Ukuntywila okunzulu kwi-wire wire

Molo, ndinguKevin, naseDongxin itekhnoloji, iintsuku zam zichithwe ukuxoxa kwihlabathi le microscopic ngeenjineli ezifana ne-marcus kwi-Autcus yeShishini le-AutoMotic esuka eJapan I-Semiconductor icandelo. Sithetha ngezityholo ezilinganiswe kwimicrons kunye nesayensi ezibonakalayo ezixhasa lonke ilizwe ledijithali. Enye yezona zigxeki kakhulu, kodwa zihlala zityhutyha, izinto kweli lizwe zithobekile i-wire ye-wire. Ezi ntambo zincinci ze ucingo zizinto ezifunekileyo ngaphakathi kuzo zonke ii-microchip, zonke ii-LED, kunye nemodyuli yombane. Ukuqonda okwahlukileyo Iindidi zentambo nokukhetha ilungelo Uhlobo lwe-wire ayisiyosebenzi nje yokufunda; Ibalulekile ekudaleni ukuthembeka, ukusebenza kakhulu i-elektroniki. Eli nqaku leli nqaku lenjineli enomdla kunye nemveliso yemveliso efuna ukujonga nzulu kule teknoloji ibalulekileyo. Siza kuphonononga i Umhlaba wocingo lwe-wire, kwiinkqubo eziphambili kwizixhobo ezenza ukuba zibekho konke.

Yintoni eyona nkqubo imbi ye-wire kwi-semicondcuct ye-semicondcuct?

I-wire bond ibalulekile ubuchule obusetyenziselwa ukwenza Unxibelelwano lombane phakathi kwe I-Semiconductor Die (i-microchip) kunye nokupakishwa kwayo, okanye phakathi kweetshipsi ezininzi. Yicinge njengenyathelo lokugqibela ekwenzeni i-chip. I I-Wire Sire Sport Inkqubo isebenzisa i-tiny, icocekile ucingo Ukwenza amakhonkco, qhagamshela i-microscopic I-Bond pad Kwi-chip ukuya kwizikhokelo ezikhulu zeplaji yephakheji eya kuthi ekugqibeleni iqhagamshele kwibhodi yesekethe. Olu nxibelelaniso lubalulekile ekudluliseleni amandla kunye nedatha ngaphakathi nangaphandle kwe Isixhobo se-semiconductor.

I Inkqubo ibandakanya Sebenzisa umatshini okhethekileyo-a ucingo Isigqeba-esisebenzisa indibaniselwano yobushushu, uxinzelelo, kunye namandla e-ultrasonic ukwenza i-steld eqinileyo-rhulumente oqinileyo kuzo zombini iziphelo ze ucingo. Oku kudala uqhagamshelo olomeleleyo, oluthembekileyo ngaphandle kokunyibilikisa izinto ezibuthathaka. Injongo ye I-Wire Sire Sport Inkqubo Kukudala amawaka onxibelelwano kwisixhobo esinye, umntu ngamnye ogqibeleleyo, ukuqinisekisa ukuba imveliso yokugqibela isebenza ngokungagungqiyo. I-wire i-wire i-wire yinkqubo enzima Kwinkoliso enkulu ye Ukupakishwa kwe-semicondcuct yenziwe namhlanje.

Zeziphi iintlobo eziphambili zendlela yokubonisa?

Ngelixa injongo ihlala ifana-ukwenza uqhagamshelo lombane oqinileyo-zimbini eziphambili eziphambili Iindidi zentambo Iindlela zobuchule ezisetyenziswa kumzi mveliso: Ibhola iBhola kwaye I-Wedge Bond. Ukukhetha phakathi kwabo kuxhomekeke kwi isicelo, izixhobo ezichaphazelekayo, kunye nefom efunekayo.

1. Ibhola iBhola: Le yeyona nto ininzi isetyenzisiwe ngokubanzi I-BOUFISIQOIT, i-accounting ngaphezulu kwe-90% yazo zonke i-wire ye-wire Unxibelelwano. Ikhawuleza kwaye iguqulwe ngakumbi ngokwendlela yokuboleka. Inkqubo iqala ngokunyibilika ukuphela kocingo ukwenza ibhola encinci, emva koko iqhotyoshelwe kwi-chip I-Bond pad.
2. I-Wedge Bond: Le ndlela isebenzisa i-Wedge-imile Isixhobo sokuBonelela ukucinezela ucingo ngokuchasene ne I-Bond pad kwaye yenza i-stitch-njenge iqhina. Ayiyola ibhola. I-Wedge Bond ihlala isetyenziselwa izicelo ezifuna iprofayile esezantsi (ngaphantsi ucingo loop ukuphakama) okanye ukubopha kunye i-aluminium wire, engayisebenzisi ibhola ngokulula njengegolide.

