Mold upfa umutwe kugirango upfe Bonder Asm & KS ikoreshwa kuri elegitoroniki yimodoka na IgBT

Https://dgdx-elec.com/wp-uwakorerwa/uplet/2022/OIE_Icyitegererezo. 01 à0 ? À

Tanga icyifuzo

Ibisobanuro

marike

Ibisobanuro	A (-0.01) (mm)	B (À0. 01)
Gupfa umutwe	2	3
Gupfa umutwe	6	7
¡
? ¡Ïrunda no kumara inshuro nyinshi mubuzima	¡AïcustomizeTodized idasanzwe

Ibicuruzwa No .: DXGJ-22001

Izina ry'ibicuruzwa: Gupfa Bonder apfa umutwe
Ikirango: Ubushinwa Doxo
Intera yo kwihanganira: -0.002
Ibikoresho bikurikizwa: ASM KS ipfa Bonder
Gutunganya ibicuruzwa: gutunganya ukurikije ibishushanyo
Imikorere: Semiconductor yapakiye mold
Ibikoresho: M2 Tungsten Carbide
Umwanya wa Porogaramu: Automotive Electronics IgBt Triode Diode
Ibyiza byibicuruzwa: Gukomera kwinshi, gusya cyane, kuramba, kuzamura ibicuruzwa umusaruro, gutunganya

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