
https://dgdx-elec.com/wp-content/uploads/2022/07/Die-pressing-equipment-solder-head.mp4 Specifications A (-0.01) (mm) B (¡À0. 01) Die isi 2 3 Die isi 6 7 ¡ï A na-eji ígwè pụrụ iche mee ngwaahịa ahụ. ?¡ï Ịmepụta na imenyụ ọtụtụ oge iji gbatịa ndụ ¡ï Ahaziri nha na-abụghị ọkọlọtọ ...

| Nkọwapụta | A (-0.01) (mm) | B(¡À0. 01) |
| Nwuo isi | 2 | 3 |
| Nwuo isi | 6 | 7 |
| ¡ï A na-eji ígwè pụrụ iche mee ngwaahịa ahụ. | ||
| ?¡ï Ịkwụsị na imenyụ ọtụtụ oge iji mee ka ndụ dịkwuo ogologo | ¡ï ahaziri nha na-abụghị ọkọlọtọ | |
Nọmba ngwaahịa: DXGJ-22001
Aha ngwaahịa: Die Bonder anwụ Isi
Akara: China DOXO
Oke nnabata: + -0.002
Akụrụngwa dị mkpa: ASM KS anwụ bonder
Nhazi nhazi: nhazi dị ka eserese
Ọrụ: Semiconductor nkwakọ ngwaahịa ebu
Ihe: M2 Tungsten Carbide
Oke ngwa: akpakanamde eletrọnịkị IGBT triode diode
Uru ngwaahịa: elu ike, elu egweri, ogologo ndụ, mma ngwaahịa mmepụta, mkpuchi usoro