Zombini iindlela zendlela zinendawo yazo kule mihla i-elektroniki ukuvelisa. Ibhola iBhola yindawo yendawo yokuvelisa ivolumu ephezulu, ngelixa I-Wedge Bond sisisombululo esikhethekileyo kwimiceli mingeni ethile, ngakumbi kwizixhobo zamandla kunye nokusetyenziswa kakuhle. Ezi Iindidi ezimbini zocingo Iindlela zokuxhobela zilawula ishishini.

Zeziphi izixhobo eziphambili ezisetyenziswayo kwi-wire bond kwaye ngoba?

Ukukhethwa kwe Izixhobo ze-cire yinto ebaluleke kakhulu inkalo ye-wire wire inkqubo. I Izixhobo ezisetyenziswa kwi-wire boire kufuneka ibe yeyona ibalaseleyo ukuqhubela phambili kombane kunye ne-thermal, yiba unganyangeki ukuba ulahlekelwe, kwaye ubeke ngokwaneleyo ukuba wenze ukuthembeka iqhina. Izinto ezintathu zilawula imbonakalo yomhlaba.

I-wire yegolide ngokubanzi yamkelwe njengonyulo lweprimiyamu kwaye yayiyinto yasekuqaleni isetyenziswe kwi-wire i-wire kwintembeko yayo. Nangona kunjalo, iindleko eziphezulu zegolide ziqhube ishishini ucingo lobhedu, enika intsebenzo ephezulu kwezinye iintlonipho kodwa ilucelomngeni ngakumbi iqhina kuba iyaxhuzula ngokulula. I-aluminium wire kukuhamba nzima ucingo Izicelo zinamandla i-elektroniki. I Ukukhetha ucingo ekugqibeleni ixhomekeke kwi-uqoqosho phakathi kweendleko, ukusebenza, kunye neemfuno ezithile ze Isixhobo se-semiconductor.

Isebenza njani ibhola isebenza njani?

I I-Bloll Bondiquique kukuboniswa okunomdla kwesantya esiphezulu. I I-Wire Sonding Inkqubo ibandakanya Isixhobo se-capillary apho ucingo olucekeceke (Rhoqo I-wire yegolide okanye ucingo lobhedu) yondliwe.

1. Ukuqulunqwa kwebholaInkqubo iqala nge "ye-elektrome-off" (i-EFO) i-wand ethumela i-spark ukuya kwincam ye ucingo, ukuyinyibilikisa kwaye ivumela uxinzelelo lwe-temputer ukwenza indawo egqibeleleyo, okanye ibhola. Le bhola iqhelekileyo i-1.5 ukuya kwi-2,5 amaxesha Ububanzi beWire.
2. I-Bondy yokuqala: Isixhobo se-capillary sizisa ibhola iye ezantsi kwishushu I-Bond pad ye I-Semiconductor ufe. Umatshini usebenza ukudityaniswa kwamandla kunye namandla e-ultrasonic, ebangela ibhola ibe yingozi kwaye wenze i-intertictic eyomeleleyo, i-intermetallic iqhina kunye nepali. Oku kuhlala kubizwa ngokuba yi-thermosonic iqhina.
3. Ukuqulunqwa kwe-LOP: Umatshini emva koko ushukuma kwi-yesibini iqhina Indawo ekwiphakheji yephakheji yephakheji, ibuyile ucingo kwicandelo elithile ucingo loop Ijometri njengoko ihamba.
4. I-Bond Bond (i-stitch ye-stit): Kwindawo yesibini, umatshini wenza isitayile iqhina. Icinezela i ucingo Ngokuchasene nesakhelo esikhokelayo ngomda wesixhobo se-capillary kwaye sisebenzisa amandla e-ultrasonic, ukudala enye id.
5. Umsila wocingo: Okokugqibela, umatshini uxhwila i ucingo kwaye iphakamisa i-capillary, yaphula i ucingo Kwisithende esithendeni iqhina kwaye uyishiya ilungele ukwenza ibhola elandelayo.

Lo mjikelo wonke wenzeka kwi-milliseconds, ivumela oomatshini bokwenza ucingo Ukwenza amakhulu onxibelelwano ngomzuzwana. Yinkqubo esebenzayo kakhulu iqhele ukusetyenziswa kwi-elektroniki yabathengi.

