https://dgdx-elec.com/wp-content/uploads/2022/07/Die-pressing-equipment-solder-head.mp4 Specifications A(-0.01) (mm) B(¡À0. 01) Die head 2 3 Die head 6 7 ¡ïThe product is made of special steel. ?¡ïForging and quenching for many times to prolong life ¡ïCustomized non-standard size ...
Specifications | A(-0.01)
(mm) |
B(¡À0. 01) |
Die head | 2 | 3 |
Die head | 6 | 7 |
¡ïThe product is made of special steel. | ||
?¡ïForging and quenching for many times to prolong life | ¡ïCustomized non-standard size |
Product No.: DXGJ-22001
Product Name: Die Bonder Die Head
Brand: China DOXO
Tolerance range: +-0.002
Applicable equipment: ASM KS die bonder
Processing customization: processing according to drawings
Function: Semiconductor packaging mold
Material: M2 Tungsten Carbide
Scope of application: automotive electronics IGBT triode diode
Product advantages: high hardness, high grinding, long life, improving product yield, coating process