2025-07-07
It is used in the bonding of semiconductor devices, such as TO-252, TO263, TO247，TO-3p IGBT,etc.packages.It is also widely used to bond high and medium Power Transistor, Thyristor,FET, High Current Fast Recovery Diode, Schottky. Multi-row products such as Polar Tubes.
Equipped with the optional wire pull tester, non-destructive online pull test can be done to ensure bonding quality.
On the fly Vision Capture System：Reduce Machine Vibration Effect on Image Quality.
An EtherCAT controlled bonder provides real-time bond force and bond power feedback control lead to high quality bonding.Machines networking can be done easily to support equipment monitoring,remote set up and software update.