Yintoni ebangela ukuba uphumelele ubuchule obukhethekileyo bobango?

I-Wedge Bond ngokwahlukileyo indlela yokundedwa esebenza ngokwahlukileyo kwi Ibhola iBhola. Njengoko igama libonisa, isebenzisa i-Wedge-imile Isixhobo sokuBonelela endaweni ye-capillary. I ucingo yondliwe phantsi komphambili womtshato. I I-Bound ibandakanya Ukucinezela i ucingo iflethi ngokuchasene ne I-Bond pad kunye nokusebenzisa amandla e-ultrasonic ukwenza i-weld.

Ngokungafaniyo Ibhola iBhola, eyokuqala iqhina sisitayile iqhina, hayi ibhola iqhina. Emva kweyokuqala iqhina yenziwa, umatshini ushukume ukuya kwesibini iqhina Indawo kwaye yenza enye isikhuselo iqhina. Umahluko ophambili kukuba I-Wedge Bond yinkqubo yokungacacanga; Umatshini kufuneka uhambise ngokuhambelana ne ucingo Yondla, usenza incinci kancinci ukuba iguqulwe kunokuba Ibhola iBhola.

Nangona kunjalo, I-Wedge Bond inika izibonelelo ezibalulekileyo. Ivelisa iprofayile engaphantsi kakhulu ucingo Unxibelelwano, olubaluleke kakhulu kwiitshipsi ezithe nkqo okanye izixhobo ezineemfuno zokucaciswa ngokuqinileyo. Ikwayindlela ekhethiweyo ye I-Aluminium Wire Bond, ngakumbi ububanzi bezinto ezinkulu ucingo isetyenziswa kwizixhobo zamandla. Inkqubo inokwenziwa kubushushu begumbi (i-Ultrasonic Bill ngaphandle kobushushu ongezelelweyo), nto leyo ibalulekile kwizixhobo ezinobuthathaka kubushushu.

Kutheni le nto ukukhetha i-wire wire igxeka umgangatho?

I I-wire wire ayisiyiqhubi nje ngokulula; Licandelo elinikiweyo kakhulu elinefuthe ngokuthe ngqo intsebenzo kunye nokuthembeka kwesixhobo se-elektroniki sokugqibela. I Ukukhetha i-Wire Stower kwaye umgangatho wayo ubaluleke kakhulu. A I-wire yomgangatho ophezulu kufuneka ube neempawu eziphambili zokuqinisekisa I-wire ethembekileyo nephezulu yomzimba.

Okokuqala, i ucingo kufuneka ube nobunyulu obukhethekileyo. Ukungcola kunokukhokelela ekungangqinelaniyo iqhina Ukuqulunqwa kwaye kunokuba ngumthombo wemicimbi yexesha elide yokuthembeka. Okwesibini, ucingo Kufuneka ube nepropathi engaguqukiyo, kubandakanya amandla e-thensung kunye ne-Elongwation. Oku kuqinisekisa ukuba ucingo ayiphumi ngexesha lesantya esiphezulu I-Hander Inkqubo kwaye ukuba imeko ye-loop iphinda iphindwe ngalo lonke ixesha. I Ububanzi beWire kufuneka ilawulwe ngaphandle kokuqina okuqinisekileyo.

EDongxin, xa sibonelela I-wire ecocekileyo ye-aluminium kubathengi bethu, sibonelela ngokufuntshisiweyo kwezinto ezibonakalayo. Iinjineli njengeMarcus zixhomekeka kule datha kuba bayazi ukuba kuphambuka kancinci kwi ucingo inokuvala umgca we-dolai I ucingo Ngokwenene isiseko sento elungileyo i-wire ye-wire.

Zeziphi izinto eziphambili eziphembelela ucingo olunomgangatho?

Ukufezekisa okugqibeleleyo i-wire ye-wire Ngalo lonke ixesha, izigidi zamaxesha ngaphezulu, yeyona njongo iphambili. I Umgangatho wokuBonakaza Kuxhomekeka kwi-tuning ehleliweyo yezinto ezininzi. Injineli yenkqubo kufuneka ilawule ngokulandelelana le "Recope" ukufumana iziphumo ezingaguqukiyo.

