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Manufacturer directly precision part positioning block for semiconductor packaging mold

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Home - K&S FNK OE360 wire bonding parts - MGP mold parts - Manufacturer directly precision part positioning block for semiconductor packaging mold

Products

  • K&S FNK OE360 wire bonding part 
    • Bonding cutters
    • Bonding wedge
    • Die bonding equipment parts
    • MGP mold parts
    • Wire Guides
  • Metallized film capacitor automatic winding machine parts
  • Lithium battery winder equipment consumables
  • Thick aluminum wire products
  • Aluminum wire binding machinery
  • Metallized film capacitor winding machine
Wire bonding wedge tool and ultrasonic aluminum wire bonding machine introduce the parameters used

Wire bonding wedge tool and ultrasonic aluminum wire bonding machine introduce the parameters used

Wire bonding wedge, mandrel of metallized film winding machine, paper

Wire bonding wedge, mandrel of metallized film winding machine, paper

Leading the Future of Energy and Manufacturing Innovation: The Excellent Choice of Tesla-Related Machinery

Leading the Future of Energy and Manufacturing Innovation: The Excellent Choice of Tesla-Related Machinery


  • Long life bonding machine consumables thick aluminium wire bonding wedge

    Long life bonding machine consumables thick aluminium wire bonding wedge

  • High end quality long life bonding machine consumables copper wire bonding wedge

    High end quality long life bonding machine consumables copper wire bonding wedge

  • Cutter Blade for aluminium wire bonding machine using Japanese tungsten carbide steel

    Cutter Blade for aluminium wire bonding machine using Japanese tungsten carbide steel

  • Custom mandrel holder for capacitor or battery winding machine

    Custom mandrel holder for capacitor or battery winding machine

  • Nice quality SKD 11 mold parts thimble cutter made in China

    Nice quality SKD 11 mold parts thimble cutter made in China

  • Different size precision parts of semiconductor packing

    Different size precision parts of semiconductor packing

  • High voltage capacitor winding machine

    High voltage capacitor winding machine

  • Winding shaft for capacitor winding equipment device

    Winding shaft for capacitor winding equipment device

  • Top precision cutter for aluminium strip bonding machine for electric components packaging

    Top precision cutter for aluminium strip bonding machine for electric components packaging

  • Cutter knife for semiconductor aluminium wire welding machine FNK

    Cutter knife for semiconductor aluminium wire welding machine FNK

  • Capacitor metallization winding machine pressure wheel

    Capacitor metallization winding machine pressure wheel

  • Non standard precision for semiconductor assembly packaging

    Non standard precision for semiconductor assembly packaging

  • Chip Expansion Machine

    Chip Expansion Machine

  • Manual binding machine for battery pack

    Manual binding machine for battery pack

  • Dongguan manufacturer heavy aluminum or copper wire bonding cutter blade for semiconductor products packaging

    Dongguan manufacturer heavy aluminum or copper wire bonding cutter blade for semiconductor products packaging

  • 720 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (N Series)

    720 plastic wire guide spare parts for semiconductor aluminium wire bonding equipment (N Series)

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Manufacturer directly precision part positioning block for semiconductor packaging mold

https://dgdx-elec.com/wp-content/uploads/2023/01/s-1.mp4 Specifications A(¡À0. 001) B(¡À0. 001) C(¡À0. 001) MGP mold barrel injection head 7/8/9 12 12 MGP mold barrel injection head 10/11 12 12   Product No.:DXMJ-22002 Product name: positioning block Brand: China DOXO Toleranc...

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Description

marker

https://dgdx-elec.com/wp-content/uploads/2023/01/s-1.mp4

Specifications A(¡À0. 001) B(¡À0. 001) C(¡À0. 001)
MGP mold barrel injection head 7/8/9 12 12
MGP mold barrel injection head 10/11 12 12

 

Product No.:DXMJ-22002

Product name: positioning block
Brand: China DOXO
Tolerance range: +-0.002
Processing customization: processing according to drawings
Function: Semiconductor packaging mold
Material: M2 Tungsten Carbide
Scope of application: automotive electronics IGBT triode diode
Product advantages: high hardness, high grinding, long life, improve product yield, 200,000 mold times

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    Working Hours

    Monday – Friday

    08:00-24:00

    Saturday

    09:00-23:00

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    CONTACT INFORMATION

    • 

      Company number:

      +86 18819519536

    • 

      E-mail:

      terry@dgdx-electronic.com

    • 

      Company address:

      No. 13, Lane 5, Nanmen Street, Shabu Industrial Zone, Dalang Town, Dongguan City, Guangdong Province

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