kugadzira iyo weld.

Kusiyana Bhora Bland, yekutanga chisungo iri stitch chisungo, kwete bhora chisungo. Mushure mekutanga chisungo inogadzirwa, muchina unofamba kuenda kune wechipiri chisungo Nzvimbo uye inoita imwe stitch chisungo. Mutsauko mukuru ndewavo Wedge Bhuku chiitiko chisina kujairika; Muchina unofanirwa kufamba mumutsara ne waya fudza, ichiita kuti isanyatso shandura kupfuura Bhora Bland.

Nekudaro, Wedge Bhuku inopa zvakakosha zvakanakira. Inoburitsa yakaderera-chimiro waya Kubatana, uko kwakakosha kune vakadzvanywa vakachekwa chips kana zvishandiso zvine midziyo yakasarudzika zvinodiwa. Iyo zvakare ndiyo nzira inosarudzwa ye Aluminium Wire Kubatira, kunyanya neakakura-diamita waya inoshandiswa mumidziyo yemagetsi. Maitiro acho anogona kuitwawo pamhepo tembiricha (Ultrasonic Bonding isina kuwedzera kupisa), iyo yakakosha kune tembiricha-tembiricha-inonamira zvishandiso.

Nei kusarudzwa kwekusimudzira waya kushomeka kwemhando?

The the Kuronga waya haisiri chete conductor chete; Icho chinhu chakanyanya chemajiniya chinokanganisa kuita uye kuvimbika kweiyo yekupedzisira yemagetsi kifaa. The the kusarudzwa kwe waya ye waya uye kunaka kwayo kuri kutenderwa. A Wire-mhando waya Inofanirwa kuve neyakati wandei hunhu hunhu kuve nechokwadi yakavimbika uye yakakwirira-mhando waya waya zvisungo.

Kutanga, iyo waya Inofanirwa kuve nekuchena kwakasiyana. Kusachena kunogona kutungamira kusawirirana chisungo Kuumbwa uye kunogona kuve kunobva kwakawanda kwenguva refu nyaya. Wechipiri, waya Inofanirwa kuve neyakaenderana nemakaniki midziyo, kusanganisira kusanganisa kwesimba uye elongation. Izvi zvinovimbisa kuti waya haina kupaza panguva yakakwirira-kumhanya Kubatira maitiro uye kuti chiuno choupfu chinodzokororwa nguva dzese. The the waya diamita inofanira zvakare kudzorwa kuti ishandiswe yakasimba tolerances.

KuDongxin, patinopa Yakachena aluminium waya Kune vatengi vedu, isu tinopa zvakadzama zvinyorwa zvinyorwa. Mainjiniya senge marcus anoenderana neiyi data nekuti ivo vanoziva kuti kunyangwe kutsauka kudiki mukati waya inogona kuvhara pasi mamiriyoni emadhora emadhora ekugadzira mutsara. The the waya zvirokwazvo nheyo dzechokwadi Wire Bond.

Ndezvipi zvinhu zvikuru izvo zvinokanganisa waya kugadzirwa zvine hunhu?

Kuzadzisa yakakwana Wire Bond Imwe neimwe nguva, mamirioni enguva pamusoro, ndiyo chinangwa chikuru. The the Wire Boging mhando zvinoenderana neyakagadziriswa yakajeka yezvinhu zvinoverengeka. Injiniya yekuita inofanirwa kudzora zvisina musoro "nzira" iyi yekuwana zvinoitika.

Zvinhu zvikuru zvinopesvedzera Kubatanidza mhando Sanganisira:

• Kuronga paramita: Iyi ndiyo seti yemuchina mirayiridzo, kusanganisira simba rinoshandiswa, huwandu hwesimba rekupedzisira, tembiricha yekufa, uye nguva ye chisungo. Izvi Kuronga paramita inofanira kuve yakagadzirirwa kune yakatarwa waya uye substrate zvinhu.
• Hunhu: Izvi zvinosanganisira zvese zviri zviviri Kuronga waya uye Bond Pad nzvimbo. The the waya Inofanirwa kuve yekuchena kwakanyanya uye zviyero zvinowirirana, uye mapads anofanira kunge akachena uye akasununguka oxides kana kusvibiswa.
• Bonding mudziyo mamiriro:The Bonding Tool (capillary kana wedge) chikamu chinodiwa chinopfeka nguva nenguva. Chishandiso chakapfeka kana chakasviba chinogona kutungamira kune varombo chisungo mhando kana kukuvara kune vanofa. Isu tinogadzira zvishandiso zvekushandisa senge zvedu Yakagadzirirwa Wedge Bonding chishandiso chealuminium wire welding auto michina kuve nechokwadi chekuti hupenyu hurefu uye kusawirirana.
• Muchina calibration:The Wire Boging Equipment inofanira kuve yakanyatsogadzirirwa kuve nechokwadi kuti iri kuburitsa masimba echokwadi uye mafambiro.

Kushandisa zvinhu izvi zvakakosha kuti Gadzirisa iyo waya yekubatanidza maitiro uye uwane yakakwirira kwazvo inobvumirwa uye kuvimbika.

Ndezvipi zvinonyanya kujairika zvikumbiro zveWire kulosha nhasi?

Apo midzi yayo iri mu semicononductor indasitiri, iyo Zvikumbiro zveWire Kubatanidza zvakave zvinoshamisa zvinoshamisa. Wire Bonding inowedzera yakashandiswa pane iyo yakazara spectrum ye Electronics kugadzira. Unogona kuwana a Wire Bond mune chero chero zvigadzirwa zvemagetsi zvauri iwe pachako.

Imwe kiyi Wire Boging application inosanganisira:

• Yakabatanidzwa Dunhu (ICS): Iyi ndiyo yakasarudzika application, kubatanidza silicon kufa kune iyo package inotungamira muCPUS, Memory Chips, uye dzinenge mimwe madzishe ese.
• Simba zvishandiso: Igbts, mosfets, uye mamwe magetsi emakemikari anovimba zvakanyanya Aluminium Wire Kubatira kubata yakakwira mafungu.
• Leds: Chidiki Goridhe Wire inoshandiswa kubatanidza iyo Chanyo Chant kune yayo yekubvunzana, ine simba zvese kubva kufoni yako skrini kune nhandare yemwenje.
• Zvemagetsi emagetsi: Injini Control Units, Sensors, uye infotainment masisitimu ese kuvimba nekugara Wire Bond kubatana kunotsungirira nharaunda ine hutsinye yemotokari.
• Zvekushandisa Zvekushandisa: Pacemaker, defibrillators, uye yekuongorora midziyo yekushandisa Wire-mhando waya Zvisungo zvekupedzisira kuvimbika kwekupedzisira.

Kunyanya, chero kupi microchip inoda kubatanidza kune vekunze, iwe ungangowana kuti mainjiniya ane akashandisa waya kugadzirwa.

Ma Wire Kubatira Kuenzanisa Kuenzanisa neFlip-Chip Kusungwa?

Wire Kubatira ndiyo yakakurumbira kasimusi tekinoroji, asi haisi iyo yega. Imwe huru imwe nzira ndeye Flip-chip kusungwa. MuFlip-chip nzira, chip iri kubhururuka kumusoro, uye zvidiki mutengesi mabumps panzvimbo yayo inoshandiswa kufambira mberi zvakananga kune substrate. Iyi ndiyo nzira dzakasiyana kwazvo kubva uchishandisa waya kugadzira kubatana.

Flip-chip kusungwa Inopa zvimwe zvakakwanisika zvakanakira ini / o density (zvimwe zvinobatana munzvimbo diki) uye nzira pfupi yemagetsi, iyo inovandudza mashandiro ezvekupedzisira zvakanyanya. Nekudaro, maitiro acho ezvinhu akaomarara uye anodhura. Inonetsekana zvakare nematambudziko nemanejimendi ekutonga uye kuongorora.