Izinto eziphambili zibangela ukuphazamisa Umgangatho wokuSebenza Faka:

• I-rameter ye-rameters: Le yiseti yemiyalelo yomatshini, kubandakanya amandla asetyenziswayo, isixa samandla e-ultrasonic, ubushushu balo bafe, kunye nexesha le iqhina. Ezi I-rameter ye-rameters kufuneka yenziwe ikhethekileyo ucingo kunye nezixhobo ezinzulu.
• Umgangatho wezinto ezibonakalayo: Oku kubandakanya zombini I-wire wire kwaye i I-Bond pad iindawo eziphezulu. I ucingo Kufuneka ube ngococeko oluphezulu kunye nemilinganiselo engaguqukiyo, kwaye iipads kufuneka zicoceke kwaye zikhululekile kwii-oxidas okanye ungcoliseko.
• Imeko yokuBopha: I Isixhobo sokuBonelela . Isixhobo esinxilisayo okanye esingcolileyo sinokukhokelela kwihlwempu iqhina Umgangatho okanye ukonakala kwabafa. Sibenza izixhobo ezichanekileyo njengawethu Isixhobo se-Wedge esiSebenzayo se-Aluminium Wire Wel Ukuqinisekisa ukuba i-longevity kunye nokungqinelana.
• Ulungelelwaniso lomatshini: I Izixhobo ezibonisa izixhobo Kufuneka ulungelelaniswe ngokuchanekileyo ukuqinisekisa ukuba ihambisa amandla afanelekileyo kunye nokuhamba.

Ukusebenzisana kwezi zinto kubalulekile Yenza i-wio wire wire fire kwaye ufezekise esona sivuno siphezulu kunye nokuthembeka.

Zeziphi ezona zicelo ziqhelekileyo zocingo lwentambo namhlanje?

Ngelixa iingcambu zayo zikwi I-Semiconductor ishishini, i Izicelo zocingo lwentambo yandise kakhulu. I-wire bonds ikwindawo enkulu isetyenziselwe yonke imbonakalo ye i-elektroniki ukuvelisa. Ungafumana a i-wire ye-wire Phantse nasiphi na isixhobo se-elektroniki onayo.

Iqhosha elithile Izicelo zocingo zibandakanyeka:

• Iisekethe ezihlanganisiweyo (i-IC): Le yiklasi isicelo, ukudibanisa isilicon kufa kwiphakheji kukhokelela kwi-CPU, i-chips yememori, kunye phantse zonke ezinye ii-microchips.
• Izixhobo zamandla: I-Igbts, Mosfets, kunye namanye amaNxweme se-semicondondlars axhomekeke kakhulu I-Aluminium Wire Bond ukuphatha imijelo ephezulu.
• I-LEDS: Incinci I-wire yegolide isetyenziselwa ukudibanisa i-chip ye-LED kubafowunelwa bayo, ukulawula yonke into kwiscreen sefowuni kwi-Stadium.
• I-automatic yemoto: Iiyunithi zolawulo zenjini, ezenziweyo, kunye neenkqubo zolwazi zonke zixhomekeke kwi-Irmler i-wire ye-wire Unxibelelwano lokumelana nendawo enobungozi.
• Izixhobo zonyango: I-PACCEABESS, i-Deabrillators, kunye nokuSebenzisa izixhobo zokuFuya I-wire yomgangatho ophezulu I-Bonds yokuthembeka kokugqibela.

Ngokuyintloko, naphi na i-microchip kufuneka inxibelelane nehlabathi elingaphandle, uya kufumanisa ukuba iinjineli zinayo isetyenziselwe i-wire wire.

I-wire ibuthelekiswa njani kwiFlip-Chip?

I-wire bond Itekhnoloji yonxibelelwano ebalaseleyo, kodwa ayisiyiyo kuphela. Eyona ndlela iphambili kuyo I-Flip-chip iBonda. Kwindlela ye-chip-chip ye-chip-chip, i-chip ihamba phantsi, kwaye i-thedning encinci yomthengisi kumphezulu wayo isetyenziselwa Bondsing ngqo kwi-subtate. Le yindlela eyahlukileyo evela Sebenzisa ucingo ukwenza uqhagamshelo.

I-Flip-chip iBonda Inika ezinye izibonelelo ezibalulekileyo, ikakhulu iphezulu kakhulu i / oxinano (unxibelelwano olungaphezulu kwindawo encinci) kunye neendlela ezimfutshane zombane, eziphucula intsebenzo kwizicelo ezinde kakhulu. Nangona kunjalo, inkqubo inzima kakhulu kwaye iyabiza. Ikwabonelela ngemiceli mngeni nolawulo lobushushu kunye nokuhlolwa.

