Ithuluzi le-Wire Bonding Wedge ne-Ultrasonic Aluminium Wire Bonding Machine Yethula amapharamitha asetshenzisiwe

2025-07-07

Ikhanda le-Dual Bond: Ukukhiqiza okuphezulu
I-Linear Guided Z Bond Head: Amandla e-Bond athembekile futhi aphindaphindwayo
Ukuzwakala kwesivinini okuphezulu okuphezulu
I-Voice-Coil Wire Clamp: Ukuphakelwa kwentambo efanele ngesikhathi sokujikeleza kwe-Bonding
Ukulawulwa Kokubuyiselwa Kwe-Loop Bond Force: Ukulawulwa kwe-Coil-Coil Real Time Force Force

Isetshenziswa esondweni lamadivayisi we-semiconductor, njenge-252, kuya ku-252, to263, to247, to2p47, njll. Imikhiqizo ebanzi enjenge-polar rubes.

Ihlome umhloli wokudonsa we-wire ongayikhetha, ukuhlolwa okungelonakalisi okuku-inthanethi kungenziwa ukuqinisekisa ikhwalithi yokubopha.

Uhlelo lokubona olusebenzayo nolunembile

Ohlelweni lokuthwebula lwe-Fly Vision Capture: Yehlisa umphumela wokudlidliza ngomshini ngekhwalithi yesithombe.

Ikati le-ether - uhlelo lokulawula isikhathi sangempela

I-ethercat elawulwa iBonder Bonder inikezela nge-real-time form Force kanye ne-Bond Power Repecture control control control hort to bonding high bonding.Machines Networking kungenziwa kalula ukusekela ukuqapha kwemishini, ukubuyekeza okukude kwesoftware.