Wire Kubatira, kune rumwe rutivi, inonyanya kukura, inoshanduka, uye tekinoroji inoshanda. Zviri nyore kuita uye yakakodzera kune yakasarudzika mhando dzekushandisa. Yemidziyo yakawanda, kunyanya mukati vatengi vezvematengi, automotives, uye simba Electronics, Wire Kubatira inopa chiyero chakakwana chekuita, kuvimbika, uye mutengo. Iwo maviri matekinoroji haasi mashoma ega; Iwo maturusi akasiyana ematambudziko akasiyana einjiniya.

Unosarudza sei iyo yakakodzera waya yekubatanidza yekubatanidza?

Kusarudza iyo Kurudyi waya kusungwa zvishandiso chisarudzo chikuru icho chinokanganisa kugona kwechigadzirwa uye chigadzirwa mhando. Sarudzo inoenderana zvachose pane chaiyo application zvido. R & D LAB inogona kuda bhuku rinoshanduka-shanduka rinobatsira, nepo mbozerwe-yakawanda-mbozha mutsetse inoda mashoni akazara otomatiki anokwanisa kumhanya 24/7.

Kana uchiongorora Wire Boging Equipment, funga izvi pfungwa:

• Kubatira Technology: Iwe unoda a Bhora Bland kana Wedge Bhuku muchina? Mamwe michina yepamberi, seyedu WS9820 otomatiki thick aluminium wire wedge bonder, vanonyatsorema pakurema Aluminium Wire, kudiwa kwakajairika muEv uye simba semicononductor Maindasitiri.
• Kuburitsa: Vangani zvisungo pane imwe nguva iyo muchina unogona kuburitsa? Ichi chinhu chakanyanya kutsoropodza chekuverenga kudzoka kwako pakudyara.
• Kururamisa uye kudzokorora: Muchina unofanirwa kukwanisa kuisa zvisungo ne micron-lever-light-nguva mushure menguva.
• Kuchinjika: Muchina unokwanisa here kuti ufe wakasiyana uye saizi saizi? Zviri nyore sei kuchinja kune chigadzirwa chitsva?
• Tsigiro Yekutengesa: Anopa mutengesi anopa nyanzvi yekudzidziswa, rutsigiro rwekushandisa, uye nyore nyore kuwanikwa zvikamu zvevhu senge a Cutter banga reSemiconductor aluminium wire welding Machine Fnk? Muchina wakangonaka chete sekutsigira shure kwayo.

Kusarudza munhu chaiye akakosha sekusarudza muchina wekurudyi kuti Ita shuwa kusarongeka kusungwa mhinduro.

Key Deaaroways

Iyo yakaoma Wire Bond ndiyo gamba risingatauri rinopa hupenyu hwedu hwerarama. Kuti ipfupise kuongorora kwedu tekinoroji iyi yakaoma:

• Core basa: Wire Bonding iri maitiro izvo zvinogadzira zvakakosha Kubatana kwemagetsi pakati pemicrochip uye package yaro, ichigonesa kuita basa.
• Nhamba mbiri huru: Iyo indasitiri inovimba nenzira mbiri dzekutanga: Bhora Bland, iyo inokurumidza uye inoshanduka, uye Wedge Bhuku, iyo yakakodzera kune yakaderera-chimiro uye inorema waya zvikumbiro.
• Key zvinhu: Zvakanyanya zvinowanzoshandiswa zvishandiso zve Kuronga waya Ndarama (kuvimbika kwakakura), mhangura (copper (yakanakisa kufambidzana uye yakaderera mutengo), uye aluminium (yakakodzera kune mashandiro esimba).
• Unhu huri kutaurirana: Kubudirira Wire Bond zvinoenderana neyakajeka kusanganiswa kweakagadziriswa Kuronga paramita, zvinhu zvakanyanyisa, uye michina yakanyatsochengetedzwa.
• Ubiquitous application: Kubva kuCPU mune yako laptop kune iyo magetsi module mumotokari yemagetsi, Wire Bond Tekinoroji chinhu chakakosha chivakwa chazvino Electronics.
• Kusarudza Nouchenjeri: Kusarudza kurudyi Kubatira maitiro, Wire zvinhu, uye zvishandiso chiitiko chinonzwisisika cheinjini chinonyanya kukanganisa chigadzirwa kuita, mutengo, uye kuvimbika.