I-wire bondKwelinye icala, ukuqola, ukutshintsha, kunye netekhnoloji enexabiso. Kulula ukuyisebenzisa kwaye ilungele uluhlu olubanzi lwezicelo. Kwiindawo ezininzi, ngakumbi ngaphakathi I-elektroniki yabathengi, izithuthi, kunye namandla i-elektroniki, I-wire bond Inika ibhalansi efanelekileyo yokusebenza, ukuthembeka kunye neendleko. Iitekhnoloji ezimbini azikhethi cala; Zizixhobo ezahlukeneyo kwimiceli mingeni yobunjineli.

Ukhetha njani izixhobo ezifanelekileyo zocingo?

Ukukhetha i ucingo lwasekunene luxhotyiwe Izixhobo zesona sigqibo siphambili esichaphazela ukusebenza ngempumelelo kunye nomgangatho wemveliso. Ukukhetha kuxhomekeke ngokupheleleyo kwiimfuno ezithile zesicelo. I-R & D I-LAB inokufuna i-bonite yencwadi eguqukayo, ngelixa umgca weqela eliphezulu ufuna umatshini ozenzekelayo onokuphumelela kwi-24/7.

Xa uphononongwa Izixhobo ezibonisa izixhobo, cinga la manqaku:

• Itekhnoloji ye-Bondile: Ngaba ufuna Ibhola iBhola okanye I-Wedge Bond umatshini? Abanye oomatshini abaphambili, njengawethu I-WS9820 I-ALMUMUM YOKUGQIBELA I-ALMUMUM WONI, zikhethekile ukuba zinzima i-aluminium wire, isidingo esiqhelekileyo kwi-Ev namandla I-Semiconductor amashishini.
• Igalelo: Zingaphi iibhanti ngeyure? Le yinto ebalulekileyo yokubala imbuyekezo yakho kutyalo-mali.
• Ukuchaneka kunye nokuphindaphinda: Umatshini kufuneka ukwazi ukubeka i-Bonds ngenqanaba lokuchaneka komgangatho, ixesha emva kwexesha.
• Bhetyebhetye: Ngaba umatshini unokuphatha ubungakanani obahlukileyo kunye nobukhulu? Kulula kangakanani ukutshintsha kwimveliso entsha?
• Inkxaso yomthengi: Ngaba umthengisi wenza uqeqesho lobuchwephesha, inkxaso yesicelo, kwaye ifumaneke ngokulula iinxalenye ezifana ne Ukusika isitshetshe se-Imiconductor Alumnum Wire Welnking Fnk? Umatshini ulunge kuphela njengenkxaso emva kwayo.

Ukukhetha iqabane elifanelekileyo kubaluleke njengokukhetha umatshini olungileyo Qinisekisa ukuba i-bonding engaguqukiyo iziphumo.

Iqhosha lezitshixo

Intsusa i-wire ye-wire liqhawe elingangcungce igunyazisa ubomi bethu bedijithali. Ukushwankathela ukuhlolwa kwethu kwale tekhnoloji ebalulekileyo:

• Umsebenzi ophambili: I-wire wire yinkqubo oko kudala into eyimfuneko Unxibelelwano lombane Phakathi kwe-microchip kunye nephakheji yayo, eyenza ukuba isebenze.
• Iindlela ezimbini eziphambili: Ishishini lixhomekeke ngeendlela ezimbini eziphambili: Ibhola iBhola, okukhawulezayo kwaye eguqukayo, kwaye I-Wedge Bond, elungele iprofayile ephantsi kwaye inzima ucingo izicelo.
• Izinto eziphambili: Okuninzi isetyenziswa rhoqo izixhobo ze I-wire wire Ngaba igolide (ukuthembeka okuphezulu), ubhedu (ukuqhutywa ngokugqwesileyo kunye neendleko eziphantsi), kunye ne-aluminium (efanelekileyo (elungele izixhobo zamandla).
• Umgangatho yiParamount: Impumelelo i-wire ye-wire Kuxhomekeka kwindibaniselwano yechanekileyo I-rameter ye-rameters, Izinto ezicocekileyo ezicocekileyo, izixhobo ezigcinwe kakuhle.
• Isicelo soMgaqo-nkqubo: Ukusuka kwi-CPU kwi-laptop yakho kwiimodyuli zamandla kwimoto yombane, i-wire ye-wire Itekhnoloji sisiseko sebhloko esisiseko sale mihla i-elektroniki.
• Ukukhetha ngobulumko: Ukukhetha ilungelo I-BOUFISIQOIT, Izixhobo ze-cire, kwaye izixhobo sisigqibo esibalulekileyo sobunjineli esichaphazela ngokuthe ngqo ukusebenza kwemveliso, iindleko, kunye nokuthembeka.